JPS6116920Y2 - - Google Patents
Info
- Publication number
- JPS6116920Y2 JPS6116920Y2 JP13019681U JP13019681U JPS6116920Y2 JP S6116920 Y2 JPS6116920 Y2 JP S6116920Y2 JP 13019681 U JP13019681 U JP 13019681U JP 13019681 U JP13019681 U JP 13019681U JP S6116920 Y2 JPS6116920 Y2 JP S6116920Y2
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- circuit board
- transport direction
- molten solder
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 17
- 238000005476 soldering Methods 0.000 claims description 5
- 230000004907 flux Effects 0.000 description 6
- 230000007547 defect Effects 0.000 description 3
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【考案の詳細な説明】
本考案は自動はんだ付け装置、特に回路基板の
溶融はんだへの浸漬により発生したフラツクスガ
スを確実に除去して、はんだもれ等の不良を削減
するための改良に関する。[Detailed Description of the Invention] The present invention relates to an automatic soldering device, and particularly to an improvement for reliably removing flux gas generated by immersing a circuit board in molten solder to reduce defects such as solder leakage.
従来の自動はんだ付け装置は、キヤリアに固定
された回路基板をはんだ槽の溶融はんだに浸漬さ
せて、キヤリアは搬送方向に直線的に移送されて
いる。このキヤリアの直線的移送は、回路基板に
対して一方向の溶融はんだの流れを形成するにす
ぎず、チツプ電子部品の前面および後面と回路基
板とで構成される隈のフラツクスガス等は除去さ
れにくく、除去されないフラツクスガスによつて
はんだもれ等の不良が発生しやすいものであつ
た。 In a conventional automatic soldering device, a circuit board fixed to a carrier is immersed in molten solder in a solder bath, and the carrier is linearly transported in a transport direction. This linear transfer of the carrier only forms a unidirectional flow of molten solder toward the circuit board, and it is difficult to remove flux gas, etc. in the areas between the front and rear surfaces of the chip electronic components and the circuit board. However, defects such as solder leakage were likely to occur due to flux gas that was not removed.
本考案はかかる従来技術の欠点を改良するため
になされたもので、キヤリアを搬送方向の移動
と、この搬送方向に対して横方向の移動と、を行
なわしめて、回路基板に対して複数方向の溶融は
んだの流れを形成して、フラツクスガスの除去を
確実なものとしたことを特徴とする。以下本考案
の一実施例を示す図を参照して説明する。１は溶
融はんだ槽、２はキヤリアガイド、３はキヤリア
である。キヤリアガイド２は矢印Ａの搬送方向に
対してポイントｏ，ｐ，ｑ，ｒで横方向に屈折し
ている。即ち、ポイントｏまでは搬送方向Ａで移
動し、ポイントｏからｐの間は横方向Ｂと搬送方
向Ａとが合成された斜方向に移動し、ポイントｐ
からｑの間は逆の横方向Ｃと搬送方向Ａとが合成
された別の斜方向に移動し、ポイントｑからｒの
間は横方向Ｂと搬送方向Ａとの合成された斜方向
に移動される。したがつて、回路基板は搬送方向
Ａと横方向Ｂ，Ｃとの溶融はんだの流れを受ける
ことになり、チツプ電子部品の前面および後面に
滞留せるフラツクスガスが横方向の溶融はんだの
流れで除去される。 The present invention was made to improve the drawbacks of the prior art, and it moves the carrier in the transport direction and in the lateral direction with respect to the transport direction, thereby moving the carrier in multiple directions relative to the circuit board. It is characterized by forming a flow of molten solder to ensure the removal of flux gas. An embodiment of the present invention will be described below with reference to the drawings. 1 is a molten solder bath, 2 is a carrier guide, and 3 is a carrier. The carrier guide 2 is bent laterally at points o, p, q, and r with respect to the transport direction of arrow A. That is, it moves in the transport direction A to point o, moves in the diagonal direction that is a combination of lateral direction B and transport direction A from point o to p, and then moves to point p.
Between points q and q, it moves in another diagonal direction that is a combination of the opposite lateral direction C and transport direction A, and between points q and r it moves in a diagonal direction that is a combination of lateral direction B and transport direction A. be done. Therefore, the circuit board receives the flow of molten solder in the transport direction A and the lateral directions B and C, and the flux gas that remains on the front and rear surfaces of the chip electronic components is removed by the lateral flow of molten solder. Ru.
なお、図示せる実施例はキヤリアガイドを屈折
して斜に形成するが、これに限られることなく、
キヤリアガイドを曲線で形成してもよく、さらに
は、搬送方向Ａへの移動と横方向Ｂ，Ｃへの移動
とをそれぞれ別個に行なわしめてもよい。 Note that in the illustrated embodiment, the carrier guide is bent and formed obliquely, but the invention is not limited to this.
The carrier guide may be formed in a curved line, and furthermore, the movement in the transport direction A and the movement in the lateral directions B and C may be performed separately.
以上説明した所から明らかなように本考案によ
れば、回路基板は搬送方向のみならず横方向から
も溶融はんだの流れを受けるために、フラツクス
ガスの除去が確実であり、はんだもれ等の不良発
生を削減できる。 As is clear from the above explanation, according to the present invention, since the circuit board receives the flow of molten solder not only in the transport direction but also in the lateral direction, flux gas can be reliably removed and defects such as solder leakage can be avoided. occurrence can be reduced.
図は本考案の一実施例を示す自動はんだ付け装
置の骨格的平面図である。
１……溶融はんだ槽、２……キヤリアガイド、
３……キヤリア、Ａ……搬送方向、Ｂ，Ｃ……横
方向。
The figure is a skeletal plan view of an automatic soldering device showing an embodiment of the present invention. 1... Molten solder bath, 2... Carrier guide,
3...Carrier, A...Transportation direction, B, C...Transverse direction.
Claims (1)
よりキヤリアに固定された回路基板がはんだ槽の
溶融はんだに浸漬されて回路基板のはんだ付けを
行なう自動はんだ付け装置において、回路基板を
溶融はんだに浸漬させた状態でキヤリアを搬送方
向への移動と、搬送方向に対して横方向の移動と
を行なわしめるよう上記キヤリアガイドを横方向
へ曲げたことを特徴とする自動はんだ付け装置。 A state in which the circuit board is immersed in molten solder in an automatic soldering machine in which the circuit board fixed to the carrier is dipped in molten solder in a solder bath by being transported by a carrier guided by a carrier guide to solder the circuit board. An automatic soldering device characterized in that the carrier guide is bent in the lateral direction so that the carrier can be moved in the transport direction and moved in the lateral direction with respect to the transport direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13019681U JPS5834769U (en) | 1981-09-01 | 1981-09-01 | automatic soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13019681U JPS5834769U (en) | 1981-09-01 | 1981-09-01 | automatic soldering equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5834769U JPS5834769U (en) | 1983-03-07 |
| JPS6116920Y2 true JPS6116920Y2 (en) | 1986-05-24 |
Family
ID=29923838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13019681U Granted JPS5834769U (en) | 1981-09-01 | 1981-09-01 | automatic soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5834769U (en) |
-
1981
- 1981-09-01 JP JP13019681U patent/JPS5834769U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5834769U (en) | 1983-03-07 |
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