JPH0157991B2 - - Google Patents

Description

[Detailed Description of the Invention] This invention holds the IC in a carrier holder and performs preliminary soldering to the lead terminals of the IC.
This relates to an IC holder.

As is well known, in order to prevent oxidation of the IC lead terminals and to facilitate and ensure soldering after mounting the IC on a printed circuit board, the lead terminals must be soldered in advance and then cleaned. It's on.

By the way, conventionally, when soldering and cleaning the lead terminals of an IC, in order to hold the IC in a carrier, the IC was hung by being held in the claws of a hanger that constitutes a holder of the carrier.

For this reason, when the IC lead terminals are immersed in solder melt to attach solder, or when cleaning is performed by spraying a cleaning solution, the IC moves and becomes unstable, causing it to come off the hook of the hanger and fall off. Something happened. As a result, it fell off the hanger.
ICs fall into the solder melt and become heated, or fall into the cleaning solution and are damaged, making them unusable, resulting in economic losses in terms of IC management.

This invention was made in order to eliminate the above-mentioned drawbacks, and provides an IC holder that has a stable holding force that prevents the IC from falling off even when the carrier is moved when the IC is held in the carrier holder. This is what we provide. This invention will be explained below.

FIGS. 1a, b, and c show an embodiment of the present invention. FIG. 1a is a partial plan view, and FIGS. 1b and c are a front view and a side view of FIG. 1a. In these figures, 1 is a carrier, 2 is a frame of the carrier 1, 3 is a handle for carrying the carrier 1,
4 is a wheel with a flange, 5 is a rail for guiding the wheel 4, 6 is a wheel, 7 is a rail on which the wheel 6 rolls, 8 is an IC, and 9 is a lead terminal. Reference numeral 10 denotes a holder which represents the main part of the present invention, and is mounted on and holds the IC 8, and is attached below the frame 2 (indicated by the two-dot chain line) as shown in FIG. Reference numeral 11 denotes a long table piece on which the IC 8 is placed, and is made of ceramic or heat-resistant synthetic resin, or metal material and heat-resistant synthetic resin, to which melted solder does not adhere and which is not corroded by cleaning liquid. It is formed of a coated material, etc. Reference numeral 12 denotes a long engagement piece, which is made of the same material as the base piece 11, and has an IC on its bottom surface as shown in FIG.
An engagement groove 13 having a gap is formed between both side surfaces of the lead terminal 9 and the lead terminal 9 side. Reference numeral 14 denotes a long holding piece made of a metal material for attaching and holding the engaging piece 12, and its longitudinal direction is the traveling direction of the carrier 1 (direction of arrow A in FIG. 1A and FIG. 2).
It is fixed to the lower surface of the frame 2 by screws or welding so as to be perpendicular to the lower surface of the frame 2, and an engaging piece 12 is attached to the lower groove 14a of the holding piece 14 with a screw 15 as shown in FIG. ing. 16
is a mounting tool, the upper part 16a of which is fixed integrally with both longitudinal ends of the holding piece 14 by welding, etc., and the lower groove part 16b has an engaging piece attached to both longitudinal ends of the stand piece 11 with screws 17. 12 while maintaining a predetermined interval. Note that the engagement piece 12 and the holding piece 14 may not be separate parts but may be integrated. In this case, a metal material coated with a heat-resistant synthetic resin is used.

Next, the operation will be explained.

The IC 8 is inserted into the holder 10 automatically by an automatic insertion device (not shown) or directly by hand, and placed on the base piece 11. The IC 8 moves while sliding on the base piece 11 and is guided by the engagement groove 13, and the IC 8 at the tip comes into contact with a stopper such as a protrusion or a lid (not shown) and stops.

In this way, the carrier 1 with the ICs 8 sequentially attached to the holder 10 travels on the rails 5 and 7 in the direction of arrow A in FIG. 1a by the drive of a conveyance chain (not shown). Next, it is soldered to the lead terminal 9 in a solder bath, and then transported to a cleaning device.
Then, in the cleaning device, the cleaning liquid is sprayed upward (in the direction of arrow B) as shown in Figure 4.
The IC 8 floats and the upper part of the IC 8 comes into contact with the engagement groove 13, creating a gap between the IC 8 and the table piece 11, allowing the cleaning liquid to pass through, so that the lower surface of the IC 8 can also be thoroughly cleaned.

In addition, on the side where the IC 8 is inserted into the holder 10,
By providing a stopper such as a pin or a lid,
It is possible to prevent the IC 8 from falling off due to the movement of the carrier 1.

Further, the holder 10 according to this embodiment can be used not only for soldering the lead terminals 9 of the ICs 8, but also for a device that transports a large number of ICs 8 at once.

Further, the shape of the holder 10 is not limited to that shown in the drawings, and various shapes can be manufactured within the scope of the gist of the present invention.

As explained above, the present invention provides an elongated table having an engagement groove having a gap between the elongated table piece on which the IC is placed and the top surface of the IC and the side surface on the side having the lead terminals. Since the IC holder is formed by the engaging piece and the fixture that fixes the base piece and the engaging piece together at a predetermined distance, it is easy to use when pre-soldering the lead terminals of the IC. The IC does not fall off the holder even when cleaned with a cleaning solution, and stable holding power can be obtained even when the holder is moved. Also, when cleaning the IC by spraying the cleaning liquid upward, the IC may float up.
The top surface of the IC comes into contact with the engagement groove, and a gap is created between the bottom surface of the IC and the top surface of the stand, so the bottom surface of the IC can also be thoroughly cleaned.Furthermore, since the IC does not fall off during transportation, It has advantages such as being able to prevent economic losses due to breakage or powder loss.

[Brief explanation of drawings]

Figures 1a, b, and c show an embodiment of the present invention; Figure 1a is a partial plan view, Figures 1b and c are a front view and side view of Figure 1a, and Figure 2 is a partial plan view. is an enlarged perspective view of the main part of Fig. 1, and Fig. 3 is an enlarged perspective view of the main part of Fig. 1b.
- An enlarged cross-sectional view taken by X-rays, and FIG. 4 is an explanatory diagram showing a floating state of the IC. In the diagram, 1 is the carrier, 2 is the frame, 8 is the IC, and 9
is a lead terminal, 10 is a holder, 11 is a stand piece, 12
is an engagement piece, 13 is an engagement groove, 14 is a holding piece, 15,
17 is a screw, and 16 is a fixture.

Claims (1)

[Claims] 1. An elongated platform piece on which an IC is placed, and an elongated engagement piece in which an engagement groove having a gap is formed between the top surface of the IC and the side surface on the side having the lead terminal;
1. A holder for an IC, characterized in that the IC holder comprises a fixture that fixes the base piece and the engagement piece together with a predetermined distance between each other.