JPH01114161U - - Google Patents

Info

Publication number
JPH01114161U
JPH01114161U JP755388U JP755388U JPH01114161U JP H01114161 U JPH01114161 U JP H01114161U JP 755388 U JP755388 U JP 755388U JP 755388 U JP755388 U JP 755388U JP H01114161 U JPH01114161 U JP H01114161U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
soldering device
solder
solder bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP755388U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP755388U priority Critical patent/JPH01114161U/ja
Publication of JPH01114161U publication Critical patent/JPH01114161U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案装置の一実施例を示す縦断側面
図、第2図及び第3図は従来例の説明用縦断側面
図である。 1……プリント基板、2……スルーホール、5
……半田槽、6……エアブロー用ノズル。
FIG. 1 is a longitudinal sectional side view showing one embodiment of the device of the present invention, and FIGS. 2 and 3 are illustrative longitudinal sectional side views of a conventional example. 1...Printed circuit board, 2...Through hole, 5
...Solder tank, 6...Air blow nozzle.

Claims (1)

【実用新案登録請求の範囲】 プリント基板と半田槽とを、相対的に移動させ
て、プリント基板上の部品を、一括して半田付け
する半田付け装置において、 半田槽の部品取出口側に、プリント基板のスル
ーホールの位置と対応させて、エアブロー用ノズ
ルを、プリント基板の取出し方向に沿つて複数個
設置したことを特徴とする半田付け装置。
[Scope of Claim for Utility Model Registration] In a soldering device that moves the printed circuit board and the solder bath relatively to solder the components on the printed circuit board all at once, on the component outlet side of the solder bath, A soldering device characterized in that a plurality of air blow nozzles are installed along the direction in which the printed circuit board is taken out, corresponding to the positions of the through holes of the printed circuit board.
JP755388U 1988-01-22 1988-01-22 Pending JPH01114161U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP755388U JPH01114161U (en) 1988-01-22 1988-01-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP755388U JPH01114161U (en) 1988-01-22 1988-01-22

Publications (1)

Publication Number Publication Date
JPH01114161U true JPH01114161U (en) 1989-08-01

Family

ID=31212655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP755388U Pending JPH01114161U (en) 1988-01-22 1988-01-22

Country Status (1)

Country Link
JP (1) JPH01114161U (en)

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