JPS61167266U - - Google Patents
Info
- Publication number
- JPS61167266U JPS61167266U JP4833085U JP4833085U JPS61167266U JP S61167266 U JPS61167266 U JP S61167266U JP 4833085 U JP4833085 U JP 4833085U JP 4833085 U JP4833085 U JP 4833085U JP S61167266 U JPS61167266 U JP S61167266U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- fluxer
- preheater
- conveyor
- vertical movement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 7
- 230000007246 mechanism Effects 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 230000004907 flux Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Molten Solder (AREA)
Description
第１図は本考案の自動はんだ付け装置の一実施
例を示す正面図、第２図はその側面図、第３図は
その要部の正面図、第４図はその側面図、第５図
はその上下動用シリンダの配置関係を示す説明図
である。
２……はんだ付け物、４……フラクサ、５……
プリヒータ、７……はんだ槽、１１……コンベヤ
、１２……エンドレスチエン、１３……移動基板
、１４……上下動機構としてのシリンダ、１５…
…チヤツクベース、１６……チヤツク機構。
Fig. 1 is a front view showing one embodiment of the automatic soldering device of the present invention, Fig. 2 is a side view thereof, Fig. 3 is a front view of its main parts, Fig. 4 is a side view thereof, and Fig. 5 FIG. 2 is an explanatory diagram showing the arrangement relationship of the vertical movement cylinders. 2...Soldering material, 4...Fluxer, 5...
Preheater, 7... Solder bath, 11... Conveyor, 12... Endless chain, 13... Moving board, 14... Cylinder as vertical movement mechanism, 15...
...Chuck base, 16...Chuck mechanism.
Claims (1)
、フラクサによりフラツクス付けを行ない、プリ
ヒータにより予加熱を行ない、はんだ槽によりは
んだ付けを行なう自動はんだ付け装置において、
上記コンベヤは、上記フラクサ、プリヒータおよ
びはんだ槽に沿つてエンドレスチエンを設けると
ともに、このエンドレスチエンにて搬送される移
動基板を移動自在に設け、この移動基板に独立に
作動可能の複数の上下動機構を設け、この複数の
上下動機構の下端部によりチヤツクベースを傾動
可能に支持し、このチヤツクベースに、はんだ付
け物保持用のチヤツク機構を設けてなることを特
徴とする自動はんだ付け装置。 In an automatic soldering device that fluxes soldering objects transported by a conveyor using a fluxer, preheats them using a preheater, and performs soldering using a soldering bath,
The conveyor is provided with an endless chain along the fluxer, preheater, and solder bath, and is provided with a movable substrate that is conveyed by the endless chain, and has a plurality of vertical movement mechanisms that can be operated independently on the movable substrate. , a chuck base is tiltably supported by the lower ends of the plurality of vertical movement mechanisms, and the chuck base is provided with a chuck mechanism for holding soldering objects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4833085U JPS61167266U (en) | 1985-04-01 | 1985-04-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4833085U JPS61167266U (en) | 1985-04-01 | 1985-04-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61167266U true JPS61167266U (en) | 1986-10-17 |
Family
ID=30564484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4833085U Pending JPS61167266U (en) | 1985-04-01 | 1985-04-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61167266U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5383948A (en) * | 1976-12-29 | 1978-07-24 | Pioneer Electronic Corp | Method of soldering print wiring plate and its device |
-
1985
- 1985-04-01 JP JP4833085U patent/JPS61167266U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5383948A (en) * | 1976-12-29 | 1978-07-24 | Pioneer Electronic Corp | Method of soldering print wiring plate and its device |
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