JPS6116924Y2 - - Google Patents

Description

[Detailed Description of the Invention] This invention relates to an apparatus for soldering lead wires derived from electronic components.

Normally, various processing steps are required in the manufacture of electronic components such as transistors and ICs. For example, as shown in FIG. 1, there is a lead processing process in which metal members, such as lead wires 3, led out from the resin-molded main body 2 of an electronic component 1 are soldered and finished one by one. If you do so, the workability will be very poor. For this reason, conventionally, as shown in FIGS. 2 and 3, a turntable 5 which rotates intermittently in the direction of the arrow and which has slits 4 arranged around the circumference, and a parts feeder 6 consisting of a ball-type vibration device are used as a linear feeder 7. When the turntable 5 is stopped, a plurality of electronic components 1, which are sequentially supplied from the parts feeder 6 and sent to the linear feeder 7, are suspended and held in the slit 4, and soldered by the intermittent rotation of the turntable 5. When the solder tank 8 is sent to a certain position, the solder tank 8 is raised and the lead wire 3 of the electronic component 1 is immersed in the solder liquid 9 in the solder tank 8. After a certain period of time, the solder finish is completed.

However, the above-mentioned solder finishing apparatus requires a turntable 5 and requires the solder tank 8 to be moved up and down, resulting in a problem of increased installation size. Furthermore, since the lead wires 3 of the electronic component 1 are not sufficiently preheated and are immersed in the solder liquid 9 in the solder bath 8, the solder finish is not uniform. In addition, the surface of the lead wire 3 of the electronic component 1 is coated with, for example, Sn plating for the purpose of improving the solder finish, but when this Sn plating oxidizes, a solder layer is formed on the surface of the lead wire 3. In some cases, the soldering process could not be performed properly, which required many man-hours to remove the oxide film.

This invention improves and eliminates the above-mentioned conventional drawbacks, and provides an apparatus that applies solder to the surface of a lead wire while transporting an electronic component. An example in which this invention is applied to an apparatus for forming a solder layer on the lead wire 3 of the electronic component 1 will be described below with reference to FIGS. 4 to 6.

4 to 6, reference numeral 10 denotes a linear feeder, which has an inclined rail 11 for holding the electronic component 1 in a suspended state. At the upper end of this rail 11, there is a parts feeder 1 made of, for example, a Syntron device.
2 are connected. The electronic component 1 is supplied from the parts feeder 12 to the upper end of the rail 11, and is then transported by its own weight on the rail 11 using the vibration effect unique to the linear feeder 10. Reference numeral 13 denotes a soldering finishing chamber disposed in the middle of the rail 11 of the linear feeder 10. The soldering finishing chamber 13 is surrounded by the rail 11 so as not to interfere with the sliding of the electronic component 1 on the rail 11, and the interior is kept in a high temperature state. The electronic component 1 is conveyed through the high temperature section. A solder bath 14 is disposed within this solder finishing chamber 13, and as shown in FIG. The lead wires 3 of the electronic component 1 are sequentially immersed in the solder liquid 15 in the solder bath 14 starting from their lower ends.
The bottom of the lower end and the upper end of the solder tank 14 are connected to a communicating pipe 16.
The solder liquid 15 is circulated from the bottom of the lower end to the upper end through the communication pipe 16 by the pump 17 provided in the middle of the communication pipe 16, and as a result, the solder liquid 15 flows through the solder tank 14 electronically. It circulates in the same direction as the part 1 conveyance direction. In this case, since the solder tank 14 is arranged in an inclined manner as shown in FIG. 5, the depth of the solder liquid 15 gradually becomes deeper from the upper end of the solder tank 14 to the lower end.
In the drawing, 18 indicates a motor for operating the pump 17, 19 indicates a flow rate adjustment hole, and 20 indicates a flow rate adjustment orifice.

Using the above-mentioned apparatus, this invention finishes the lead wire 3 of the electronic component 1 with solder as follows. First, the electronic components 1 are transferred from the parts feeder 12 to the straight feeder 1.
It is supplied in a suspended state from the upper end of the rail 11 of No. 0. Then, this electronic component 1 is transferred to the linear feeder 10
It slides on the rail 11 under its own weight due to the vibration action of
It is transported to a solder finishing room 13 located midway along the rail 11. Here, the lead wire 3 of the electronic component 1 is preheated by the internal temperature of the soldering finishing chamber 13, and then as it is transported on the rail 11, the lead wire 3 of the electronic component 1 is transferred to the solder tank 1.
The solder liquid 1 in the solder tank 14 is gradually immersed in the solder liquid 16 in the solder bath 14 while passing through the solder finishing chamber 13.
5 and the lead wire 3 is finished with solder.
After that, the electronic component 1 is conveyed to the linear feeder 10, and is sent to a stamping process, for example.

According to the solder finishing device described above, the linear feeder 1 serving as a conveying device carries out the solder liquid 15 in the solder tank 14.
0 are arranged in an inclined manner, and the solder liquid 15 in the solder tank 14
is gradually immersed upward from the bottom end of the lead wire 3 as the electronic component 1 is transported.
Thermal shock to the resin molded part and the resin molded component body 2 is small, there is no damage to the component during soldering, and the lead wire 3 can be heated by thermal conduction, so preheating is sufficient and soldering is completed. is constant and the finish is good.

Further, since the lead wire 3 is immersed in the solder liquid 15 while applying vibration to the electronic component 1 by the linear feeder 10, the lead wire 3 and the solder liquid 15 come into contact with each other and rub against each other. oxide film and impurities can be removed, and a solder layer can be formed satisfactorily on the surface of the lead wire 3.

In addition, the component 1 that has been soldered is soldered in the solder tank 14.
The lead wire 3 climbs over the side wall of the lead wire 3 and is transported further forward, but since vibration is applied to the component 1 at this time as well, the solder remaining between the lead wires 3 is shaken off, causing a solder bridge. Occurrence is prevented.

Furthermore, since a soldering part is provided in a part of the linear feeder 10, the entire apparatus can be made smaller and simpler.

Furthermore, since the solder liquid 15 is circulated, clean solder liquid 15 can be constantly supplied simply by providing a filter or the like in the circulation path, and the overall cleanliness of the solder tank 14 is improved, resulting in a good solder finish. .

The above configuration and operation have been described with respect to an example in which the linear feeder 10 and the solder tank 14 are tilted, and the electronic component 1 is transported along with the flow of the solder liquid 15 in the solder tank 14. The invention is not limited to this, but includes all cases where electronic components are soldered while being transported using the vibration of the transporting body.

As explained above, according to this invention, the vibration of the conveying body is used to carry out soldering while conveying the parts, so the device can be made smaller and simpler, and impurities can be removed by vibration. A good solder layer can be formed.

[Brief explanation of the drawing]

FIG. 1 is a front view showing an example of an electronic component to be soldered, FIG. 2 is a plan view of a conventional solder finishing device, and FIG. 3 is a longitudinal cross-sectional view taken along line A-A in FIG.
Fig. 4 is a schematic side view showing an embodiment of the solder finishing device according to this invention, Fig. 5 is a drawing showing the inside of the solder finishing chamber, and Fig. 6 is a longitudinal cross-sectional view taken along line B-B in Fig. 5. It is. 1...Electronic component, 3...Lead wire, 10...Light feeder, 11...Rail, 13...Solder finishing room, 14...Solder tank, 15...Solder liquid.

Claims (1)

[Scope of utility model registration request] A conveyor body that vibrates and sequentially moves parts held in a suspended state is arranged at an angle with respect to the molten solder surface of a solder tank, and the parts moving on the conveyor body are immersed in the molten solder sequentially from the bottom end. A solder finishing device characterized by: