JPH01174968U - - Google Patents

Info

Publication number
JPH01174968U
JPH01174968U JP7224588U JP7224588U JPH01174968U JP H01174968 U JPH01174968 U JP H01174968U JP 7224588 U JP7224588 U JP 7224588U JP 7224588 U JP7224588 U JP 7224588U JP H01174968 U JPH01174968 U JP H01174968U
Authority
JP
Japan
Prior art keywords
lands
circuit board
printed circuit
insertion hole
elliptical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7224588U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7224588U priority Critical patent/JPH01174968U/ja
Publication of JPH01174968U publication Critical patent/JPH01174968U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例のプリント基板の平
面図、第2図は別の実施例の平面図である。 図において、1……ランド、2…ソルダーレジ
スト、3……除去部分、4……一部欠落部、5…
…部品挿入穴、6……インク、である。
FIG. 1 is a plan view of a printed circuit board according to one embodiment of the present invention, and FIG. 2 is a plan view of another embodiment. In the figure, 1...Land, 2...Solder resist, 3...Removed portion, 4...Partially missing portion, 5...
... component insertion hole, 6... ink.

Claims (1)

【実用新案登録請求の範囲】 長円形状のランドを、該ランドの長手方向に対
し直角方向に狭小間隔で複数個配置したプリント
基板において、 隣接した前記ランドの部品挿入穴付近の一部を
、はんだ付着防止剤で覆つたことを特徴とするプ
リント基板。
[Claims for Utility Model Registration] In a printed circuit board in which a plurality of elliptical lands are arranged at narrow intervals in a direction perpendicular to the longitudinal direction of the lands, a part of adjacent lands near a component insertion hole, A printed circuit board characterized by being coated with a solder adhesion prevention agent.
JP7224588U 1988-05-31 1988-05-31 Pending JPH01174968U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7224588U JPH01174968U (en) 1988-05-31 1988-05-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7224588U JPH01174968U (en) 1988-05-31 1988-05-31

Publications (1)

Publication Number Publication Date
JPH01174968U true JPH01174968U (en) 1989-12-13

Family

ID=31297416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7224588U Pending JPH01174968U (en) 1988-05-31 1988-05-31

Country Status (1)

Country Link
JP (1) JPH01174968U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0493180U (en) * 1990-12-25 1992-08-13

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226074B2 (en) * 1979-05-17 1987-06-06 Tokyo Shibaura Electric Co

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226074B2 (en) * 1979-05-17 1987-06-06 Tokyo Shibaura Electric Co

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0493180U (en) * 1990-12-25 1992-08-13

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