JPH0428476U - - Google Patents

Info

Publication number
JPH0428476U
JPH0428476U JP6973190U JP6973190U JPH0428476U JP H0428476 U JPH0428476 U JP H0428476U JP 6973190 U JP6973190 U JP 6973190U JP 6973190 U JP6973190 U JP 6973190U JP H0428476 U JPH0428476 U JP H0428476U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
wiring pattern
droplet
tails
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6973190U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6973190U priority Critical patent/JPH0428476U/ja
Publication of JPH0428476U publication Critical patent/JPH0428476U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す要部平面図、
第2図は本考案の他の実施例を示す要部平面図で
第3図は従来例を示す要部平面図である。 10,20……プリント基板、11,21……
配線パターン、12,22……貫通孔、13……
電極部、14,23……半田付ランド、14a,
23a……円形頂部、14b,23b……尾部、
24……チツプ部品。
FIG. 1 is a plan view of essential parts showing an embodiment of the present invention;
FIG. 2 is a plan view of main parts showing another embodiment of the present invention, and FIG. 3 is a plan view of main parts showing a conventional example. 10,20...Printed circuit board, 11,21...
Wiring pattern, 12, 22... Through hole, 13...
Electrode part, 14, 23... Soldering land, 14a,
23a...Circular top, 14b, 23b...Tail,
24... Chip parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 回路部品をプリント基板の配線パターンに、半
田により半田付けするプリント基板において、該
配線パターンの半田付ランドを滴形に形成すると
共に、隣接する該半田付ランドの滴形の尾部を互
いに離間する方向へ引き出す構成としたことを特
徴とするプリント基板。
In a printed circuit board in which a circuit component is soldered to a wiring pattern on a printed circuit board, a direction in which the soldering land of the wiring pattern is formed into a droplet shape, and the tails of the droplet shapes of adjacent soldering lands are separated from each other. A printed circuit board characterized by having a structure that can be pulled out.
JP6973190U 1990-06-29 1990-06-29 Pending JPH0428476U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6973190U JPH0428476U (en) 1990-06-29 1990-06-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6973190U JPH0428476U (en) 1990-06-29 1990-06-29

Publications (1)

Publication Number Publication Date
JPH0428476U true JPH0428476U (en) 1992-03-06

Family

ID=31605288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6973190U Pending JPH0428476U (en) 1990-06-29 1990-06-29

Country Status (1)

Country Link
JP (1) JPH0428476U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710768B2 (en) * 1973-05-12 1982-02-27

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710768B2 (en) * 1973-05-12 1982-02-27

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