JPS63108678U - - Google Patents
Info
- Publication number
- JPS63108678U JPS63108678U JP20052586U JP20052586U JPS63108678U JP S63108678 U JPS63108678 U JP S63108678U JP 20052586 U JP20052586 U JP 20052586U JP 20052586 U JP20052586 U JP 20052586U JP S63108678 U JPS63108678 U JP S63108678U
- Authority
- JP
- Japan
- Prior art keywords
- board
- reference pattern
- pattern
- view
- plan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図〜第４図は本考案の一実施例を示すもの
であつて、第１図は基準パターン部分の平面図、
第２図は基準パターンの検出を示す平面図、第３
図は第２図―線断面図、第４図ははんだ付け
時の平面図である。第５図及び第６図は基板に対
する部品の実装技術の一従来例を示すものであつ
て、第５図は予備はんだ時の断面図、第６図は部
品装着時の断面図である。第７図〜第９図は本考
案の前提となる検討例を示すものであつて、第７
図は基準パターン部分の平面図、第８図は基準パ
ターンの検出を示す平面図、第９図は第８図―
線断面図である。
なお図面に用いた符号において、１…基板、２
…導体パターン、４…溶融はんだの噴流、６…予
備はんだ、７…自動部品装着機、８…チツプ部品
、９…フラツトパツケージＩＣ、１５…基準パタ
ーン、１６…切欠部、１７…はんだ、１８…はん
だ付け機、である。
1 to 4 show an embodiment of the present invention, in which FIG. 1 is a plan view of a reference pattern portion;
Figure 2 is a plan view showing detection of the reference pattern;
The figure is a sectional view taken along the line of FIG. 2, and FIG. 4 is a plan view at the time of soldering. 5 and 6 show a conventional example of a technique for mounting components onto a board, in which FIG. 5 is a cross-sectional view during preliminary soldering, and FIG. 6 is a cross-sectional view during component mounting. Figures 7 to 9 show examples of studies that are the premise of the present invention.
The figure is a plan view of the reference pattern part, FIG. 8 is a plan view showing detection of the reference pattern, and FIG. 9 is a plan view of the reference pattern part.
FIG. In addition, in the symbols used in the drawings, 1...substrate, 2
... Conductor pattern, 4... Molten solder jet, 6... Preliminary solder, 7... Automatic component placement machine, 8... Chip component, 9... Flat package IC, 15... Reference pattern, 16... Notch, 17... Solder, 18 ...It's a soldering machine.
Claims (1)
その基板を搬送させながら溶融はんだの噴流によ
つて前記導体パターン上に予備はんだを施すよう
にしたプリント配線基板において、 前記基板の表面に位置決め用の環状の基準パタ
ーンを形成し、この環状の基準パターンの一部で
前記基板の搬送方向の前方側に切欠部を設けたこ
とを特徴とするプリント配線基板。[Scope of claim for utility model registration] Forming a conductor pattern for wiring on the surface of a board,
In a printed wiring board in which preliminary soldering is performed on the conductor pattern by a jet of molten solder while the board is being transported, an annular reference pattern for positioning is formed on the surface of the board, and this annular reference pattern is formed on the surface of the board. 1. A printed wiring board, characterized in that a cutout is provided in a part of the pattern on the front side in the conveyance direction of the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20052586U JPS63108678U (en) | 1986-12-27 | 1986-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20052586U JPS63108678U (en) | 1986-12-27 | 1986-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63108678U true JPS63108678U (en) | 1988-07-13 |
Family
ID=31163113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20052586U Pending JPS63108678U (en) | 1986-12-27 | 1986-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63108678U (en) |
-
1986
- 1986-12-27 JP JP20052586U patent/JPS63108678U/ja active Pending
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