JPH0376657U - - Google Patents
Info
- Publication number
- JPH0376657U JPH0376657U JP13386489U JP13386489U JPH0376657U JP H0376657 U JPH0376657 U JP H0376657U JP 13386489 U JP13386489 U JP 13386489U JP 13386489 U JP13386489 U JP 13386489U JP H0376657 U JPH0376657 U JP H0376657U
- Authority
- JP
- Japan
- Prior art keywords
- jet
- degrees
- soldering device
- circuit board
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims 2
- 230000007547 defect Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案による面実装部品用噴流式半田
付け装置の斜視図、第２図は本考案による噴出口
列と回路基板の関係を示す平面図、第３図は従来
の面実装部品用噴流式半田付け装置の斜視図、第
４図は従来の噴出口列と回路基板の関係を示す平
面図、第５図は従来例による半田付け不良を示す
平面図と側面図である。
１……噴流式半田槽、２……噴出口列、３……
予熱用加熱器、４……ベルト、５……回路基板、
６……ランド、７……面実装部品、８……外部端
子、９……大形部品、１０……正常な半田付け、
１１……ブリツジ、１２……濡れ不良。
Fig. 1 is a perspective view of a jet soldering device for surface mount components according to the present invention, Fig. 2 is a plan view showing the relationship between the jet nozzle array and a circuit board according to the present invention, and Fig. 3 is a conventional soldering device for surface mount components. FIG. 4 is a perspective view of the jet soldering apparatus, FIG. 4 is a plan view showing the relationship between a conventional jet nozzle array and a circuit board, and FIG. 5 is a plan view and a side view showing soldering defects in the conventional example. 1... Jet type soldering bath, 2... Jet nozzle row, 3...
Preheating heater, 4...belt, 5...circuit board,
6...Land, 7...Surface mount component, 8...External terminal, 9...Large component, 10...Normal soldering,
11...Bridging, 12...Poor wetting.
Claims (1)
その前に予熱用加熱器、また上記の両者の両側に
回路基板搬送用のベルトを設けた面実装部品用噴
流式半田付け装置において、上記の噴出口列を、
回路基板の進行方向に対して３０度から６０度に
傾くように設置したことを特徴とする面実装部品
用噴流式半田付け装置。 A jet-flow solder tank equipped with a row of spouting ports for molten solder;
In a jet soldering device for surface mount components, which is equipped with a heater for preheating and belts for conveying circuit boards on both sides of the above, the above jet nozzle array is
A jet soldering device for surface-mounted components, characterized in that it is installed so as to be inclined at 30 degrees to 60 degrees with respect to the direction of movement of a circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13386489U JPH0376657U (en) | 1989-11-20 | 1989-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13386489U JPH0376657U (en) | 1989-11-20 | 1989-11-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0376657U true JPH0376657U (en) | 1991-07-31 |
Family
ID=31681250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13386489U Pending JPH0376657U (en) | 1989-11-20 | 1989-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0376657U (en) |
-
1989
- 1989-11-20 JP JP13386489U patent/JPH0376657U/ja active Pending