JPS58182896A - Device for soldering printed circuit board - Google Patents
Device for soldering printed circuit boardInfo
- Publication number
- JPS58182896A JPS58182896A JP6697682A JP6697682A JPS58182896A JP S58182896 A JPS58182896 A JP S58182896A JP 6697682 A JP6697682 A JP 6697682A JP 6697682 A JP6697682 A JP 6697682A JP S58182896 A JPS58182896 A JP S58182896A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- molten solder
- support
- support stand
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明１；Ｊ： ＩＪ−ド線を持たない電子回路部品を
印刷配線基板にはんだ伺けする装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention 1; J: relates to an apparatus for soldering electronic circuit components without IJ-wires to a printed wiring board.
近時、リード線の無いコンデンサ、抵抗、半導体等の電
子回路部品、所謂リードレス電子回路部品を用いて印刷
配線基板上に電１回路の構成が行なイつれている。2. Description of the Related Art Recently, electric circuits have been constructed on printed wiring boards using electronic circuit components such as capacitors, resistors, and semiconductors without lead wires, so-called leadless electronic circuit components.
第３図に示す如く］−記リードレス電子回路部品（８）
は従来のリード線の代りに両端部に電極部＋８１） （
８］）を有しており、該電極部（８１）と印刷配線基板
（７）の導電体層（７１）とがはんだ（Ｉｌａ）によっ
て電気的に導通される。As shown in Fig. 3] -Leadless electronic circuit component (8)
has electrode parts at both ends instead of the conventional lead wire +81) (
8]), and the electrode portion (81) and the conductor layer (71) of the printed wiring board (7) are electrically connected by solder (Ila).
ところが、１−記はん、だ付けを公知の浸漬法や噴流法
で行なえばはんだ付けの信頼性に問題があることが判っ
た。However, it has been found that there is a problem in the reliability of soldering when the soldering described in 1-1 is performed using the well-known dipping method or jet method.
即ち、浸漬法は第４図に示す如く印刷配線基板（７）に
リードレス電子回路部品（８）を接着剤で仮付けし、こ
れを溶融はんだ槽（１）に漬けるのであるが、浸漬の際
に第５図に示す如く溶融はんだ（１１）が矢印囚の様に
回路部品（８）の両側へ流れ込む際、回路部品（８）の
両端の電極部＋８］） （８１＋が流れの死角となって
渦が発生し、この時空気が一緒に巻き込まれる。That is, in the immersion method, as shown in Figure 4, leadless electronic circuit components (8) are temporarily attached to a printed wiring board (7) with adhesive, and then immersed in a molten solder bath (1). In this case, as shown in Fig. 5, when the molten solder (11) flows to both sides of the circuit component (8) as shown by the arrows, the electrode parts at both ends of the circuit component (8) +8]) (81+ are the blind spots of the flow). This creates a vortex, and at this time air is drawn in together.
更に印刷配線基板（７）やリードレス電子回路部品（８
）に耐着したフラックスの一部が高温に晒されてガス化
し、これらの空気やガスによる気泡（９）が電子回路部
品（８）の両側に滞溜する。この気泡（９）がはんだの
濡れを明害し、はんだ付けの信頼性を著しく悪化させる
のである。Furthermore, printed wiring boards (7) and leadless electronic circuit components (8)
) is exposed to high temperatures and gasifies, and bubbles (9) of these air and gases accumulate on both sides of the electronic circuit component (8). These air bubbles (9) impair solder wetting and significantly deteriorate soldering reliability.
又、第６図に示す噴流法は噴流溶融はんだ（１１）に対
し、印刷配線基板（７）を横移動させて通過させるので
あるが、第７図の様に印刷配線基板（７）の移動方向に
対して電子回路部品（８）の後方の電極部（８１ａ）近
傍で渦か生じ、前記同様この部分に気泡（９）が滞溜し
てはんだの濡れを１１１］害し、はんだ付番ノの信頼性
を低−ドさぜる。In addition, in the jet method shown in Fig. 6, the printed wiring board (7) is moved horizontally to pass the jet molten solder (11), but as shown in Fig. 7, the printed wiring board (7) is moved A vortex is generated near the electrode part (81a) at the rear of the electronic circuit component (8) with respect to the direction, and air bubbles (9) accumulate in this part as described above, impairing solder wetting and causing solder numbering. This will reduce the reliability of the system.
」−記従来法について研究してみると、浸漬法、噴流法
の何れの場合も気泡によりはんだの濡れか［；ｌ」害さ
れる箇所は溶融はんだの流れ方向の死角となる部分であ
ること及び、電子部品の電極部（８１）がはんだで濡れ
ると、１１ｆ度溶融はんだに浸漬しても気泡による悪影
響は出ないことが判った。A study of the conventional methods revealed that in both the immersion method and the jet method, the areas where bubbles damage the solder wetting are the blind spots in the flow direction of the molten solder. It has been found that when the electrode part (81) of an electronic component is wetted with solder, there is no adverse effect due to bubbles even if it is immersed in molten solder at 11 degrees Fahrenheit.
本発明は上記実情及び研究に基づき印刷配線基板（７）
を支える支持台（３）を回転させる装置（６）及び、支
持台（３）と溶融はんだを相対的に横移動させる装置（
２）を具えることにより印刷配線基板（７）を溶融はん
だ槽（１）に対して回転させっつ横移動させることによ
り気泡の影響が無く信頼性のあるはんだ付けが行なえる
はんだ付は装置を提供することを目的とする。The present invention is based on the above actual situation and research, and provides a printed wiring board (7).
A device (6) for rotating the support stand (3) that supports the
2) enables reliable soldering without the influence of air bubbles by rotating and moving the printed wiring board (7) horizontally relative to the molten solder bath (1). The purpose is to provide
以下図面に示す如く本発明を具体的に説明する第１図は
はんだ付は装置の平面図、第２図はその断面図であって
、該はんだ利は装置は溶融はんだ（１１）を谷れた上面
開ｆ丁＋の長尺の槽（１）の−１一方に印刷配線基板（
７）の支持台（３）が配備され、該支持台（３）は回転
装置（６）及び横移動装置（２）に連繋されている。As shown in the drawings below, the present invention will be explained in detail. Fig. 1 is a plan view of a soldering device, and Fig. 2 is a cross-sectional view thereof. A printed wiring board (
A support stand (3) of 7) is provided, which support stand (3) is connected to the rotation device (6) and the lateral movement device (2).
横移動装置（２）は溶融はんだ槽（１）の」一方に該は
んだ槽に沿って張設され駆動装置（図示せず）にょつて
走行する一対の搬送チェノｔ２１＋ ＋２１）である。The lateral movement device (2) is a pair of conveyor chains (t21+ +21) which are stretched along one side of the molten solder bath (1) and run by a drive device (not shown).
搬送チェノ（２１） ＋２１＋には支持台保合用の受は
軸（２２）が突設されている。A shaft (22) is provided protruding from the conveyance ceno (21) +21+ as a receiver for holding the support stand.
支持台（３）は搬送チェノ＋２１＋ （２］］に跨かつ
て配備された支持台本体（４）と、該本体（４）の中央
に突設した支持軸（３１）に水すＩＺｎ内で回転自由に
枢止され外周に南面（５４）を形成した補助台（５）と
、補助台（５）に突設され印刷配線基板（７）を支える
ハンガー（５１）とで構成されている。The support stand (3) is connected to the support stand main body (4) that was previously installed across the conveyance ceno +21+ (2]) and the support shaft (31) protruding from the center of the main body (4), and is rotated in the water bath IZn. It consists of an auxiliary stand (5) which is freely pivoted and has a south face (54) on its outer periphery, and a hanger (51) which projects from the auxiliary stand (5) and supports the printed wiring board (7).
支持台本体（４）は両端に軸孔（３３）か開設され該孔
（３３）が前記搬送チェノ（２１）の受軸ｅ２＋に嵌ま
っている。The support body (4) has shaft holes (33) at both ends, and the holes (33) fit into the receiving shaft e2+ of the conveyance ceno (21).
支持台本体（４）及び補助台（５）には印刷配線基板（
７）に対応する大きさの貫通部（、ｌＩ２＋ ＋５２＋
が形成され、補助台（５）の貫通部（５２）の周縁に先
端が内向きに屈曲し往つ溶融はんだ液面に達するハンガ
ー（５１）が下向きに突設されている。A printed wiring board (
7) of a size corresponding to (, lI2+ +52+
A hanger (51) is formed on the periphery of the penetrating portion (52) of the auxiliary stand (5) and protrudes downward, the tip of which is bent inward and reaches the molten solder level.
上記一対の搬送チェノ（２１）の内一方の搬送チェノ（
２１）に沿ってラックバ−（６１）がその歯面を補助台
（５）側に向けて固定配備され、補助台（５）の歯面（
５４）に噛合している。One of the above-mentioned pair of transport chenos (21) (
A rack bar (61) is fixedly arranged along the tooth surface of the auxiliary table (5) with its tooth surface facing the auxiliary table (5).
54).
又、搬送チェノ＋２１＋ ＋２１）の下方にはチェノ方
向にガイド台（２４）が配備され、チェノ（２１）に取
付けたローラ因）がガイド台（２４＋ 、１−を転勤す
ることにより、チェノ（２１）に掛かる荷重はガイド台
（２４）で支えられ従ってチェノ（２１）は真直に走行
する。In addition, a guide stand (24) is provided below the conveying ceno +21+ +21) in the direction of the ceno, and the rollers attached to the ceno (21) transfer the guide stands (24+, 1-) to transfer the ceno (21). ) is supported by the guide stand (24), so that the ceno (21) runs straight.
然してリードレス電子回路部品（８）を接着によって仮
付けした印刷配線基板（７）を、電子回路部品（８）の
装着面を下向きにして支持台（３）のハンガー（５１）
に支持せしめ、搬送ヂエン（２１）を走行させる。Then, the printed wiring board (7) to which the leadless electronic circuit component (8) is temporarily attached by adhesive is placed on the hanger (51) of the support base (3) with the mounting surface of the electronic circuit component (8) facing downward.
The transport engine (21) is made to run.
チェノ（２１）に係合した支持台（３）従って印刷配線
基板（７）は溶融はんだ（１１）に漬かりなから横移動
する。The support base (3) engaged with the solder (21) and therefore the printed wiring board (7) are moved laterally without being submerged in the molten solder (11).
この時、支持台（３）の補助台（５）は外周の歯面（圓
がラックバ−ｔ６］）に係合しているため、支持台（３
）の横移動に伴なって回転し、従って印刷配線基板（７
）は溶融はんだ槽（１）の長手方向に横移動しつつ水平
面内で回転移動する。従って溶融はんだ中に気泡が生じ
ても、従来の様に気泡が一定の位置に即ち電極部（８１
）近傍に滞溜してはんだの濡れを阻害することは無い。At this time, since the auxiliary base (5) of the support base (3) is engaged with the tooth surface on the outer periphery (the round is the rack bar t6), the support base (3)
) rotates as the printed wiring board (7
) rotates within a horizontal plane while laterally moving in the longitudinal direction of the molten solder bath (1). Therefore, even if air bubbles occur in the molten solder, the air bubbles will remain at a fixed position, that is, at the electrode part (81
) It does not accumulate in the vicinity and impede wetting of the solder.
尚、実施例は溶融はんだを噴流させない場合を示してい
るか、これに限定されず槽（１）中で溶融はんだをト、
方に噴流させつつ印刷配線基板（７）を回転技０・横移
動させてはんだ伺けすることも勿論１月能である。It should be noted that the examples show the case where the molten solder is not jetted, or the molten solder is not jetted in the tank (1), but is not limited to this.
Of course, it is also possible to perform soldering by rotating the printed wiring board (7) horizontally and moving the printed wiring board (7) horizontally while making the jet flow in the opposite direction.
又本発明の実施に際して支持台（３）の支持軸（３１）
にモータ等の回転装置を連繋し、溶融はんだ槽（１）に
横移動装置を連繋しても前記と同様の効果を得ることが
出来る。Also, when implementing the present invention, the support shaft (31) of the support stand (3)
The same effect as described above can be obtained by connecting a rotating device such as a motor to the molten solder bath (1) and a lateral movement device to the molten solder bath (1).
尚、本発明は］−記構酸に限定されることはなく特許請
求の範囲に記載の技術範囲内で種々の変形が可能である
のは勿論である。It should be noted that the present invention is not limited to the structural acid described above, and it goes without saying that various modifications can be made within the technical scope of the claims.
本発明はＦ、、、 ｉｃ！の如（、印刷配線基板を回転
させつつＹ」、つ溶融はんだ槽に対し相対的に横移動さ
せて溶融はんだに浸漬させることが出来るから溶融はん
だ中に気泡が生じても気泡が同じ位置で滞Ｈすることは
なく、従って気泡によって電極部へのはんだのＩ需れが
阻害されることはなく、信頼性の高いはんだ付けが行な
える優れた効果を有す。The present invention is F...ic! The printed wiring board can be moved laterally relative to the molten solder bath and immersed in the molten solder, so even if air bubbles form in the molten solder, the air bubbles will remain at the same position. There is no stagnation, therefore, the flow of solder to the electrode portion is not inhibited by bubbles, and this has the excellent effect of allowing highly reliable soldering to be performed.
第１図ははんだ付は装置の′＝１ｉ面図、第２図は第１
図ＩＩＩ−ＩＩ線に沿う断面図、第３図は印刷配線基板
」−に電子回路部品をはんだ付けした状態の断面図、第
４図乃至第７図は従来例の説明図である。
（２）・・・横移動装置 （２１）・・・搬送チェノ
（６）・・・回転装置 （６１） ラックバ−出
願人 三洋電機株式会社
特開昭５８−１８２８９６ （４）Figure 1 shows soldering on the '=1i side of the device, and Figure 2 shows soldering on
FIG. 3 is a sectional view taken along the line III--II, FIG. 3 is a sectional view of a state in which electronic circuit components are soldered to a printed wiring board, and FIGS. 4 to 7 are explanatory diagrams of conventional examples. (2)...Lateral movement device (21)...Transporting cheno (6)...Rotating device (61) Rack bar - Applicant Sanyo Electric Co., Ltd. JP-A-58-182896 (4)
Claims (1)
を水平面内で回転させる回転装置（６）と、該回転装置
（６）のｆ方に配備され印刷配線基板（７）が漬かる溶
融はんだを容れる溶融はんだ槽（１）と、前記回転装置
（６）或は溶融はんだ槽（１）の何れかに連繋され回転
装置（６）と溶融はんだ槽（１）とを相対的に移動させ
る横移動装置（２）とで構成された印刷配線基板のはん
だ付は装置。 ■ 支持台（３）は支持台本体（４）と該支持台本体（
４）に回転自由に枢止され下面に印刷配線基板（７）を
支えるハンガー６１）を具え、且つ外周に南面（５４）
を形成した円形の補助台（５）とから成り、横移動装置
（２）は支持台本体（４）に連結した搬送チェノ（２１
）であり、回転装置（６）は搬送チェノｔ２１１と平行
に配備したラックバ−（６１）に対して前記補助台（５
）の外周歯面６４）を係合して構成されている特許請求
の範囲第１項に記載の印刷配線基板のはんだ付は装置[Claims] ■ Support stand (3) that horizontally supports the printed wiring board (7)
a rotating device (6) for rotating the printed wiring board (7) in a horizontal plane; a molten solder bath (1) disposed on the f side of the rotating device (6) and containing molten solder in which the printed wiring board (7) is immersed; ) or a soldering device for printed wiring boards, which is connected to either the molten solder tank (1) and consists of a rotation device (6) and a lateral movement device (2) that moves the molten solder tank (1) relative to each other. Attached is the device. ■ The support stand (3) has a support stand main body (4) and the support stand main body (
4) is provided with a hanger 61) which is rotatably pivoted to support the printed wiring board (7) on the lower surface, and has a south surface (54) on the outer periphery.
The lateral movement device (2) consists of a transfer ceno (21) connected to the support body (4).
), and the rotating device (6) rotates the auxiliary stand (5) with respect to the rack bar (61) arranged parallel to the transport cheno
) is configured by engaging the outer circumferential tooth surface 64) of the printed wiring board according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6697682A JPS58182896A (en) | 1982-04-20 | 1982-04-20 | Device for soldering printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6697682A JPS58182896A (en) | 1982-04-20 | 1982-04-20 | Device for soldering printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58182896A true JPS58182896A (en) | 1983-10-25 |
| JPS6254581B2 JPS6254581B2 (en) | 1987-11-16 |
Family
ID=13331557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6697682A Granted JPS58182896A (en) | 1982-04-20 | 1982-04-20 | Device for soldering printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58182896A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60106192A (en) * | 1983-11-14 | 1985-06-11 | 松下電器産業株式会社 | Method of soldering printed board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5127845A (en) * | 1974-09-03 | 1976-03-09 | Koki Kk | HANDAZUKE SOCHI |
-
1982
- 1982-04-20 JP JP6697682A patent/JPS58182896A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5127845A (en) * | 1974-09-03 | 1976-03-09 | Koki Kk | HANDAZUKE SOCHI |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60106192A (en) * | 1983-11-14 | 1985-06-11 | 松下電器産業株式会社 | Method of soldering printed board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6254581B2 (en) | 1987-11-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1263896A (en) | Wave solder finger shield apparatus | |
| JPS58182896A (en) | Device for soldering printed circuit board | |
| JPH02277753A (en) | Method and device for solder plating | |
| JPS5922933Y2 (en) | soldering equipment | |
| CN220798670U (en) | PCB board easy to solder | |
| JPH0137825Y2 (en) | ||
| JPS60227969A (en) | Soldering treatment | |
| JPS58162095A (en) | Method of soldering electronic part | |
| JPS5961572U (en) | soldering equipment | |
| JPH01157763A (en) | Presoldering device for electronic part lead | |
| JPS58221667A (en) | Soldering method of chip parts | |
| JPH0256989B2 (en) | ||
| JPH0157991B2 (en) | ||
| JPH0621644A (en) | Reflow furnace with excellent temperature controllability | |
| SU778966A1 (en) | Apparatus for tinning printed-circuit boards | |
| JPH02155567A (en) | Jet type soldering tank | |
| JPS61186163A (en) | Soldering instrument | |
| JPS614570A (en) | Draining method of coating solution | |
| JPH0787265B2 (en) | Soldering method | |
| JPS60130894A (en) | Method of mounting electronic part | |
| FR2312916A1 (en) | Electrolytic bath for coating printed circuits - has heated tin-lead alloy liquid circulated over printed circuit board to coat copper conductors | |
| JPS60144275U (en) | Electronic parts replacement equipment | |
| JPS61142788A (en) | Method and apparatus for cleaning one side of printed circuit board | |
| JPS59207688A (en) | Method of soldering printed board | |
| JP2003017846A (en) | Lead-free soldering method and device thereof |