JPS62199260U - - Google Patents
Info
- Publication number
- JPS62199260U JPS62199260U JP8664186U JP8664186U JPS62199260U JP S62199260 U JPS62199260 U JP S62199260U JP 8664186 U JP8664186 U JP 8664186U JP 8664186 U JP8664186 U JP 8664186U JP S62199260 U JPS62199260 U JP S62199260U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- movable
- soldering device
- automatic soldering
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 6
- 210000000078 claw Anatomy 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims 1
- 230000004907 flux Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案キヤリアレス自動はんだ付け装
置の要部斜視図、第２図は本考案キヤリアレス自
動はんだ付け装置の平面図、第３図は第２図―
線断面拡大図である。
１……フラクサー、２……プリヒーター、３…
…はんだ槽、４……冷却機、５……固定フレーム
、５……移動フレーム、６……爪、７……無端チ
エーン、８……カバー、Ｒ……走行復路、Ｇ……
走行往路。
Fig. 1 is a perspective view of the main parts of the carrier-less automatic soldering device of the present invention, Fig. 2 is a plan view of the carrier-less automatic soldering device of the present invention, and Fig. 3 is the same as Fig. 2-
It is an enlarged view of a line cross section. 1...Fluxer, 2...Preheater, 3...
...Solder bath, 4...Cooler, 5...Fixed frame, 5...Moving frame, 6...Claw, 7...Endless chain, 8...Cover, R...Return trip, G...
Outbound trip.
Claims (1)
等のはんだ付け処理設備の上方に設置された一対
のフレームには、それぞれプリント基板搬走用の
爪を有する無端チエーンが回動し、しかも一方の
フレームはフレーム間隔を調整するために移動可
能となつているキヤリアレス自動はだ付け装置に
おいて、前記移動可能なフレームの爪走行復路に
はフラクサーの上方となるところに爪へのフラツ
クスの付着を防止するカバーが設置されているこ
とを特徴とするキヤリレス自動はんだ付け装置。 A pair of frames installed above soldering processing equipment such as fluxers, preheaters, soldering baths, and cooling machines each have rotating endless chains with claws for transporting printed circuit boards. In a carrierless automatic soldering device that is movable to adjust the frame spacing, a cover is provided above the fluxer on the return path of the movable frame to prevent flux from adhering to the nails. A carrier-less automatic soldering device characterized by being installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8664186U JPS62199260U (en) | 1986-06-09 | 1986-06-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8664186U JPS62199260U (en) | 1986-06-09 | 1986-06-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62199260U true JPS62199260U (en) | 1987-12-18 |
Family
ID=30943135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8664186U Pending JPS62199260U (en) | 1986-06-09 | 1986-06-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62199260U (en) |
-
1986
- 1986-06-09 JP JP8664186U patent/JPS62199260U/ja active Pending
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