JPS63189465U - - Google Patents
Info
- Publication number
- JPS63189465U JPS63189465U JP7781987U JP7781987U JPS63189465U JP S63189465 U JPS63189465 U JP S63189465U JP 7781987 U JP7781987 U JP 7781987U JP 7781987 U JP7781987 U JP 7781987U JP S63189465 U JPS63189465 U JP S63189465U
- Authority
- JP
- Japan
- Prior art keywords
- conveyor chain
- chain carrier
- printed circuit
- circuit board
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 5
- 210000000078 claw Anatomy 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000004907 flux Effects 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Description
第１図は本案に係る自動ハンダ付け装置を示す
側面図、第２図は自動ハンダ付け装置を示す平面
図である。
１０……プリント基板、１１……第１のコンベ
アチエーンキヤリア、１２……第２のコンベアチ
エーンキヤリア、２０……駆動モータ、２３……
無端チエーン、２５……基板保持爪具、１３……
つなぎ部、１４……基板ガイド、１５……フラク
サー、１６……プリヒーター、１８……ハンダ槽
。
FIG. 1 is a side view showing an automatic soldering device according to the present invention, and FIG. 2 is a plan view showing the automatic soldering device. 10... Printed circuit board, 11... First conveyor chain carrier, 12... Second conveyor chain carrier, 20... Drive motor, 23...
Endless chain, 25... Board holding claw tool, 13...
Connecting portion, 14... Board guide, 15... Fluxer, 16... Preheater, 18... Solder bath.
Claims (1)
第１のコンベアチエーンキヤリアと第２のコンベ
アチエーンキヤリアとをプリント基板の移送方向
の前後に配設し、前記第１のコンベアチエーンキ
ヤリアによる基板の移送経路にフラツクスの塗布
を行うフラクサー、予備加熱を行うプリヒーター
を配置すると共に、前記第２のコンベアチエーン
キヤリア側にハンダ槽を配設し、前記第１のコン
ベアチエーンキヤリアから受け渡されたプリント
基板が前記第２のコンベアチエーンキヤリアによ
る移送時に前記ハンダ槽に浸漬されるようにした
ことを特徴とする自動ハンダ付け装置。 A first conveyor chain carrier and a second conveyor chain carrier each having a board holding claw for holding a printed circuit board are disposed before and after the printed circuit board in the transport direction, and the board is transferred by the first conveyor chain carrier. A fluxer for applying flux and a preheater for preheating are arranged in the path, and a solder bath is arranged on the side of the second conveyor chain carrier, and the printed circuit board is transferred from the first conveyor chain carrier. The automatic soldering device is characterized in that the soldering device is immersed in the soldering bath during transfer by the second conveyor chain carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7781987U JPS63189465U (en) | 1987-05-23 | 1987-05-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7781987U JPS63189465U (en) | 1987-05-23 | 1987-05-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63189465U true JPS63189465U (en) | 1988-12-06 |
Family
ID=30926185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7781987U Pending JPS63189465U (en) | 1987-05-23 | 1987-05-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63189465U (en) |
-
1987
- 1987-05-23 JP JP7781987U patent/JPS63189465U/ja active Pending
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