JPS63170071U - - Google Patents
Info
- Publication number
- JPS63170071U JPS63170071U JP6330087U JP6330087U JPS63170071U JP S63170071 U JPS63170071 U JP S63170071U JP 6330087 U JP6330087 U JP 6330087U JP 6330087 U JP6330087 U JP 6330087U JP S63170071 U JPS63170071 U JP S63170071U
- Authority
- JP
- Japan
- Prior art keywords
- jet
- solder
- soldering
- level
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 238000005476 soldering Methods 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims description 7
Landscapes
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例による噴流式半田付
け装置の噴流半田レベル検出装置を示す斜視図、
第２図はその検出パレツトをキヤリア装置に取り
付けた状態を示す斜視図、第３図はその噴流レベ
ルを検出する状態を示す正面図、第４図は一般的
な噴流式半田付け装置を示す断面図、第５図は該
半田付け装置が採用された自動半田付け装置を示
す平面図である。
図において、６は噴流式半田付け装置、９は半
田浴槽、１２は噴出口、１３は噴流半田、１４は
プリント基板（被半田付け部材）、１５は溶融半
田、２０は噴流半田レベル検出装置、２１は検出
パレツト、２３は噴出孔、２４はレベルゲージで
ある。
FIG. 1 is a perspective view showing a jet solder level detection device for a jet soldering apparatus according to an embodiment of the present invention;
Figure 2 is a perspective view showing the state in which the detection pallet is attached to the carrier device, Figure 3 is a front view showing the state in which the jet level is detected, and Figure 4 is a cross section showing a general jet type soldering device. FIG. 5 is a plan view showing an automatic soldering device in which the soldering device is adopted. In the figure, 6 is a jet soldering device, 9 is a soldering bath, 12 is a spout, 13 is a jet solder, 14 is a printed circuit board (member to be soldered), 15 is molten solder, 20 is a jet solder level detection device, 21 is a detection pallet, 23 is an ejection hole, and 24 is a level gauge.
Claims (1)
該噴流半田に被半田付け部材を接触させて半田付
けする噴流式半田付け装置の上記噴流半田の噴流
レベルを検出する装置おいて、噴出孔が形成され
た平板状の検出パレツトを、基準高さで、かつ上
記噴流半田が上記噴出孔を通つて上方に突出する
位置に配設し、上記検出パレツトの上記噴出孔の
近傍にレベルゲージを配設したことを特徴とする
噴流式半田付け装置の噴流半田レベル検出装置。 The molten solder is jetted from the spout in the solder bath,
In the apparatus for detecting the jet level of the jet solder of the jet soldering apparatus which solders the soldering object by bringing it into contact with the jet solder, the flat detection pallet in which the jet holes are formed is placed at a reference height. and the jet soldering device is disposed at a position where the jet solder projects upward through the spouting hole, and a level gauge is disposed in the vicinity of the spouting hole of the detection pallet. Jet solder level detection device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6330087U JPS63170071U (en) | 1987-04-24 | 1987-04-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6330087U JPS63170071U (en) | 1987-04-24 | 1987-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63170071U true JPS63170071U (en) | 1988-11-04 |
Family
ID=30898396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6330087U Pending JPS63170071U (en) | 1987-04-24 | 1987-04-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63170071U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014216390A (en) * | 2013-04-23 | 2014-11-17 | 三菱電機株式会社 | Jet state evaluation device of molten solder |
| WO2018131419A1 (en) * | 2017-01-12 | 2018-07-19 | 三菱電機株式会社 | Solder jet flow inspection device and solder jet flow inspection method |
-
1987
- 1987-04-24 JP JP6330087U patent/JPS63170071U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014216390A (en) * | 2013-04-23 | 2014-11-17 | 三菱電機株式会社 | Jet state evaluation device of molten solder |
| WO2018131419A1 (en) * | 2017-01-12 | 2018-07-19 | 三菱電機株式会社 | Solder jet flow inspection device and solder jet flow inspection method |
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