JPH03106265U - - Google Patents
Info
- Publication number
- JPH03106265U JPH03106265U JP1136790U JP1136790U JPH03106265U JP H03106265 U JPH03106265 U JP H03106265U JP 1136790 U JP1136790 U JP 1136790U JP 1136790 U JP1136790 U JP 1136790U JP H03106265 U JPH03106265 U JP H03106265U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- soldering
- jet
- circuit board
- soldering device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 230000002265 prevention Effects 0.000 claims description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Description
第１図は、本考案にかかるはんだ付け装置の一
実施例の略式斜視図；第２図は、第１図のＡ−Ａ
断面図；および第３図は、従来のはんだ付け装置
の一例を示す略式断面図である。
１……電子部品、２……プリント基板、３……
キヤリヤ、４……はんだ槽、５……噴流槽、６…
…噴流口、７……溶融はんだ、８……反り防止部
材、９……スケール、１０……レール、１１……
治具、１２……ボルト。
FIG. 1 is a schematic perspective view of an embodiment of a soldering device according to the present invention; FIG. 2 is an A-A in FIG.
A sectional view; and FIG. 3 are schematic sectional views showing an example of a conventional soldering device. 1...Electronic components, 2...Printed circuit boards, 3...
Carrier, 4... Solder bath, 5... Jet bath, 6...
... Jet port, 7 ... Molten solder, 8 ... Warpage prevention member, 9 ... Scale, 10 ... Rail, 11 ...
Jig, 12... bolts.
Claims (1)
噴流式はんだ槽の噴流口から噴流する溶融はんだ
で前記プリント基板のはんだ付けを行うはんだ付
け装置であつて、 （） 前記プリント基板の搬送方向に前記噴流
口を横断して延設された反り防止部材と、 （） 前記プリント基板の搬送方向と交叉する
方向における前記反り防止部材の位置を指示する
、前記噴流式はんだ槽に設けられたスケールと を備えてなることを特徴とするはんだ付け装置。[Scope of claim for utility model registration] Transporting printed circuit boards with electronic components installed,
A soldering device for soldering the printed circuit board with molten solder jetted from a jet port of a jet soldering tank, the soldering device comprising: () a warpage prevention device extending across the jet port in the conveying direction of the printed circuit board; A soldering device comprising: (1) a scale provided in the jet solder tank that indicates the position of the warpage prevention member in a direction intersecting the conveying direction of the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1136790U JPH03106265U (en) | 1990-02-07 | 1990-02-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1136790U JPH03106265U (en) | 1990-02-07 | 1990-02-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03106265U true JPH03106265U (en) | 1991-11-01 |
Family
ID=31514895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1136790U Pending JPH03106265U (en) | 1990-02-07 | 1990-02-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03106265U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57130764A (en) * | 1981-02-02 | 1982-08-13 | Sony Corp | Jet type automatic soldering device |
-
1990
- 1990-02-07 JP JP1136790U patent/JPH03106265U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57130764A (en) * | 1981-02-02 | 1982-08-13 | Sony Corp | Jet type automatic soldering device |
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