JPS60144275U

JPS60144275U - Electronic parts replacement equipment

Info

Publication number: JPS60144275U
Application number: JP3060984U
Authority: JP
Inventors: 田島　一宏; 三郎高橋; 大槻　光男; 筧　実
Original assignee: 沖電気工業株式会社
Priority date: 1984-03-05
Filing date: 1984-03-05
Publication date: 1985-09-25

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１図は交換電子部品を搭載した基板の斜視図、第２図
は電子部品の端子と挿入孔の固定状態を示す側断面図、
第３図は従来の交換装置の斜視図、第４図は従来の交換
工程を示すフローチャート、第５図は時間による銅拡散
量を示すグラフ、第６図は従来の交換作業による銅メッ
キ層の側断面図、第７図は銅メッキ層の部分拡大側断面
図、第８図は本考案の一実施例を示す交換装置の全体斜
視図、第９図は本装置の駆動機構を示す側面図、第１０
図は部品吸着支の側面図、第１１図は電子部品の端子の
固定部分の拡大側面図、第１２図は装置の作動タイミン
グを示すタイムチャートである。１・・・・・・基板、２・・・・・・電子部品、７・・
・・・・半田槽、８・・・・・・溶融半田、９・・・用
ノズル、１０・・・・・・攪拌部、１１・・・・・・モ
ータ、１２・・・・・・ベルト、１３・曲・基板取付台
、１４・・・・・・スライド棒、１５・・・・・・部品
吸着支、１５’ａ・・・・・・バキュームチャック、１
６・・・・・・部品交換支、１７・・・・・・半田浸漬
可動部、１８゜１９・・・・・・エアシリンダ、２０・
・・・・・腕、２１・・曲センサ。Fig. 1 is a perspective view of a board on which a replacement electronic component is mounted, Fig. 2 is a side sectional view showing the fixed state of the terminal of the electronic component and the insertion hole;
Fig. 3 is a perspective view of a conventional exchange device, Fig. 4 is a flowchart showing the conventional exchange process, Fig. 5 is a graph showing the amount of copper diffusion over time, and Fig. 6 is a diagram showing the amount of copper plating layer due to the conventional exchange process. 7 is a partially enlarged side sectional view of the copper plating layer, FIG. 8 is an overall perspective view of an exchange device showing an embodiment of the present invention, and FIG. 9 is a side view showing the drive mechanism of the device. , 10th
11 is an enlarged side view of a fixed portion of a terminal of an electronic component, and FIG. 12 is a time chart showing the operating timing of the device. 1... Board, 2... Electronic components, 7...
... Solder tank, 8 ... Melted solder, 9 ... Nozzle, 10 ... Stirring section, 11 ... Motor, 12 ... Belt, 13, curved, board mounting stand, 14...slide rod, 15...component suction support, 15'a...vacuum chuck, 1
6... Parts replacement support, 17... Solder immersion movable part, 18° 19... Air cylinder, 20.
...Arm, 21...Bending sensor.

Claims

[Scope of utility model registration request]

A nozzle opened above a solder bath containing molten solder is provided, and the molten solder is jetted from the nozzle to perform flux treatment on the back surface of a board on which a plurality of electronic components are mounted, and the back surface of a predetermined electronic component is coated with the jet flow. In an electronic component replacement device, the electronic component is immersed in molten solder to melt the solder on the solder fixing part of the electronic component, and then the electronic component is removed from the board and a new electronic component is installed. The slide refers to a component suction support that slides in the orthogonal direction and moves up and down by providing a board mount on the nozzle and sucking electronic components onto the board mount at a position directly above the nozzle and moving up and down. What is claimed is: 1. A device for replacing electronic components, characterized in that the upward movement of the component suction support is set at a predetermined time.