JPH0459178U - - Google Patents
Info
- Publication number
- JPH0459178U JPH0459178U JP10011490U JP10011490U JPH0459178U JP H0459178 U JPH0459178 U JP H0459178U JP 10011490 U JP10011490 U JP 10011490U JP 10011490 U JP10011490 U JP 10011490U JP H0459178 U JPH0459178 U JP H0459178U
- Authority
- JP
- Japan
- Prior art keywords
- component
- lead
- mounting hole
- mounting
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例を示す平面図、第２
図は第１図のＣ−Ｃ線断面図、第３図は第１図の
Ｄ−Ｄ線断面図、第４図は従来例を示す平面図、
第５図は第４図のＡ−Ａ線断面図、第６図は第４
図のＢ−Ｂ線断面図、第７図は他の従来例を示す
平面図である。
１……部品、２……リード、３……ＰＷＢ、１
０……取り付け穴、１１……部品取り付けランド
。
Figure 1 is a plan view showing one embodiment of the present invention;
The figure is a sectional view taken along the line C-C in FIG. 1, FIG. 3 is a sectional view taken along the line D-D in FIG. 1, and FIG. 4 is a plan view showing a conventional example.
Figure 5 is a sectional view taken along line A-A in Figure 4, and Figure 6 is a cross-sectional view of Figure 4.
A sectional view taken along the line B--B in the figure, and FIG. 7 is a plan view showing another conventional example. 1...Parts, 2...Lead, 3...PWB, 1
0...Mounting hole, 11...Component mounting land.
Claims (1)
する取り付け穴と、該取り付け穴に配置した部品
取り付けランドとを設け、この部品取り付けラン
ドに前記リードを半田を介して取り付ける印刷配
線板の部品実装構造において、 前記取り付け穴を、連続して配置した複数個の
小径穴により実装する部品のリードとほぼ同一形
状に加工したことを特徴とする印刷配線板の部品
実装構造。[Scope of Claim for Utility Model Registration] A printed circuit board is provided with a mounting hole that passes through the lead of a component to be mounted, and a component mounting land placed in the mounting hole, and the lead is soldered to the component mounting land. Component mounting structure for a printed wiring board, characterized in that the mounting hole is formed into a plurality of consecutively arranged small-diameter holes and processed into a shape almost identical to the lead of the component to be mounted. structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10011490U JPH0459178U (en) | 1990-09-27 | 1990-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10011490U JPH0459178U (en) | 1990-09-27 | 1990-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459178U true JPH0459178U (en) | 1992-05-21 |
Family
ID=31842519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10011490U Pending JPH0459178U (en) | 1990-09-27 | 1990-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459178U (en) |
-
1990
- 1990-09-27 JP JP10011490U patent/JPH0459178U/ja active Pending