JPH0846115A - Metallic film forming apparatus - Google Patents
Metallic film forming apparatusInfo
- Publication number
- JPH0846115A JPH0846115A JP18143294A JP18143294A JPH0846115A JP H0846115 A JPH0846115 A JP H0846115A JP 18143294 A JP18143294 A JP 18143294A JP 18143294 A JP18143294 A JP 18143294A JP H0846115 A JPH0846115 A JP H0846115A
- Authority
- JP
- Japan
- Prior art keywords
- pin
- forming apparatus
- mask
- film forming
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、ピン型リードを有す
る半導体パッケージの製造工程において用いられる金属
被膜形成装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal film forming apparatus used in a manufacturing process of a semiconductor package having a pin type lead.
【０００２】[0002]
【従来の技術】ピン型アウタリードを有する半導体パッ
ケージとして、セラミックパッケージと称されるものが
知られている。このセラミックパッケージは、セラミッ
クからなる回路基板に半導体チップを搭載したものであ
り、このようなセラミックパッケージのピン型アウタリ
ードは、電気的抵抗を考慮して金（Ａｕ）で製作されて
いることが多い。2. Description of the Related Art As a semiconductor package having a pin type outer lead, one called a ceramic package is known. In this ceramic package, a semiconductor chip is mounted on a circuit board made of ceramic, and the pin-type outer leads of such a ceramic package are often made of gold (Au) in consideration of electric resistance. .
【０００３】従って、セラミックパッケージをプリント
基板にハンダ付けする場合には、あらかじめピン型アウ
タリードの表面にＳｎ−Ｐｂ系合金（ハンダ）の金属被
膜を形成しておく必要があり、従来では図４に示すよう
な金属被膜形成装置を用いてセラミックパッケージのピ
ン型アウタリードにＳｎ−Ｐｂ系合金の金属被膜を形成
している。Therefore, when soldering a ceramic package to a printed circuit board, it is necessary to previously form a metal coating of Sn-Pb alloy (solder) on the surface of the pin type outer lead. A metal film of Sn—Pb alloy is formed on the pin-shaped outer leads of the ceramic package using the metal film forming apparatus as shown.
【０００４】図４において、１は図示しない昇降機構に
より上下方向に昇降する水平アームであり、この水平ア
ーム１の先端には、セラミックパッケージ等の半導体パ
ッケージを保持する保持手段２が設けられている。ま
た、３は前記保持手段２の下方に設けられた溶融金属槽
であり、この溶融金属槽３には、Ｓｎ−Ｐｂ系合金（ハ
ンダ）４が溶融した状態で収容されている。In FIG. 4, reference numeral 1 denotes a horizontal arm which is vertically moved by an elevator mechanism (not shown), and a holding means 2 for holding a semiconductor package such as a ceramic package is provided at the tip of the horizontal arm 1. . Reference numeral 3 denotes a molten metal tank provided below the holding means 2. The molten metal tank 3 contains a Sn-Pb alloy (solder) 4 in a molten state.
【０００５】このような金属被膜形成装置を用いてセラ
ミックパッケージのピン型アウタリードに金属被膜を形
成する場合は、図５に示すように、水平アーム１の先端
に設けられた保持手段２によりセラミックパッケージ４
を保持した後、図示しない昇降機構を駆動して水平アー
ム１を下降させ、溶融金属槽３に収容されたＳｎ−Ｐｂ
系合金４にセラミックパッケージ５のピン型アウタリー
ド６を浸漬する。そして、所定時間経過した後、図示し
ない昇降機構を駆動して水平アーム１を上昇させ、ピン
型アウタリード６を溶融金属槽３から引き上げると、ピ
ン型アウタリード６に付着したＳｎ−Ｐｂ系合金４が固
化し、ピン型アウタリード６の表面にＳｎ−Ｐｂ系合金
４の金属被膜が形成される。When a metal coating is formed on the pin type outer leads of the ceramic package by using such a metal coating forming apparatus, the ceramic package is held by the holding means 2 provided at the tip of the horizontal arm 1 as shown in FIG. Four
After holding, the elevating mechanism (not shown) is driven to lower the horizontal arm 1 and the Sn-Pb contained in the molten metal tank 3 is held.
The pin-type outer lead 6 of the ceramic package 5 is immersed in the system alloy 4. Then, after a lapse of a predetermined time, the elevating mechanism (not shown) is driven to raise the horizontal arm 1 and the pin-type outer lead 6 is pulled up from the molten metal tank 3, so that the Sn-Pb alloy 4 adhered to the pin-type outer lead 6 is When solidified, a metal coating of the Sn—Pb alloy 4 is formed on the surface of the pin-type outer lead 6.
【０００６】[0006]
【発明が解決しようとする課題】ところで、最近の半導
体パッケージは、ピン型アウタリードの数が増加する傾
向にあり、リード数の増加に伴ってリード間のピッチも
例えば１．０ｍｍ〜１．５ｍｍと狭くなっている。この
ようにピッチの狭いピン型アウタリードに金属被膜を形
成する場合、上述した金属被膜形成装置ではピン型アウ
タリード６を溶融金属槽３から引き上げたときに、図６
に示すように、ピン型アウタリード６の間にＳｎ−Ｐｂ
系合金４が付着し、リード間を短絡させる短絡ブリッジ
が形成されるという難点があった。By the way, in recent semiconductor packages, the number of pin-type outer leads tends to increase, and the pitch between the leads is, for example, 1.0 mm to 1.5 mm as the number of leads increases. It is getting narrower. When the metal coating is formed on the pin-shaped outer leads having a narrow pitch as described above, when the pin-shaped outer leads 6 are pulled up from the molten metal tank 3 in the above-described metal coating forming apparatus,
As shown in, Sn-Pb is provided between the pin-type outer leads 6.
There is a problem that the system alloy 4 adheres to form a short-circuit bridge that short-circuits the leads.
【０００７】この発明は上述した問題点に鑑みてなされ
たもので、その目的はリード間のピッチが狭くてもリー
ド間に溶融金属の短絡ブリッジを形成することなくピン
型リードの表面に金属被膜を形成することのできる金属
被膜形成装置を提供しようとするものである。The present invention has been made in view of the above problems, and an object thereof is to form a metal coating on the surface of a pin-type lead without forming a short-circuit bridge of molten metal between the leads even if the pitch between the leads is narrow. An object of the present invention is to provide a metal film forming apparatus capable of forming a metal film.
【０００８】[0008]
【課題を解決するための手段】上述した課題を解決する
ために、この発明は、溶融金属槽と対向する位置にマス
クを設け、このマスクに半導体パッケージのピン型リー
ドが挿通可能な貫通孔を設けたことを特徴とするもので
ある。In order to solve the above-mentioned problems, the present invention provides a mask at a position facing a molten metal bath, and a through hole into which a pin-type lead of a semiconductor package can be inserted is provided in the mask. It is characterized by being provided.
【０００９】[0009]
【作用】半導体パッケージのピン型リードをマスクに穿
設された貫通孔を挿通して溶融金属に浸漬すると、ピン
型リードを溶融金属から引き上げたときにリード間に付
着した溶融金属がマスクによって除去される。When the pin type lead of the semiconductor package is inserted into the molten metal through the through hole formed in the mask, the molten metal adhered between the leads when the pin type lead is pulled up from the molten metal is removed by the mask. To be done.
【００１０】[0010]
【実施例】以下、この発明の一実施例を図１ないし図３
を参照して説明する。なお、図４に示したものと同一部
分には同一の符合を付し、その部分の説明は省略する。
図１に示すように、この発明の一実施例に係る金属被膜
形成装置は、溶融金属槽３の上方にプレート状のマスク
７を有している。このマスク７はステンレス鋼からな
り、図２に示すように多数の貫通孔８を有している。こ
れらの貫通孔８は半導体パッケージのピン型アウタリー
ド６に対応して設けられており、ピン型アウタリード６
が挿通可能な内径を有している。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS.
Will be described with reference to. The same parts as those shown in FIG. 4 are designated by the same reference numerals, and the description of those parts will be omitted.
As shown in FIG. 1, a metal film forming apparatus according to an embodiment of the present invention has a plate-shaped mask 7 above a molten metal tank 3. The mask 7 is made of stainless steel and has a large number of through holes 8 as shown in FIG. These through holes 8 are provided so as to correspond to the pin-type outer leads 6 of the semiconductor package.
Has an inner diameter that allows insertion.
【００１１】なお、マスク７は図示しない昇降機構によ
り上下方向に昇降する保持アーム９に保持されている。
このような金属被膜形成装置を用いてセラミックパッケ
ージのピン型アウタリードに金属被膜を形成する場合
は、図３の（ａ）に示すように、まず水平アーム１の先
端に設けられた保持手段２によりセラミックパッケージ
４を保持する。次に、図３の（ｂ）（ｃ）に示すよう
に、図示しない昇降機構を駆動して水平アーム１を下降
させ、マスク７に穿設された貫通孔８を通してセラミッ
クパッケージ５のピン型アウタリード６を溶融金属槽３
に収容されたＳｎ−Ｐｂ系合金４に浸漬する。そして、
所定時間経過した後、水平アーム１を上昇させ、セラミ
ックパッケージ５のピン型アウタリード６を溶融金属槽
３に収容されたＳｎ−Ｐｂ系合金４から引き上げる。こ
のとき、ピン型アウタリード６は、図３の（ｄ）に示す
ように、マスク７に穿設された貫通孔８を通って引き上
げられる。The mask 7 is held by a holding arm 9 that moves up and down in the vertical direction by an elevator mechanism (not shown).
When a metal coating is formed on the pin type outer leads of the ceramic package by using such a metal coating forming apparatus, as shown in FIG. 3A, first, the holding means 2 provided at the tip of the horizontal arm 1 is used. Hold the ceramic package 4. Next, as shown in FIGS. 3B and 3C, an elevating mechanism (not shown) is driven to lower the horizontal arm 1, and the pin-shaped outer lead of the ceramic package 5 is passed through the through hole 8 formed in the mask 7. 6 for molten metal tank 3
It is dipped in the Sn—Pb alloy 4 housed in. And
After a lapse of a predetermined time, the horizontal arm 1 is raised, and the pin-type outer lead 6 of the ceramic package 5 is pulled up from the Sn-Pb alloy 4 contained in the molten metal bath 3. At this time, the pin-type outer lead 6 is pulled up through the through hole 8 formed in the mask 7, as shown in FIG.
【００１２】従って、この発明の一実施例に係る金属被
膜形成装置では、ピン型アウタリード６をＳｎ−Ｐｂ系
合金４から引き上げたときにピン型アウタリード６の間
にＳｎ−Ｐｂ系合金４が付着していたとしても、マスク
７に穿設された貫通孔８を通してピン型アウタリード６
を引き上げることによりピン型アウタリード６の間に付
着したＳｎ−Ｐｂ系合金４がマスク７によって除去され
るので、リード間のピッチが狭くてもリード間にＳｎ−
Ｐｂ系合金４の短絡ブリッジを形成することなくピン型
アウタリード６の表面に金属被膜を形成することができ
る。Therefore, in the metal coating film forming apparatus according to the embodiment of the present invention, when the pin-type outer lead 6 is pulled up from the Sn-Pb-based alloy 4, the Sn-Pb-based alloy 4 adheres between the pin-type outer leads 6. Even if it is, the pin-type outer lead 6 is inserted through the through hole 8 formed in the mask 7.
The Sn-Pb-based alloy 4 adhered between the pin-type outer leads 6 is removed by the mask 7 by pulling up the pin-type outer leads 6. Therefore, even if the pitch between the leads is narrow,
A metal coating can be formed on the surface of the pin-type outer lead 6 without forming a short-circuit bridge of the Pb-based alloy 4.
【００１３】また、この発明の一実施例に係る金属被膜
形成装置では、マスク７はステンレス鋼で形成されてい
るので、マスク７の下面をＳｎ−Ｐｂ系合金４に浸して
もマスク７の下面にＳｎ−Ｐｂ系合金４が付着し難いと
いう利点がある。Further, in the metal film forming apparatus according to the embodiment of the present invention, since the mask 7 is made of stainless steel, even if the lower surface of the mask 7 is dipped in the Sn-Pb alloy 4, the lower surface of the mask 7 In addition, there is an advantage that the Sn-Pb alloy 4 is hard to adhere.
【００１４】[0014]
【発明の効果】以上説明したように、この発明によれ
ば、リード間のピッチが狭くてもリード間に溶融金属の
短絡ブリッジを形成することなくピン型リードの表面に
金属被膜を形成することのできる金属被膜形成装置を提
供できる。As described above, according to the present invention, even if the pitch between the leads is narrow, a metal film is formed on the surface of the pin type lead without forming a short circuit bridge of the molten metal between the leads. It is possible to provide a metal film forming apparatus capable of performing the above.
【図１】この発明の一実施例に係る金属被膜形成装置の
概略構成図。FIG. 1 is a schematic configuration diagram of a metal film forming apparatus according to an embodiment of the present invention.
【図２】同実施例に係る金属被膜形成装置の要部を示す
図。FIG. 2 is a view showing a main part of a metal film forming apparatus according to the embodiment.
【図３】同実施例に係る金属被膜形成装置の作用説明
図。FIG. 3 is an operation explanatory view of the metal film forming apparatus according to the embodiment.
【図４】従来の金属被膜形成装置の概略構成図。FIG. 4 is a schematic configuration diagram of a conventional metal film forming apparatus.
【図５】従来の金属被膜形成装置の作用説明図。FIG. 5 is an operation explanatory view of a conventional metal film forming apparatus.
【図６】図４に示した金属被膜形成装置において狭ピッ
チのピン型アウタリードを溶融金属から引き上げた状態
を示す図。6 is a view showing a state in which the pin-shaped outer leads with a narrow pitch are pulled up from the molten metal in the metal film forming apparatus shown in FIG.
１…水平アーム ２…保持手段 ３…溶融金属槽 ４…Ｓｎ−Ｐｂ系合金 ５…セラミックパッケージ ６…ピン型アウタリード ７…マスク ８…貫通孔 DESCRIPTION OF SYMBOLS 1 ... Horizontal arm 2 ... Holding means 3 ... Molten metal tank 4 ... Sn-Pb type alloy 5 ... Ceramic package 6 ... Pin type outer lead 7 ... Mask 8 ... Through hole
Claims (2)
ードを浸漬して前記ピン型リードの表面に金属被膜を形
成する金属被膜形成装置において、前記溶融金属が収容
された溶融金属槽と対向する位置にマスクを設け、この
マスクに前記ピン型リードが挿通可能な貫通孔を設けた
ことを特徴とする金属被膜形成装置。1. A metal film forming apparatus for immersing a pin-type lead of a semiconductor package in molten metal to form a metal film on the surface of the pin-type lead, at a position facing a molten metal tank containing the molten metal. A metal film forming apparatus, wherein a mask is provided on the mask, and a through hole into which the pin type lead can be inserted is provided in the mask.
とを特徴とする請求項１記載の金属被膜形成装置。2. The metal film forming apparatus according to claim 1, wherein the mask is made of stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18143294A JPH0846115A (en) | 1994-08-02 | 1994-08-02 | Metallic film forming apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18143294A JPH0846115A (en) | 1994-08-02 | 1994-08-02 | Metallic film forming apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0846115A true JPH0846115A (en) | 1996-02-16 |
Family
ID=16100678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18143294A Pending JPH0846115A (en) | 1994-08-02 | 1994-08-02 | Metallic film forming apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0846115A (en) |
-
1994
- 1994-08-02 JP JP18143294A patent/JPH0846115A/en active Pending
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