JPS60106192A - Method of soldering printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is directed to a half-day-one visit method for printed circuit boards;
Printed circuit board Fil with high mounting density, especially equipped with chip-shaped electronic components such as resistors and capacitors that do not have lead wires.
The present invention relates to a soldering method in which the terminals of these chip-shaped electronic components are soldered to the conductor portions of printed circuit boards.

Configuration of conventional example and its problems Conventional soldering device for chip-shaped electronic componentsFiAs shown in Fig. 1, the specific configuration is shown in Figure 1. a first nozzle;
Soldering was performed using a jet-type soldering device that soldered by passing through a second nozzle in order.

1 to 3 are explanatory diagrams for explaining such a conventional soldering method, FIG. 1 is a schematic diagram for explaining the soldering method of a conventional jet soldering device, and FIG. 2 is a 4-tube-shaped electronic component. FIG. 3 is a side view of the main part of the printed circuit board showing a defective soldering state after soldering is completed by a conventional jet soldering device.

In the figure, 1 is a chip-shaped electronic component, with electrodes 21.2 on both ends.
b is provided. 3 is a printed circuit board, and 4 is a conductor pattern formed in the shape of a printed circuit board. 5 is an adhesive for temporarily fixing the chip-shaped electronic component onto the printed circuit board 4 before soldering. Usually, the chip-shaped electronic component 1 is temporarily fixed to the printed circuit board 3 with an adhesive 5 applied between the conductor patterns 4 before soldering. 6 is a conventional jet-type soldering device for chip-shaped electronic components; 7 is a half-1 g18.
9 is a solder flow, and 10 is a solder fillet.

Now, the solder 7 is transferred to the first nozzle 11 by a solder flow generating means (not shown) provided in the jet soldering device 6.
The second nozzle moves in the direction of the arrow B and generates solder flows 8 and 9. Therefore, if the printed circuit board SaC moves in the direction of the arrow while contacting the upper surface of the solder flows 8 and 9, the second nozzle moves in the direction of the arrow B and generates solder flows 8 and 9. The electronic component 1 and the conductive pattern 4 can be soldered together.

However, with the above configuration, the electronic equipment is small and
Due to weight reduction, the mounting density of printed circuit boards mounted with chip-shaped electronic components increases, and the solder spacing between chip-shaped electronic components becomes narrower. If the gap between the chip-shaped electronic components is narrow because the gas generated in the process is not removed sufficiently, failures will occur in which the chip electrodes will not be soldered.

This has resulted in restrictions on component mounting, making it difficult to reduce the size and weight of electronic devices through high-density mounting.

This defect had to be corrected manually, but at this time, there was a problem in that the chip components were damaged due to localized heating by the soldering iron used for correction.

Purpose of the Invention The present invention solves the above-mentioned conventional drawbacks, and provides a method for quickly escaping gas generated from soldering flux when soldering to a high-density mounted chip-shaped electronic component mounting board. The present invention provides a soldering method with a simple structure, which allows chip-shaped electronic components to be soldered well to a printed circuit board.

Structure of the Invention The printed circuit board soldering method of the present invention includes two independent nozzles for jetting molten solder to form an overflow part in a semi-IJJ 4'l"i which stores the molten solder, and a printed circuit board. In the printed circuit board soldering apparatus for soldering by passing through the first and second overflow parts, vibration is applied to the printed circuit board when passing through the first overflow part. This feature allows for good soldering to high-density chip mounting boards.

DESCRIPTION OF THE EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 4 to 6. 4 and 6 are explanatory diagrams of the soldering apparatus according to the present invention, with FIG. 4 being a longitudinal sectional view thereof, and FIG. 5 being a lateral sectional view thereof. Figure 6 is a front view of the main parts of the printed circuit board soldered using the same soldering device.The same parts as in Figures 1 to 3 are marked with the same arrows. 7 is a solder tank 6 that stores molten solder, and 6 is a solder tank 6 that stores molten solder 1. In the solder tank 6, there is a hot flow part that swells up from the solder tank 6 by spouting molten solder 1 to the upper surface. solder ejection nozzles 11 and 12 for forming the printed circuit board, a conveying claw 19 for holding the printed circuit board, a vibrating device 18 for applying vibration sound, and rollers 13a and 13b for transmitting vibration.

A rod 16 is provided.

The operation of the printed circuit board soldering apparatus constructed as described above (14) will be described below.

Solder waves 8°9 are generated from the nozzles 11 and 12 in the solder bath 6, and the printed circuit board 3 on which chip-shaped electronic components are mounted is generated.
moves in the direction of arrow C in the figure.

On the other hand, above the solder wave 8 ejected from the nozzle 11, an eccentric cam plate 14 is constantly pushed upward by a spring 17 attached to a rotating heel fixing plate 16.
The vibration adding device 1 performs reciprocating motion via the roller 13b.
8 is provided.

The downward movement of the rod 16 is transmitted to the printed circuit board 3 by the collar 13a in contact with the upper surface of the printed circuit board 3, and the printed circuit board 3 held by the printed circuit board conveyance claw 19 vibrates up and down.

When soldering the printed circuit board 3 to which such vibrations are applied, the gas generated from the soldering flux can quickly escape, making it difficult for solder waves to get into the narrow spaces between chi-knob-shaped parts. As a result, as shown in FIG. 6, the solder waves 8 also infiltrate between the chip-like components 20 and 210 that are mounted on the printed circuit board 3 and have narrow intervals between them, and the solder waves 8 infiltrate between the respective electrodes 22. Half 1[1 is also attached to .23, forming solder overlay 924.25. The immersion depth of the printed circuit board 3 and the solder wave A during this soldering is set to 1 to improve the gas removal effect of the soldering flux and to prevent solder fog caused by thermal deformation of the printed circuit board 3 due to heating. /2t Also, when the vibration frequency at this time is 150 cycles or more, good results can be obtained compared to the half-IJiJ attachment.

Further, as shown in FIGS. 7 and 8, vibrations can be transmitted to the printed circuit board 3 by soldering in a similar manner by using a vibration applying device 18 applied from the side surface of the printed circuit board 3. That is, when the printed circuit board 3 contacts the solder wave 8 in the direction of the arrow C at an immersion depth of /2 below the board thickness and passes through it, the rotation of the eccentric cam 14 is caused to be attached to the fixed plate 16 via the roller 13bi. Due to the action of the attached spring 17,
The rod 39 has an amplitude of 0.3 to 2. □ffJ is preferably 0
．． 5 to 0.8 m shoulders, vibration frequency 100 to 2,000 times, preferably 260 to 550 times, and the movement supports the printed circuit board 3.
The force is transmitted from the plate 26 to the printed circuit board 3 via the plate 26 and vibrates the printed circuit board 3 from the side at right angles to the conveying direction. In this way, the same soldering result 4 as shown in the embodiments of FIGS. 4 and 5 can be obtained.

Further, in this embodiment, the eccentric cam is fully utilized to apply vibration to the printed circuit board, but vibration may be applied by other methods such as an ampli?er. Furthermore, in a device that holds a printed circuit board on a pallet or the like for soldering, even if the pallet is vibrated, the same effect can be obtained because the printed circuit board vibrates as a result.

Effects of the Invention As described above, according to the present invention, by vibrating the printed circuit board, especially at the solder overflow area, the gas generated by thermal decomposition of the soldering flux can be quickly removed. Therefore, it is possible to perform good soldering without mistakes when soldering printed circuit boards that have chi-knob-shaped electronic components mounted at high density, which greatly reduces the number of man-hours required for soldering corrections. , damage to chi-knob-shaped electronic components due to modification work is eliminated, and li[
It can support miniaturization of slave devices and has great practical effects.

[Brief explanation of drawings]

Figure 1 is a schematic diagram of a conventional jet soldering device, Figure 2 is a perspective view of the main parts of a printed circuit board on which chip-shaped electronic components are mounted, and Figure 3 is a conventional FIG. 4 is a side view of the main parts of a printed circuit board showing a soldering failure state after soldering is completed by the jet soldering device; FIG. 4 is a side view of the main parts of the soldering device according to an embodiment of the invention; FIG. 6 is a front view of the main parts of the same, FIG. 6 is a printed circuit board main part Tτl (4III side view) soldered by the same apparatus, FIG. 7 is a plan view of the main parts of the soldering apparatus in another embodiment of the invention, Figure 8 is a map of the main cities of the same device.
! II>'Mountain degree quick turn-1,'1.3...Printed circuit board, 6...Solder tank, 7...Melted solder, 8,9°゛° °゛Solder wave, 11.12°゛°°
°Nozzle, 14...Eccentric cam plate, 18...
... Vibration adding device, 19... Conveyance claw. Name of agent: Patent attorney Toshio Nakao and 1 other person
5 Figure 1 Figure 1 Figure 8/9

Claims (1)

[Claims] In the solder tank that stores the molten solder and in the solder tank, the molten solder is spouted from two independent nozzles to the upper surface to form an overflow part rising from the solder tank, and the overflow part is In the flow set soldering method, in which the terminals of chip-shaped electronic components and the printed circuit board are soldered by moving the printed circuit board to be soldered while touching the top surface, the printed circuit board is soldered at a rate of 0.5 to 3 m/mi.
A printed circuit board soldering method in which the printed circuit board is moved at a feed speed of n and vibration is applied to the printed circuit board when the printed circuit board passes through an overflow portion where molten solder is spouted from the first nozzle.