JPH03113870U - - Google Patents
Info
- Publication number
- JPH03113870U JPH03113870U JP2411490U JP2411490U JPH03113870U JP H03113870 U JPH03113870 U JP H03113870U JP 2411490 U JP2411490 U JP 2411490U JP 2411490 U JP2411490 U JP 2411490U JP H03113870 U JPH03113870 U JP H03113870U
- Authority
- JP
- Japan
- Prior art keywords
- type
- dip
- rows
- electronic components
- mounting electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
第１図ａ，ｂは本考案の一実施例の平面図及び
底面図、第２図ａ，ｂは第１図ａ，ｂの印刷配線
板にＤＩＰを実装した場合の平面図及びＡ−Ａ′
線断面図、第３図ａ，ｂは第１図ａ，ｂの印刷配
線板にＺＩＰを実装した場合の平面図及びＢ−Ｂ
′線断面図、第４図ａ，ｂは、従来の印刷配線板
の一例の平面図及び底面図、第５図ａ，ｂは第４
図ａ，ｂの印刷配線板にＤＩＰを実装した場合の
平面図及びＣ−Ｃ′線断面図である。
１，１１……印刷配線板、２……Ａ面、３……
Ｂ面、４，１４……ＤＩＰ実装用スルーホールラ
ンド、５……配線パターン、６……ＤＩＰ、７…
…ＺＩＰ、２４……ＺＩＰ実装用スルーホールラ
ンド。
Figures 1a and b are a plan view and a bottom view of an embodiment of the present invention, and Figures 2a and b are plan views and A-A of the case where the DIP is mounted on the printed wiring board of Figures 1a and b. ′
Line sectional view, Figure 3 a, b is a plan view and B-B when ZIP is mounted on the printed wiring board of Figure 1 a, b
Figures 4a and 4b are a top view and bottom view of an example of a conventional printed wiring board, and Figures 5a and 5b are sectional views taken along line 4.
FIG. 2 is a plan view and a cross-sectional view taken along the line CC' when a DIP is mounted on the printed wiring board of FIGS. a and b; FIG. 1, 11...Printed wiring board, 2...Side A, 3...
B side, 4, 14...Through hole land for DIP mounting, 5...Wiring pattern, 6...DIP, 7...
...ZIP, 24...Through hole land for ZIP mounting.
Claims (1)
装用スルーホールランドと、該デイツプタイプの
電子部品実装用スルーホールランドの前記列に囲
まれた領域内に２列に配置されたジグザグタイプ
の電子部品実装用スルーホールランドとを備え、
同一機能を有するデイツプタイプの電子部品とジ
グザグタイプの電子部品とのうちのいずれか一方
の電子部品を実装できる構造となつていることを
特徴とする印刷配線板。 Two rows of dip-type through-hole lands for mounting electronic components, and two rows of zigzag-type through-hole lands for mounting electronic components in an area surrounded by the rows of the dip-type through-hole lands for mounting electronic components. Equipped with a through-hole land,
A printed wiring board characterized by having a structure on which either a dip-type electronic component or a zigzag-type electronic component having the same function can be mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2411490U JPH03113870U (en) | 1990-03-09 | 1990-03-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2411490U JPH03113870U (en) | 1990-03-09 | 1990-03-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03113870U true JPH03113870U (en) | 1991-11-21 |
Family
ID=31527086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2411490U Pending JPH03113870U (en) | 1990-03-09 | 1990-03-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03113870U (en) |
-
1990
- 1990-03-09 JP JP2411490U patent/JPH03113870U/ja active Pending