JPH0785834B2 - Jig for soldering - Google Patents

Description

TECHNICAL FIELD The present invention relates to a soldering jig used in the process of manufacturing an electronic component mounting board having conductor pins, which is a so-called pin grid array, and in particular, to a soldering jig. The present invention relates to a soldering jig capable of performing soldering with high quality and high work efficiency while carrying a plurality of electronic component mounting boards in a predetermined array in an inclined jet soldering device while carrying them. .

(Prior Art) An inclined jet type soldering device used for soldering a general printed circuit board is widely used as a device that does not require a transfer jig or the like and can be mass-produced. This inclined jet type soldering device
As shown schematically in FIG. 6, the molten solder is jetted by a pump with a constant width and height, and the printed circuit board directly gripped by the device is brought into contact with the molten solder surface at a constant speed. Although the structure is such that soldering is performed by passing it through, the transfer claws attached to the transfer conveyor of the device for supporting the printed circuit board directly transfer the board at both ends of 3 to 4 mm. Therefore, it is inevitable that the printed board side needs a grip allowance for the transfer claw.

However, in many electronic component mounting boards that have been adopted in recent years, in order to achieve high-density mounting and downsizing, the conductor pins that are driven into the board are located around the board, and a board gripping margin is obtained. It has no shape. For this reason, it is impossible to directly convey the printed circuit board by a conveyer, and in order to make this possible, a soldering jig suitable for this is required.

The soldering jig that has been used in the past is used not for electronic component mounting boards for achieving high-density mounting and miniaturization as described above, but for small-sized boards, and its main purpose is transportation. Therefore, even when using the soldering jig that has been used in the past, it is not possible to perform uniform soldering, and it is not suitable for high-density mounting and miniaturization of electronic component mounting boards. It was

(Problems to be Solved by the Invention) The present invention has been made in view of the above circumstances, and a problem to be solved by the invention is soldering of a board for mounting electronic components, which has been made high in density and downsized. It is an incomplete support when attaching.

And, it is an object of the present invention that even a high-density and downsized electronic component mounting substrate can be reliably supported and transported in an inclined jet soldering device for soldering to this. What is needed is, of course, to provide a soldering jig capable of improving the quality of such a high-density and downsized electronic component mounting board and improving the soldering efficiency.

(Means for Solving Problems) Means adopted by the present invention for solving the above problems are
This will be described with reference to FIGS. 1 to 3 corresponding to the embodiment. “In a jig for soldering to a conductor pin (31) of an electronic component mounting board (30), this jig is a board (30 ) Is mounted on the lower side surface of the opening, and conductor pins (3
This is a soldering jig (100) characterized by having walls (12) and (13) having a height not less than the length of 1).

That is, the soldering jig (100) according to the present invention
Is an electronic component mounting board (3
0) not only for reliable transport, but for the purpose of satisfying the high quality specifications required for soldering, that is, for the opening (14) of the jig plate (10). By constructing the lower front side and the walls (12) and (13) on both sides, avoiding icicles and ensuring uniform solder wettability,
It also enables soldering that meets specifications such as solder rising onto the upper surface of the board.

Also, "The opening (14) of the soldering jig (100)
The soldering jig (100) is designed so that a plurality of electronic component mounting boards (30) can be mounted in succession.
4) Hold the board holding claws (11) formed on the periphery of the jig plate (1
It is possible to make soldering with good work efficiency by making the soldering conditions of each board (30) constant by forming it integrally with (0) and mounting multiple boards (30) continuously (adjacent state) It is what

(Operation of the Invention) The present invention adopts the above-mentioned means and has the following operation.

First, the wall (12), which is longer than the conductor pin (31) provided on the front side of the lower surface of the opening (14) in the traveling direction of the jig (10),
An oxide film on the surface of the molten solder that contacts the conductor pins (31) before entering the jet solder bath before the electronic component mounting board (This cannot be completely removed only by the flux that is attached before transporting into the jet solder bath) Stuff) is forcibly removed.

Next, by the walls (13) longer than the conductor pins (31) provided on both sides of the lower surface of the opening (14) of the jig (10), the flux adhered to the portion between these two walls (13) is removed. Board (30)
Of the conductor pin (31) is in contact with the solder surface, in particular, the part where the conductor pin (31) is separated from the solder (this part is usually called a peel back point).

Furthermore, the conductor pins (31) of the plurality of boards (30) are arranged by successively inserting the plurality of boards (30) in the shape of the opening (14) into which the boards (30) are inserted. The spacing becomes constant or nearly constant, and the soldering conditions of the plurality of substrates (30) become constant.

Hereinafter, the present invention will be described in detail based on the embodiments shown in the drawings.

(Example) The soldering jig (100) of the present invention is intended for an electronic component mounting substrate (30) called a so-called pin grid array, and as shown in FIG. A large number (plurality) of conductor pins (31) are planted. The conductor pin (31) is very small (the diameter is about 0.5 mm and the length is about several mm) because the substrate (30) on which it is implanted is small. 2.54 mm The pitch is extended to the periphery of the substrate (30), and there is almost no space for grasping the periphery of the substrate (30).

As shown in FIGS. 1 to 4, the soldering jig (100) has an opening (14) for mounting the substrate (30) at a substantially central portion thereof. The soldering jig (100) is provided on the lower surface of the opening (14) with conductor pins (3
It has walls (12) and (13) that are higher than the length of 1).
That is, the soldering jig (100) does not have a wall formed only on the lower side surface of the opening (14) and on the rear side with respect to the transport direction.

Around the opening (14) formed in the soldering jig (100), as shown in FIG. 1, stepped portions which are the board holding tabs (11) are continuously formed. The substrate holding claw portion (11) is for supporting the end portion of the substrate (30). That is, if the end portions of the board (30) are placed on the board holding claw portion (11), each board (30) is reliably supported by the soldering jig (100). further,
Opening (14) formed in this soldering jig (100)
Is sized to support a plurality of substrates (30) shown in FIG. That is, this opening (14) is formed to be long in the front-rear direction (in this embodiment, as shown in FIG. 3, six substrates (30) can be continuously arranged). The length of the substrate holding claw portion (11) is also lengthened accordingly.

On the other hand, in the inclined jet type soldering apparatus as shown in FIG. 6, a board transfer conveyor (chain transfer) is attached to the inside thereof, and the board (30) is attached to the transfer conveyor. Conveyor claws with engraved grooves are attached at a pitch of 25.4 mm, for example. Therefore, in the inclined jet type soldering apparatus as shown in FIG. 6, both ends of the substrate (30) are held by the groove portions of the transfer claw, and the jet pump has a constant width and a constant height. The molten solder surface jetted onto the surface is passed at a constant speed for soldering. Here, in order to transfer the substrate with the transfer claw,
Usually, a grip margin of 3 to 4 mm is required at both ends of the substrate, and it was impossible to directly convey the substrate (30) having no such grip margin.

Therefore, even in such an inclined jet soldering apparatus, the soldering jig (100) according to the present invention is used and the end portion of the jig (100) is grasped and held by the above-mentioned transport claws. By doing so, both ends of the substrate (30) are 0.5 mm in terms of transportation and handling which are performed in soldering of the highly dense and miniaturized electronic component mounting substrate (30) recently used.
At the opening (14) that has a substrate holding claw (11)
A plurality of boards (30) are mounted in an adjacent (continuous) array on the board holding claws (11), and a soldering jig (1
Both ends of (0) are held by the transfer claws of the inclined jet type soldering device, so that the substrate (30) can be transferred indirectly.

FIG. 3 is a vertical cross-sectional view showing a state in which the electronic component mounting board (30) having such a high density and downsizing is mounted on the soldering jig (100) according to the present invention. is there. In this state, the soldering jig (100) is put into a jetted solder bath to solder the electronic component mounting board (30).

(Effects of the Invention) As described in detail above, in the soldering jig according to the first aspect of the invention, in the jig for soldering to the conductor pin (31) of the electronic component mounting board (30), The jig has an opening (14) for mounting the substrate (30), and the jig has conductor pins on the lower side surface of the opening on the front side and both sides with respect to the transport direction. (3
The feature is that it has walls (12) and (13) that are at least as long as the length of 1). The wall (12) forcibly removes the oxide film on the solder surface that contacts the pins. It is possible to avoid the occurrence of flicker and the like. Further, the flux adhered to the portion between the walls by the wall (13) is supplied to the solder surface with which the conductor pin (31) comes into contact (especially at the peelback when the conductor pin (31) separates from the solder), Solder is evenly applied to the surface of the pin, and it is possible to avoid the occurrence of flicker.

In other words, even if the soldering jig (100) is a high-density and downsized electronic component mounting board, it can be reliably supported in an inclined jet soldering device for soldering Of course, it is possible to carry it, and it is possible to improve the quality of this kind of high-density and downsized electronic component mounting board and to improve the soldering efficiency.

Furthermore, by rectifying the solder jet in the soldering area surrounded by the two walls (13) and blocking the disturbance of the solder jet outside the area, a soldering jig (20) that satisfies high quality is provided. ) Can be provided.

In addition, "Open the opening (14) of the soldering jig (100)
In the case where a plurality of electronic component mounting boards (30) are mounted consecutively, "by mounting a plurality of boards continuously, the arrangement interval of the conductor pins of each of the plurality of boards is increased. It becomes a constant or nearly constant condition, the soldering conditions for multiple boards become constant, and variations in the soldering quality of each board can be reduced, so of course the board (30) is transported and high quality It is possible to provide a soldering jig (100) that enables the soldering of.

[Brief description of drawings]

FIG. 1 is a perspective view of the soldering jig as viewed from the upper side, FIG. 2 is a perspective view showing a wall attached to the lower surface of the jig, and FIG. 3 is mounting a plurality of electronic component mounting boards. 1 is a vertical cross-sectional view taken along the line AA of FIG. 1, and FIG. 4 is B of FIG.
FIG. 5 is a vertical cross-sectional view of the line B part, FIG. 5 is a perspective view of the electronic component mounting board, and FIG. Explanation of code 100 …… Soldering jig, 10 …… Jig plate, 11 …… Board holding tab, 12 …… Wall, 13 …… Wall, 14 …… Opening, 30…
… Electronic component mounting board, 31 …… Conductor pins.

Claims (2)

[Claims] 1. A jig for soldering to a conductor pin of an electronic component mounting board, wherein the jig has an opening for mounting the board, and the jig has a lower side surface of the opening. A soldering jig, characterized in that it has a wall having a height equal to or greater than the length of the conductor pin on each of the front side and both sides with respect to the carrying direction. 2. The soldering jig according to claim 1, wherein a plurality of electronic component mounting boards are continuously mounted on the opening of the jig. .