JPS6234478Y2 - - Google Patents
Info
- Publication number
- JPS6234478Y2 JPS6234478Y2 JP1978143257U JP14325778U JPS6234478Y2 JP S6234478 Y2 JPS6234478 Y2 JP S6234478Y2 JP 1978143257 U JP1978143257 U JP 1978143257U JP 14325778 U JP14325778 U JP 14325778U JP S6234478 Y2 JPS6234478 Y2 JP S6234478Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- mask
- printed board
- printed
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 28
- 238000005476 soldering Methods 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Description
【考案の詳細な説明】
本考案はプリント板の自動半田付け装置に関す
る。[Detailed Description of the Invention] The present invention relates to an automatic soldering device for printed circuit boards.
一般にプリント板はICや半導体等の各種電子
部品を実装した後に部品搭載面の反対側（半田
面）に突出するそれら各部品の外部端子を半田面
側で半田してプリント板に固着する必要がある。 In general, after mounting various electronic components such as ICs and semiconductors on printed circuit boards, it is necessary to solder the external terminals of those components that protrude to the opposite side (solder side) of the component mounting surface to the solder side to secure them to the printed board. be.
このプリント基板の自動半田付け装置として一
般に半田液の上昇旋回流（噴流）を利用するフロ
−式半田付け装置が用いられている。斯かるフロ
−式半田付け装置の典型的な構造例を第１図に示
す。同図について簡単に説明すると、半田槽１内
の半田液Ａはフアン５により案内部材３内を矢印
で示す如く上昇旋回せしめられる。IC、半導体
等の各種電子部品１１Ａ，１１Ｂ，１１Ｃ，……
を搭載した半田すべきプリント板１０は半田槽１
の上方を白ぬき矢印で示す方向に送られる。その
結果プリント板１０の半田面（図において下面）
に半田付けがなされる。プリント基板の移送には
一般にコンベヤ装置が用いられる。プリント基板
の両側縁部（進行方向にみて左右側縁）をこのコ
ンベヤ装置により保持して半田槽上を所定の方向
に移送せしめる。プリント基板の移送は図示の如
く傾斜移送方式（従つて傾斜コンベヤを使用）と
水平移送方式とがあるが、傾斜移送方式の方がピ
ルバツク（基板面に付いた半田を半田槽に引き戻
す力）が大きくなるという利点があるので優勢で
ある。また半田液の流動方式にも図示の如きシン
グルウエーブ式の他にダブルウエーブ式、ジエツ
トウエーブ式、２段ウエーブ式等種々用いられて
いるが半田液をプリント基板の半田面に向つて下
方から上方に流動させるという点では共通してい
る。 A flow type soldering apparatus that utilizes an upward swirling flow (jet flow) of solder liquid is generally used as an automatic soldering apparatus for printed circuit boards. A typical structural example of such a flow soldering device is shown in FIG. Briefly explaining this figure, the solder liquid A in the solder bath 1 is caused to swirl upward within the guide member 3 by the fan 5 as shown by the arrow. Various electronic components such as ICs and semiconductors 11A, 11B, 11C,...
The printed circuit board 10 to be soldered equipped with the solder tank 1
It is sent in the direction indicated by the white arrow above. As a result, the solder surface of the printed board 10 (lower surface in the figure)
soldering is done. Conveyor devices are generally used to transport printed circuit boards. Both side edges (left and right side edges as viewed in the direction of travel) of the printed circuit board are held by this conveyor device and transferred in a predetermined direction over the solder bath. As shown in the figure, there are two ways to transfer printed circuit boards: an inclined transfer method (thus using an inclined conveyor) and a horizontal transfer method, but the inclined transfer method has better pillback (force to pull the solder attached to the board surface back into the solder tank). It is dominant because it has the advantage of being large. In addition to the single wave method shown in the figure, various solder fluid flow methods are used, such as a double wave method, a jet wave method, and a two-stage wave method. What they have in common is that they flow upward.
扨て斯かるフロ−式半田付け装置においてプリ
ント板の半田領域は従来プリント板の半田面に所
定形状のマスクを所定位置に取付けることにより
調整していたのでプリント板毎にマスクをいちい
ち所定位置に取付けなければならない煩わしさが
あつた。 In such flow-type soldering equipment, the solder area of the printed circuit board was conventionally adjusted by attaching a mask of a predetermined shape to the soldering surface of the printed board at a predetermined position. It was a hassle to have to install it.
本考案はこのような煩わしい作業をなくすため
に半田槽とプリント板との間に可動マスクを設け
てこの可動マスクを動かすことによりプリント板
の半田領域を簡単かつ迅速に調整しようとするも
のである。 In order to eliminate such troublesome work, the present invention provides a movable mask between the solder tank and the printed circuit board, and moves this movable mask to easily and quickly adjust the solder area on the printed circuit board. .
以下、図面に従つて説明する。 This will be explained below with reference to the drawings.
本考案によれば第２図に示す如く半田槽１の上
方に可動マスク部材２５が設けられる。即ち可動
マスク部材２５は半田槽１の槽口１Ａをプリント
板１０の半田領域に相対する部分のみを残してマ
スキングする。マスク部材２５は例えば所定形状
のプレートでよく、ピストンシリンダ２１のピス
トンロツド２３に連結される。ピストンシリンダ
２１は例えば油圧シリンダあるいはエアシリンダ
でよい。あるいはまたシリンダ２１の代りにリニ
アモータあるいはソレノイド等を用いてマスク部
材２５を電気的あるいは電磁気的に駆動すること
も可能である。マスク部材２５は好ましくはＸ方
向と同様にＹ方向にも移動可能にし槽口１Ａを平
面内の任意の所定位置でマスキングし得るように
する。Ｙ方向の移動は例えばシリンダ装置により
シリンダ２１、ロツド２３、マスク部材２５を全
体的に動かすようにすることにより簡単に達成で
きる。尚、２は半田溜めを示す。以上の如く構成
することによりレール１３上を走行するキヤリヤ
２０上に保持されたプリント板１０は白ぬき矢印
方向に送られその下方にあるマスク部材２５上を
通過するときにマスク部材２５によつてマスキン
グされていない部分に対応する半田面のみが半田
付けされる。即ち第２図においては破線で囲んだ
領域Ｓについては半田付けがされない。尚、半田
付けは半田工程時の熱によるプリント板の反りの
原因となるので不必要な部分についてはマスクを
してできるだけ半田付けしないようにするのが好
ましい。 According to the present invention, a movable mask member 25 is provided above the solder bath 1 as shown in FIG. That is, the movable mask member 25 masks the tank opening 1A of the solder tank 1, leaving only the portion facing the solder area of the printed board 10. The mask member 25 may be, for example, a plate of a predetermined shape and is connected to the piston rod 23 of the piston cylinder 21. The piston cylinder 21 may be, for example, a hydraulic cylinder or an air cylinder. Alternatively, it is also possible to use a linear motor, a solenoid, or the like instead of the cylinder 21 to drive the mask member 25 electrically or electromagnetically. The mask member 25 is preferably movable in the Y direction as well as in the X direction so that the tank opening 1A can be masked at any predetermined position within the plane. Movement in the Y direction can be easily achieved, for example, by moving the cylinder 21, rod 23, and mask member 25 as a whole using a cylinder device. Note that 2 indicates a solder reservoir. With the above configuration, the printed circuit board 10 held on the carrier 20 running on the rail 13 is sent in the direction of the white arrow, and when passing over the mask member 25 located below, the printed board 10 is transported by the mask member 25. Only the solder surfaces corresponding to the unmasked portions are soldered. That is, in FIG. 2, the area S surrounded by the broken line is not soldered. Note that since soldering causes the printed board to warp due to the heat generated during the soldering process, it is preferable to mask unnecessary portions and avoid soldering as much as possible.
以上に記載した如く本考案によればプリント板
に直接マスク部材を取付ける代りにプリント板と
半田槽との間に可動マスク部材を配置したことに
より連続的に送られてくるプリント板のマスキン
グを簡単かつ素早く行うことができ作業性が格段
に向上する。 As described above, according to the present invention, instead of attaching the mask member directly to the printed board, a movable mask member is placed between the printed board and the solder bath, thereby simplifying the masking of printed boards that are continuously fed. Moreover, it can be done quickly and work efficiency is greatly improved.
第１図は従来の典型的なフロ−式半田付け装置
の側面概略図、第２図は本考案に係る自動半田付
け装置の平面図。
１……半田槽、１０……プリント板、２１……
ピストンシリンダ、２３……ピストンロツド、２
５……マスク部材。
FIG. 1 is a schematic side view of a typical conventional flow soldering device, and FIG. 2 is a plan view of an automatic soldering device according to the present invention. 1... Solder tank, 10... Printed board, 21...
Piston cylinder, 23...Piston rod, 2
5...Mask member.
Claims (1)
の流動半田液を下方から接触せしめて順次連続し
て送られてくる複数種のプリント板下面（半田
面）の、プリント板の種類に応じた所定領域を半
田付けする自動半田付け装置において、上記半田
槽槽口の一部を覆うマスク部材と、該マスク部材
をプリント板搬送方向と同方向および／または直
角方向に移動させるマスク移動手段とを備え、連
続して送られてくるプリント板に対応して、該マ
スク移動手段により該マスクの位置を移動せし
め、以てプリント板の種類に対応して、プリント
板半田面の所定領域のみを半田付けし得るように
したことを特徴とする自動半田付け装置。 The printed boards held above the solder tank are brought into contact with the flowing solder liquid in the solder tank from below, and the lower surfaces (solder surfaces) of multiple types of printed boards are successively sent one after another, depending on the type of the printed board. An automatic soldering device for soldering a predetermined area includes a mask member that covers a part of the solder tank mouth, and a mask moving means that moves the mask member in the same direction and/or perpendicular direction to the printed board conveyance direction. The position of the mask is moved by the mask moving means in response to printed boards that are continuously sent, so that only a predetermined area of the solder surface of the printed board is soldered depending on the type of printed board. An automatic soldering device characterized by being capable of soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978143257U JPS6234478Y2 (en) | 1978-10-20 | 1978-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978143257U JPS6234478Y2 (en) | 1978-10-20 | 1978-10-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5560271U JPS5560271U (en) | 1980-04-24 |
| JPS6234478Y2 true JPS6234478Y2 (en) | 1987-09-02 |
Family
ID=29120763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978143257U Expired JPS6234478Y2 (en) | 1978-10-20 | 1978-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6234478Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7035793B2 (en) * | 2018-05-18 | 2022-03-15 | 株式会社デンソー | Soldering equipment and soldering method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5437783Y2 (en) * | 1975-04-14 | 1979-11-12 | ||
| JPS5495533U (en) * | 1977-12-17 | 1979-07-06 |
-
1978
- 1978-10-20 JP JP1978143257U patent/JPS6234478Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5560271U (en) | 1980-04-24 |
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