JPS60181257U - jet solder bath - Google Patents

jet solder bath

Info

Publication number
JPS60181257U
JPS60181257U JP6657184U JP6657184U JPS60181257U JP S60181257 U JPS60181257 U JP S60181257U JP 6657184 U JP6657184 U JP 6657184U JP 6657184 U JP6657184 U JP 6657184U JP S60181257 U JPS60181257 U JP S60181257U
Authority
JP
Japan
Prior art keywords
solder bath
jet solder
jet
pipe
pump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6657184U
Other languages
Japanese (ja)
Inventor
良一 鈴木
Original Assignee
千住金属工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 千住金属工業株式会社 filed Critical 千住金属工業株式会社
Priority to JP6657184U priority Critical patent/JPS60181257U/en
Publication of JPS60181257U publication Critical patent/JPS60181257U/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案噴流はんだ槽の正面断面図、第２図は本
考案噴流はんだ槽でチップ部品とディスクリート部品が
混載されたプリント基板をはんだ付けする説明図、第３
図は本考案噴流はんだ槽の断面斜視図、第４図は本考案
噴流はんだ槽に用いるパイプの他の実施例である。 １．２・・・ノズル板、６・・・溶融はんだ噴出口、７
・・・パイプ。Figure 1 is a front sectional view of the jet solder bath of the present invention, Figure 2 is an explanatory diagram of soldering a printed circuit board on which chip components and discrete components are mixedly mounted in the jet solder bath of the present invention, and Figure 3
The figure is a cross-sectional perspective view of the jet solder bath of the present invention, and FIG. 4 is another embodiment of the pipe used in the jet solder bath of the present invention. 1.2... Nozzle plate, 6... Molten solder spout, 7
···pipe.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 上方に溶融はんだを噴出させる噴出口が刻設され、しか
も一端がポンプと接続されているパイプを一対のノズル
板間に設置したことを特徴とする噴流はんだ槽。A jet solder tank characterized in that a pipe is provided between a pair of nozzle plates and has a spout opening for spouting molten solder upward, and one end of which is connected to a pump.
JP6657184U 1984-05-09 1984-05-09 jet solder bath Pending JPS60181257U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6657184U JPS60181257U (en) 1984-05-09 1984-05-09 jet solder bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6657184U JPS60181257U (en) 1984-05-09 1984-05-09 jet solder bath

Publications (1)

Publication Number Publication Date
JPS60181257U true JPS60181257U (en) 1985-12-02

Family

ID=30599606

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6657184U Pending JPS60181257U (en) 1984-05-09 1984-05-09 jet solder bath

Country Status (1)

Country Link
JP (1) JPS60181257U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169762U (en) * 1986-04-12 1987-10-28

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58168471A (en) * 1982-03-31 1983-10-04 Kenji Kondo Jet system solder tank

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58168471A (en) * 1982-03-31 1983-10-04 Kenji Kondo Jet system solder tank

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169762U (en) * 1986-04-12 1987-10-28

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