JPS59186394A - Holder for ic - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] In this invention, an IC is held in a holder of a carrier.

This relates to an IC holder that performs preliminary soldering to IC lead terminals.

As is well known, it prevents oxidation of IC lead terminals and
In order to easily and reliably solder the flint board after forming grooves on it, the lead terminals are soldered in advance and then cleaned.

By the way, conventionally, when soldering and cleaning the lead terminals of an IC, in order to hold the IC in a carrier, the IC was held in a hook of a hanger forming a holder of the carrier and hung.

For this reason, when the IC lead terminals are immersed in solder melt to attach solder, or when cleaning 1 is performed by spraying cleaning liquid, the IC moves and becomes unstable, causing it to come off the hook of the hanger and fall off. Something happened. As a result, ICs that have fallen off the hanger may fall into the solder melt and be heated, or may fall into the cleaning solution and be damaged, making them unusable, resulting in economic losses in terms of IC management.

This invention was made in order to eliminate the above-mentioned drawbacks, and provides an IC holder that has a stable holding force that prevents the IC from falling off even when the carrier is moved when the IC is held in the holder of the carrier. This is what we provide. This invention will be explained below.

FIGS. 1(a), (b), and (c) show an embodiment of the present invention; FIG. 1(a) is a partial plan view;
FIGS. 1(b) and 1(c) are a front view and a side view of FIG. 1(a).

In these figures, 1 is a carrier, 2 is a frame of the carrier 10, 3 is a handle for carrying the carrier 1, 4 is a wheel with a collar, 5 is a wheel for guiding the wheel 4, 6 is a wheel, and 7 is a handle for carrying the carrier 1. 8 is the wheel on which the wheel 6 rolls, and 8 is the lead terminal of the IC 19. Reference numeral 10 denotes a holder which represents the main part of the present invention, and is mounted on and holds the IC 8, and is attached below the frame 2 (indicated by the two-dot chain line) as shown in FIG. 11 is a long table piece on which the IC 8 is placed;
It is made of ceramic, a heat-resistant synthetic resin, or a metal material coated with a heat-resistant synthetic resin, etc., to which the solder melt will not adhere (and which will not be corroded by the cleaning solution). It is a square-shaped engagement piece, made of the same material as the base piece 11, and has a gap between its lower surface and both side surfaces on the lead terminal 9 side of the IC 8, as shown in FIG. An engagement groove 13 is formed.1
Reference numeral 4 denotes a long holding piece made of a metal material for attaching and holding the engaging piece 12, and the direction of its longitudinal force or the traveling direction of the carrier 10 (the direction indicated by the arrow in FIGS. 1(a) and 2) is ) is fixed to the lower surface of the frame 2 by screws or welding, and an engaging piece 12 (not shown in FIG. 3) is located in the groove 14a below the holding piece 14. It is attached with screws 15 as shown in FIG. 16 is a mounting fixture, its upper part 1
6a is integrally fixed to both ends of the holding piece 14 in the longitudinal direction by welding or the like, and in the groove 16b below, both ends of the stand piece 11 in the longitudinal direction are fixed to the engagement piece 120 at a predetermined distance with screws 1T. and fix it. 7, the engaging piece 12 and the holding piece 14 are not separate parts (they may be integrated, but in this case, a metal material coated with a heat-resistant synthetic resin is used. .

Next, the operation will be explained.

The IC 8 is inserted into the holder 10 automatically by an automatic insertion device (not shown) or directly by hand, and placed on the base piece 11. The IC 8 moves while sliding on the base piece 11 and is guided by the retainer @ 13, and the IC 8 at the tip comes into contact with a stopper such as a protrusion or a guard (not shown) and stops.

In this way, the carrier 1 with the ICs 8 sequentially attached to the holder 1o is moved to the knoll 5 by the drive of a conveyor chino (not shown).
．． The vehicle travels on the road in the direction of arrow A in FIG. 1(a). Next, it is soldered to the lead terminal 9 with solder paste, and then
Transported to cleaning equipment.

Then, in the cleaning device, the cleaning liquid is sprayed upward (in the direction of arrow B) as shown in FIG. Since a gap is created and the cleaning liquid can easily pass through, the lower surface of the IC 8 can also be thoroughly cleaned.

By providing a stopper such as a bottle or a lid on the side where the IC 8 is inserted into the holder 10, it is possible to prevent the ICl 3 from falling off when the carrier 10 moves.

Furthermore, the holder 1o according to this embodiment can be used not only when soldering the lead terminals 9 of the IC 8, but also when soldering a large number of ICs.
It can also be used in a device that transports C8 in bulk.

Furthermore, the shape of the holder 1o is not limited to that shown in the drawings (although it is possible to produce any shape within the scope of the gist of the present invention).

As explained above, the present invention provides an elongated table having an engagement groove having a gap between the elongated table piece on which an IC is placed and the upper surface of the IC and the side surface on the side having lead terminals. Since the IC holder is formed by the engaging piece and the fixture that fixes the base piece and the engaging piece together at a predetermined interval, when pre-soldering the lead terminals of the IC, Moreover, even after cleaning with a cleaning liquid, the IC does not fall off from the holder, and a stable holding force can be obtained even when the holder is moved. In addition, when cleaning the IC by spraying the cleaning liquid upward, the IC floats up and the top surface of the IC contacts the retaining groove, creating a gap between the bottom surface of the IC and the top surface of the stand. The lower surface can be well cleaned, and furthermore, since the IC does not fall off during transportation, economic losses due to damage or loss can be prevented.

[Brief explanation of the drawing]

FIGS. 1(a), (b), and (c) show an embodiment of the present invention; FIG. 1(a) is a partial plan view;
Figures 1(b) and (c) are front and side views of Figure 1 (C&), Figure 2 is an enlarged perspective view of the main parts of Figure 1, and Figure 3 is ), enlarged cross-sectional view taken along line x-x, 4th
The figure is an explanatory diagram showing a state in which the IC is floating. In the figure, 1 is a carrier, 2 is a frame body, 8 is an IC, 9 is a lead terminal, 10 is a holder, 11 is a stand piece, 12 is an engagement piece, 13
14 is an engagement groove, 14 is a holding piece, 15°1γ is a screw, and 16 is a fitting. Figure 1 (C)] 6 Figure 2 Figure 3 Figure 4

Claims (1)

[Claims] An elongated engagement that forms an engagement with a gap between an elongated table piece on which an IC is placed and the upper surface of the IC and the side surface of the side having lead terminals. With a piece. I characterized in that it consists of a mounting piece in which the base piece and the retaining piece are fixed together at a predetermined interval, respectively.
Holder for C.