JPH01108971U - - Google Patents
Info
- Publication number
- JPH01108971U JPH01108971U JP393688U JP393688U JPH01108971U JP H01108971 U JPH01108971 U JP H01108971U JP 393688 U JP393688 U JP 393688U JP 393688 U JP393688 U JP 393688U JP H01108971 U JPH01108971 U JP H01108971U
- Authority
- JP
- Japan
- Prior art keywords
- component insertion
- insertion hole
- soldering
- component
- slits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図及び第２図は本考案の一実施例で、第１
図は本考案のプリント配線基板の平面図、第２図
は要部説明図である。第３図は従来例のプリント
配線基板の平面図である。
１…基板、２…導体パターン、３…部品挿入穴
、４…半田付部、５…スリツト、６…レジスト。
Figures 1 and 2 show an embodiment of the present invention;
The figure is a plan view of the printed wiring board of the present invention, and FIG. 2 is an explanatory diagram of the main parts. FIG. 3 is a plan view of a conventional printed wiring board. DESCRIPTION OF SYMBOLS 1... Board, 2... Conductor pattern, 3... Component insertion hole, 4... Soldering part, 5... Slit, 6... Resist.
Claims (1)
た半田付部を備えた部品挿入穴を有し、前記部品
挿入穴のうち後付け部品用の部品挿入穴の半田付
部に部品挿入穴の封鎖を防止のためのスリツトを
設けたオートデツプにより半田付するプリント配
線基板において、前記スリツトの方向を基板の流
れ方向と平行でかつ部品挿入穴より上方向に形成
したことを特徴とするプリント配線基板。 The component insertion hole has a conductor pattern formed thereon and a soldering portion drilled in the pattern, and prevents the component insertion hole from being blocked by the soldering portion of the component insertion hole for a retrofitted component among the component insertion holes. What is claimed is: 1. A printed wiring board for soldering using an auto-dep having slits for soldering, characterized in that the slits are formed in a direction parallel to the flow direction of the board and above a component insertion hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP393688U JPH01108971U (en) | 1988-01-16 | 1988-01-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP393688U JPH01108971U (en) | 1988-01-16 | 1988-01-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01108971U true JPH01108971U (en) | 1989-07-24 |
Family
ID=31206009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP393688U Pending JPH01108971U (en) | 1988-01-16 | 1988-01-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01108971U (en) |
-
1988
- 1988-01-16 JP JP393688U patent/JPH01108971U/ja active Pending