JPS6214687Y2 - - Google Patents
Info
- Publication number
- JPS6214687Y2 JPS6214687Y2 JP11521582U JP11521582U JPS6214687Y2 JP S6214687 Y2 JPS6214687 Y2 JP S6214687Y2 JP 11521582 U JP11521582 U JP 11521582U JP 11521582 U JP11521582 U JP 11521582U JP S6214687 Y2 JPS6214687 Y2 JP S6214687Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- leads
- resin material
- cover
- molten resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 78
- 229920005989 resin Polymers 0.000 claims description 78
- 239000000463 material Substances 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 28
- 238000000576 coating method Methods 0.000 claims description 22
- 239000011248 coating agent Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007654 immersion Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000007592 spray painting technique Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Coating Apparatus (AREA)
Description
【考案の詳細な説明】
技術分野
この考案はハイブリツドIC（混成集積回路）
などの電子部品装着構体である基板の表裏両面を
樹脂浸漬法で樹脂コーテイングする装置で、詳し
くは片面から複数のリードが導出された基板の表
裏両面をリードの基板近くの一部まで含めて樹脂
コーテイングする装置に関する。[Detailed explanation of the invention] Technical field This invention is a hybrid IC (hybrid integrated circuit)
It is a device that coats both the front and back sides of a board, which is an electronic component mounting structure, using a resin dipping method. Specifically, it coats both the front and back sides of a board with multiple leads led out from one side with resin, including the part near the board of the leads. Related to coating equipment.
背景技術
１枚の絶縁基板の表裏両面に薄膜状の導電路や
抵抗体パターンを印刷し、この導出パターンの要
所にチツプコンデンサやトランジスタなどを半田
付けして樹脂コーテイング処理したハイブリツド
ICは高集積化、高性能化の実現、量産性の向上
が見られ、最近多用化される傾向にある。このハ
イブリツドICの一例を第１図及び第２図に示す
と、１はセラミツク製の絶縁基板（以下基板と称
す）で通常その表裏両面には導電路や抵抗体パタ
ーンＰがスクリーン印刷法等で形成され、パター
ンＰの半田付け予定部分を残して半田レジスト膜
などがコーテイングされている。２，２……は基
板１の表裏両面の導電パターンの半田付け予定部
分に半田付けされたチツプコンデンサや別個に製
作されたトランジスタやモノリシツクICなどの
複数の電子部品、３，３……は基板１の対向する
両側端部の導電パターンＰの半田付け部分に一端
が半田付けされて外部に延びる複数のリードで、
このリード３，３……と電子部品２，２……の
各々は基板１に接着剤やかしめなどの手段で仮止
めされた状態で半田浸漬法により一括して半田付
けされる。各リード３，３……は第２図にて明ら
かな通り基板１と直交する同一方向に２列に並ん
で導出される。４は基板１の表裏両面にコーテイ
ングされた外装樹脂材で内部を保護する。このよ
うなハイブリツドICは量産性を上げるため、通
常は第３図及び第４図に示すように複数の製品に
おけるリード３，３……をタイバー５，５……で
一連に一体化したリードフレーム６を使つて複数
個が一括して半田浸漬や樹脂コーテイングされて
製造される。Background technology A hybrid device in which thin film conductive paths and resistor patterns are printed on both the front and back sides of a single insulating substrate, and chip capacitors, transistors, etc. are soldered to key points of this lead-out pattern and treated with a resin coating.
ICs have recently become more widely used as they have achieved higher integration, higher performance, and improved mass production. An example of this hybrid IC is shown in Figs. 1 and 2. 1 is a ceramic insulating substrate (hereinafter referred to as the substrate), and conductive paths and resistor patterns P are usually formed on both the front and back surfaces by screen printing, etc. A solder resist film or the like is coated with the remaining portions of the pattern P to be soldered. 2, 2... are multiple electronic components such as chip capacitors, separately manufactured transistors, and monolithic ICs soldered to the soldering portions of the conductive patterns on both the front and back sides of the substrate 1, and 3, 3... are the substrates. A plurality of leads having one end soldered to the soldered portion of the conductive pattern P on opposite side ends of the lead and extending to the outside,
The leads 3, 3, . . . and the electronic components 2, 2, . As is clear from FIG. 2, the leads 3, 3, . . . are led out in two rows in the same direction orthogonal to the substrate 1. 4 protects the inside with an exterior resin material coated on both the front and back surfaces of the substrate 1. In order to increase mass production of such hybrid ICs, they are usually made into a lead frame in which the leads 3, 3, etc. of multiple products are integrated in a series with tie bars 5, 5, etc., as shown in Figures 3 and 4. 6, multiple pieces are dipped in solder or coated with resin at the same time.
ところで、上記製品の樹脂コーテイングである
が、これは外装樹脂材４のリード３，３……を覆
う端部の部位が揃わずに一定のレベルを越えてコ
ーテイングされるリードがあると被取付機器のソ
ケツトへの挿入不良等の不都合が生じ、しかも、
樹脂材４は、硬く修理が困難であり、また外観を
悪くするので、一定のレベルに揃えてコーテイン
グさせる必要がある。この制約のため樹脂コーテ
イングは現状では浸漬法又は刷毛塗り法で行つて
いる。即ち、いま第４図で基板１のリード導出側
の面を裏面Ｂ、その反対面を表面Ｓとすると、第
３図のリードフレーム６を使用し、さらに部品を
装着した多連ハイブリツドICの各基板１，１…
…の表面Ｓ側を一括して溶融樹脂材に浸漬してこ
れを引上げて表面側に付着した樹脂材を固化さ
せ、次に各基板１，１……の裏面Ｂに刷毛を使つ
て手塗りで溶融樹脂材を順番に塗布していく。し
かし、このコーテイング法は特に刷毛塗り工程の
工数が大で作業性が極めて悪く、而も上記制約の
ため作業員に熟練を要する欠点があつた。 By the way, regarding the resin coating of the above product, if the ends of the exterior resin material 4 covering the leads 3, 3, etc. are not aligned and some leads are coated beyond a certain level, it may cause damage to the attached equipment. Inconveniences such as improper insertion into the socket may occur, and
The resin material 4 is hard and difficult to repair, and also deteriorates the appearance, so it is necessary to coat it to a certain level. Due to this restriction, resin coating is currently performed by dipping or brush coating. That is, assuming that the surface of the board 1 on the lead-out side is the back surface B and the opposite surface is the front surface S in FIG. 4, each of the multiple hybrid ICs using the lead frame 6 shown in FIG. Substrate 1, 1...
The surface S side of ... is immersed in a molten resin material and pulled up to solidify the resin material attached to the surface side. Next, the back side B of each board 1, 1... is hand painted using a brush. Apply the molten resin material in order. However, this coating method requires a large number of man-hours, especially the brush coating process, and has extremely poor workability, and also has the drawback that the above-mentioned limitations require the operator to be highly skilled.
尚、１つのリードフレーム６における複数の基
板１，１……の全体を一括して溶融樹脂材に浸漬
して、１回で全面を樹脂コーテイングすることも
考えられ、一部で実行されているが、この方法は
１つの基板１から延びる各リード３，３……の間
隔が狭いものにあつては溶融樹脂材にリード３，
３……を一定のレベルまで浸漬してもリード間に
溶融樹脂材が毛細管現象で這い上り、各リード
３，３……での樹脂コーテイングのレベルに大き
なバラツキが生じて一定のレベルに規制すること
が極めて難しい現実問題がある。またこの方法に
際し、リード３，３…の非樹脂コーテイング部分
をチヤツクで挾持して保護しておいて基板全体を
溶融樹脂材に浸漬することが考えられるが、チヤ
ツクとリード３，３……との間にどうしても若干
の隙間が生じてこの隙間に溶融樹脂材が浸入する
ことがあつて、リード３，３……の樹脂コーテイ
ングレベルにバラツキが生じ、好ましくない。 It is also possible to immerse the entire plurality of substrates 1, 1, . . . in one lead frame 6 in a molten resin material at once, and coat the entire surface with the resin at once, and this has been done in some cases. However, in this method, when the distance between the leads 3, 3... extending from one substrate 1 is narrow, the leads 3, 3, etc. are attached to the molten resin material.
Even if 3... is immersed to a certain level, the molten resin material will creep up between the leads due to capillary phenomenon, causing large variations in the level of resin coating on each lead 3, 3..., and regulating it to a certain level. There are real problems that are extremely difficult. Also, in this method, it is conceivable to protect the non-resin coated portions of the leads 3, 3... with a chuck and then immerse the entire board in the molten resin material, but the chuck and the leads 3, 3... There is inevitably a slight gap between the leads 3, 3, etc., and the molten resin material may infiltrate into this gap, which causes variations in the resin coating level of the leads 3, 3, etc., which is not preferable.
考案の開示
この考案は上記刷毛塗り塗装や全体の樹脂浸漬
法による樹脂コーテイングの各問題点に鑑みてな
されたもので、基板の片面を樹脂浸漬法で樹脂コ
ーテイングすると同時に他の片面をノズルから吐
出される溶融樹脂材で塗装する樹脂コーテイング
装置を提供する。Disclosure of the invention This invention was made in view of the problems of resin coating by brush painting and resin immersion method.One side of the board is coated with resin by resin immersion method, and at the same time, the other side is coated with resin from a nozzle. To provide a resin coating device for coating with a molten resin material.
本考案の特徴は上述のように基板の片面を溶融
樹脂材に浸漬すること、同時に他の片面を特定の
ノズルから吐出された溶融樹脂材で吐き付け塗装
や流し塗り塗装することに加え、吹く付け塗装や
流し塗り塗装される片面に当該片面側に導出され
たリードを一定レベルまで覆うカバーを被嵌して
リードの余分な部所にノズルから吐出される溶融
樹脂材が付着しないよう保護することである。こ
のようにすることにより、基板の表裏両面の同時
樹脂コーテイング、自動化、そしてリードの樹脂
コーテイングレベルの均一化が可能となる。 The feature of this invention is that, as mentioned above, one side of the board is dipped in molten resin material, and at the same time, the other side is sprayed or flow coated with molten resin material discharged from a specific nozzle. A cover is placed on one side that is to be painted or flow coated to cover the leads led out to that side to a certain level to protect the excess parts of the leads from adhering to the molten resin material discharged from the nozzle. That's true. By doing this, it becomes possible to simultaneously coat both the front and back surfaces of the substrate with resin, to automate the process, and to make the resin coating level of the leads uniform.
考案を実施するための最良の形態
本考案を第３図のリードフレーム６における複
数の基板１，１……の樹脂コーテイング装置に適
用した実施例を第５図及び第６図で説明する。７
は上端開口の長尺な箱形の樹脂槽で内部に溶融樹
脂材８を収容する。９は樹脂槽７の中央部上方に
配置されたカバー、対向する断面八字状の側壁部
９ａ，９ｂと、側壁部９ａ，９ｂの上端を連結す
る天面部９ｃで構成される。１０はカバー天面部
９ｃの略中央に下に向けて装着されたスプレー式
ノズル、１１は樹脂槽７の溶融樹脂材８をノズル
１０に供給する循環ポンプである。樹脂槽７の上
端開口の幅はリードフレーム６の幅より若干大き
な程度であり、リードフレーム６は基板１，１…
…を下にして各基板１，１……の非リード導出側
の表面を樹脂槽７の溶融樹脂材８の表層部に浸漬
して長手方向に水平移動する。このリードフレー
ム６の保持及び移動はリード先端部をチヤツクす
る搬送体１２，１２などを使つて行えばよい。カ
バーは溶融樹脂材８に部品的に浸漬されて一方向
に搬送されるリードフレーム６の搬送方向途中に
設置され、これのカバー両側壁部９ａ，９ｂはリ
ードフレーム６の対向する２列のリード３，３…
…の内面の一定レベルの部所から上を覆う。ノズ
ル１０はその下方に基板１が送られてくると基板
１に向けて溶融樹脂材８′をスプレー状に吹き付
ける。BEST MODE FOR CARRYING OUT THE INVENTION An embodiment in which the present invention is applied to a resin coating apparatus for a plurality of substrates 1, 1, . . . in the lead frame 6 shown in FIG. 3 will be described with reference to FIGS. 5 and 6. 7
is a long box-shaped resin tank with an opening at the top and stores a molten resin material 8 inside. Reference numeral 9 includes a cover disposed above the central portion of the resin tank 7, opposing side wall portions 9a and 9b having an eight-shaped cross section, and a top surface portion 9c connecting the upper ends of the side wall portions 9a and 9b. Reference numeral 10 indicates a spray nozzle that is mounted facing downward at substantially the center of the cover top surface portion 9c, and reference numeral 11 indicates a circulation pump that supplies the molten resin material 8 from the resin tank 7 to the nozzle 10. The width of the upper end opening of the resin tank 7 is slightly larger than the width of the lead frame 6, and the lead frame 6 is connected to the substrates 1, 1...
. . . with the substrates 1, 1 . This holding and movement of the lead frame 6 may be carried out using carriers 12, 12, etc. that chuck the leading ends of the leads. The cover is installed midway in the conveying direction of the lead frame 6 which is partially immersed in the molten resin material 8 and conveyed in one direction, and the side walls 9a and 9b of the cover cover two rows of opposing leads of the lead frame 6. 3,3...
Covers the inner surface of a certain level and above. When the substrate 1 is sent below the nozzle 10, the molten resin material 8' is sprayed onto the substrate 1.
つまり、リードフレーム６を基板１，１……の
表面側を樹脂浸漬しながらカバー９のある方向に
自動送りし、カバー９の中に基板１，１……が入
るとノズル１０から基板１，１……に向けて溶融
樹脂材８′を吹き付けて基板１，１……の裏面を
順次に吹き付け塗装し、リードフレーム６がカバ
ー９から離れると垂直上方に引き上げる。すると
基板１，１……の表面側は樹脂浸漬で、裏面側は
吹き付け塗装で夫々が同時に自動樹脂コーテイン
グされたものが得られる。また裏面側の吹き付け
塗装の際、ノズル１０から噴出された溶融樹脂材
８′の一部が横方向に拡がつても、これはカバー
両側壁部９ａ，９ｂに当つてリード３，３……の
非コーテイング部分に噴射されることはなく、従
つてリード３，３……にはカバー両側壁部９ａ，
９ｂから出る一定レベルまでしか樹脂コーテイン
グされず、常に良好な樹脂コーテイングが実行さ
れる。 In other words, the lead frame 6 is automatically fed in the direction of the cover 9 while the surface side of the substrates 1, 1... is immersed in resin, and when the substrates 1, 1... enter the cover 9, the nozzle 10 sends the substrates 1, 1... The back surfaces of the substrates 1, 1, . . . are sequentially spray-coated by spraying a molten resin material 8' toward the leads 1, 1, . Then, the front sides of the substrates 1, 1, . . . are automatically coated with resin by immersion in the resin, and the back sides are coated with the resin by spray painting. Furthermore, even if a portion of the molten resin material 8' ejected from the nozzle 10 spreads laterally during spray painting on the back side, it hits the cover side walls 9a, 9b and leads 3, 3, . . . Therefore, the leads 3, 3, . . .
The resin coating is applied only up to a certain level coming out from 9b, and good resin coating is always performed.
このような自動樹脂コーテイング装置は次の一
部変更が可能である。例えば、ノズル１０とカバ
ー９の一体物を上下と水平方向に移動自在とし、
リードフレーム６を各基板１，１……の表面Ｓ側
を樹脂槽７の溶融樹脂材８に定位置で浸漬してお
いて、この各基板１，１……上に沿つてノズル１
０とカバー９の一体物を水平移動させて各基板
１，１……の裏面Ｂ側に順次に樹脂吹き付け塗装
していく。またノズル１０とカバー９を別個体に
して、ノズル１０のみを水平方向に移動させつつ
基板１，１……の裏面側を順次に樹脂吹き付け塗
装するようにしてもよい。またリードフレーム６
の搬送手段の変更として、樹脂槽７の上端部をリ
ードフレーム６を塔載して送り方向のガイドを兼
ねるレールとして利用することや、樹脂槽７の長
手方向に溶融樹脂材８を流動させて、その流動力
にてリードフレーム６を送ることなどが可能であ
る。これらの各変更は次の第２実施例においても
同様に実行され得る。 Such automatic resin coating equipment can be partially modified as follows. For example, the nozzle 10 and the cover 9 are made to be movable vertically and horizontally,
The lead frame 6 is immersed in the molten resin material 8 of the resin bath 7 at a fixed position with the surface S side of each substrate 1, 1...
0 and the cover 9 are moved horizontally, and the resin spray coating is sequentially applied to the back side B of each board 1, 1, . . . Alternatively, the nozzle 10 and the cover 9 may be made into separate bodies, and the back surfaces of the substrates 1, 1, . . . may be sequentially spray-painted with resin while only the nozzle 10 is moved in the horizontal direction. Also lead frame 6
As changes to the conveying means, the upper end of the resin tank 7 can be used as a rail on which the lead frame 6 is mounted and also serves as a guide in the feeding direction, or the molten resin material 8 can be made to flow in the longitudinal direction of the resin tank 7. , it is possible to feed the lead frame 6 using the fluid force. Each of these changes can be similarly executed in the following second embodiment.
第７図の第２実施例はノズル１３を単に溶融樹
脂材８′を基板１の裏面Ｂ上に垂れ流すものに変
更した一例を示す。この場合の基板１の裏面はノ
ズル１３から流下してくる溶融樹脂材８′で流し
塗り塗装される。この場合もリード３，３……へ
の溶融樹脂材８′の付着はカバー９で一定のレベ
ルまでに規制される。 The second embodiment shown in FIG. 7 shows an example in which the nozzle 13 is changed to one that simply drips the molten resin material 8' onto the back surface B of the substrate 1. In this case, the back surface of the substrate 1 is painted with the molten resin material 8' flowing down from the nozzle 13. In this case as well, the adhesion of the molten resin material 8' to the leads 3, 3, . . . is controlled to a certain level by the cover 9.
尚、本考案における被樹脂コーテイング物はハ
イブリツドICに限らず、他の一般の電子部品装
着構体などであつてもよい。 Note that the resin-coated object in the present invention is not limited to a hybrid IC, but may be other general electronic component mounting structures.
以上のように、本考案によれば基板の表裏両面
の同時樹脂コーテイングが自動的にでき、而もリ
ードでの樹脂コーテイングレベルがカバーにより
常に一定に規制されるので、外観の均一な樹脂コ
ーテイング製品が量産性良く得ることができる。 As described above, according to the present invention, it is possible to automatically resin coat both the front and back sides of the board, and since the resin coating level on the leads is always regulated to a constant level by the cover, the resin coated product has a uniform appearance. can be obtained with good mass production.
第１図及び第２図は被樹脂コーテイング部品の
平面図及びＡ−Ａ線視断面図、第３図及び第４図
は第１図の被樹脂コーテイング部品の製造に使用
されるリードフレーム状態の側面図及び正面図、
第５図及び第６図は本考案の一実施例を示す樹脂
コーテイング装置の要部側面図及びＢ−Ｂ線視拡
大断面図、第７図は本考案の他の実施例を示す樹
脂コーテイング装置の断面図である。
１……基板、３……リード、７……樹脂槽、
８，８′……溶融樹脂材、９……カバー、１０，
１２……ノズル。
Figures 1 and 2 are a plan view and a cross-sectional view taken along the line A-A of the part to be resin coated, and Figures 3 and 4 are the state of the lead frame used for manufacturing the part to be resin coated in Figure 1. side view and front view,
5 and 6 are a side view and an enlarged cross-sectional view of the main parts of a resin coating device showing one embodiment of the present invention, and FIG. 7 is a resin coating device showing another embodiment of the present invention. FIG. 1... Board, 3... Lead, 7... Resin tank,
8, 8'... Molten resin material, 9... Cover, 10,
12... Nozzle.
Claims (1)
た被樹脂コーテイング部品の基板の樹脂コーテイ
ングにおいて、基板のリード導出側と反対の片面
を浸漬する溶融樹脂材を収容した樹脂槽と、この
溶融樹脂材に浸漬した基板のリード導出側片面に
リードを一定レベルまで覆つて被嵌するカバー
と、カバーで覆われた基板の片面に向けて溶融樹
脂材を吐出するノズルとを具備したことを特徴と
する樹脂コーテイング装置。 In the resin coating of a board of a resin-coated component in which a plurality of leads are aligned and led out in the direction of one side of the board, a resin bath containing a molten resin material is immersed into which one side of the board opposite to the lead lead-out side is immersed, and the molten resin material is The present invention is characterized by comprising a cover that is fitted to cover the leads to a certain level on one side of the lead-out side of the substrate immersed in the substrate, and a nozzle that discharges a molten resin material toward one side of the substrate covered with the cover. Resin coating equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11521582U JPS5920630U (en) | 1982-07-28 | 1982-07-28 | Resin coating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11521582U JPS5920630U (en) | 1982-07-28 | 1982-07-28 | Resin coating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5920630U JPS5920630U (en) | 1984-02-08 |
| JPS6214687Y2 true JPS6214687Y2 (en) | 1987-04-15 |
Family
ID=30266037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11521582U Granted JPS5920630U (en) | 1982-07-28 | 1982-07-28 | Resin coating equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5920630U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9221573B2 (en) | 2010-01-28 | 2015-12-29 | Avery Dennison Corporation | Label applicator belt system |
-
1982
- 1982-07-28 JP JP11521582U patent/JPS5920630U/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9221573B2 (en) | 2010-01-28 | 2015-12-29 | Avery Dennison Corporation | Label applicator belt system |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5920630U (en) | 1984-02-08 |
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