JPS645768U - - Google Patents
Info
- Publication number
- JPS645768U JPS645768U JP9737387U JP9737387U JPS645768U JP S645768 U JPS645768 U JP S645768U JP 9737387 U JP9737387 U JP 9737387U JP 9737387 U JP9737387 U JP 9737387U JP S645768 U JPS645768 U JP S645768U
- Authority
- JP
- Japan
- Prior art keywords
- board
- jet
- conveying device
- solder bath
- conveying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本実施例におけるプリント基板の搬送
状態を示す図、第２図は従来の自動半田付装置の
全体構成図、第３図は同上の問題点を示す図、第
４図は同上のプリント基板の搬送状態を示す図で
ある。
１……プリント基板、２……傾斜式コンベア、
５……半田槽、５ａ……ノズル、６……端子、７
……プリント回路、８……電子部品、Ａ，Ｂ……
端子列。
Fig. 1 is a diagram showing the conveyance state of a printed circuit board in this embodiment, Fig. 2 is an overall configuration diagram of a conventional automatic soldering device, Fig. 3 is a diagram showing the same problem as above, and Fig. 4 is a diagram showing the same as above. It is a figure showing the conveyance state of a printed circuit board. 1... Printed circuit board, 2... Inclined conveyor,
5... Solder tank, 5a... Nozzle, 6... Terminal, 7
...Printed circuit, 8...Electronic components, A, B...
terminal row.
Claims (1)
た半田槽と、該半田槽の上方に設けられ電子部品
の列設された複数の端子を裏面から突出して取り
付けた基板をその裏面が前記噴流に接触する状態
で搬送する搬送装置と、を備える自動半田付装置
において、前記基板を、前記端子列方向を搬送方
向に略一致させて前記搬送装置に取り付けたこと
を特徴とする自動半田付装置。 A solder bath is equipped with a jet generation device that generates a jet of molten solder, and a board is provided above the solder bath and has a plurality of terminals on which electronic components are arranged in rows protruding from the back surface of the board. An automatic soldering apparatus comprising: a conveying device that conveys the board in a contacting state, wherein the substrate is attached to the conveying device with the terminal row direction substantially aligned with the conveying direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9737387U JPS645768U (en) | 1987-06-26 | 1987-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9737387U JPS645768U (en) | 1987-06-26 | 1987-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS645768U true JPS645768U (en) | 1989-01-13 |
Family
ID=31322782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9737387U Pending JPS645768U (en) | 1987-06-26 | 1987-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS645768U (en) |
-
1987
- 1987-06-26 JP JP9737387U patent/JPS645768U/ja active Pending
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