JPS5973071U - automatic soldering equipment - Google Patents
automatic soldering equipmentInfo
- Publication number
- JPS5973071U JPS5973071U JP16694082U JP16694082U JPS5973071U JP S5973071 U JPS5973071 U JP S5973071U JP 16694082 U JP16694082 U JP 16694082U JP 16694082 U JP16694082 U JP 16694082U JP S5973071 U JPS5973071 U JP S5973071U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- automatic soldering
- soldering equipment
- bath surface
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面は本考案の技術的内容を示すものであって、第１図
は平面ディップ方式による半田づけ作業の概要を示した
説明図、第２図はその本考案による半田槽部分について
のノズル配設関係を示した斜面図、第３図はその半田浴
面における波の形成状態を示した斜面図、第４図はその
断面図、第５図は本考案によるものの変形例を示した第
４図と同様な断面図である。
然してこれらの図面において、１は半田槽、２はレール
、３はプリント配線基板、４はその実装部品、６はノズ
ル、７は半田浴、７ａはその浴面における波、８は波制
御部材を孝子ものである。The drawings show the technical content of the present invention; Figure 1 is an explanatory diagram showing an overview of soldering work using the plane dip method, and Figure 2 shows the nozzle arrangement for the solder tank part according to the present invention. FIG. 3 is a slope view showing the relationship, FIG. 3 is a slope view showing the state of wave formation on the solder bath surface, FIG. 4 is a sectional view thereof, and FIG. 5 is a modified example of the present invention. It is a sectional view similar to. In these drawings, 1 is a solder bath, 2 is a rail, 3 is a printed wiring board, 4 is a mounting component thereof, 6 is a nozzle, 7 is a solder bath, 7a is a wave on the bath surface, and 8 is a wave control member. It is a filial child's thing.
Claims (1)
動的に半田づけするようにしたものにおいそ、前記半田
槽に半田を噴出する複数個のノズルを配設し、該半田槽
における半田浴面に波を形成するようにしたことを特徴
とする自動半田づけ装置。 ２ ノズル吐出口と半田浴面との間に波制御部材を配設
する実用新案登録請求の範囲第１項に記載の自動半田づ
け装置。[Scope of Claim for Utility Model Registration] 1. A device in which a printed wiring board is fed flatly to a solder tank and automatically soldered therein, and a plurality of nozzles for spouting solder are arranged in the solder tank. An automatic soldering device characterized in that waves are formed on the solder bath surface in the solder tank. 2. The automatic soldering apparatus according to claim 1, wherein a wave control member is disposed between the nozzle discharge port and the solder bath surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16694082U JPS5973071U (en) | 1982-11-05 | 1982-11-05 | automatic soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16694082U JPS5973071U (en) | 1982-11-05 | 1982-11-05 | automatic soldering equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5973071U true JPS5973071U (en) | 1984-05-17 |
Family
ID=30365352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16694082U Pending JPS5973071U (en) | 1982-11-05 | 1982-11-05 | automatic soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5973071U (en) |
-
1982
- 1982-11-05 JP JP16694082U patent/JPS5973071U/en active Pending
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