JPS63106572U - - Google Patents
Info
- Publication number
- JPS63106572U JPS63106572U JP20258986U JP20258986U JPS63106572U JP S63106572 U JPS63106572 U JP S63106572U JP 20258986 U JP20258986 U JP 20258986U JP 20258986 U JP20258986 U JP 20258986U JP S63106572 U JPS63106572 U JP S63106572U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- circuit board
- printed circuit
- jet nozzle
- soldering device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 7
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図と第２図は本考案に係る半田付装置の実
施例を示す概略平面図と概略正面図、第３図乃至
第５図はそれぞれ本考案に係る蓋体の一具体例を
示す正断面図、第３図Ｂ―Ｂ線断面図、平面図、
第６図と第７図は従来の噴流式半田付装置の具体
例を示す概略平面図、概略正面図、第８図と第９
図は第６図及び第７図に示す半田付装置に含まれ
る半田槽と噴流ノズルの側断面図と平面図、第１
０図と第１１図は従来の問題点を説明するための
半田付装置の概略平面図と概略正面図である。
１…半田噴流ノズル、２…搬送路、３…プリン
ト基板、４…半田槽、５…溶融半田。
1 and 2 are a schematic plan view and a schematic front view showing an embodiment of a soldering device according to the present invention, and FIGS. 3 to 5 are a front view showing a specific example of a lid body according to the present invention, respectively. Cross-sectional view, Figure 3 B-B cross-sectional view, plan view,
6 and 7 are a schematic plan view and a schematic front view showing a specific example of a conventional jet-type soldering device, and FIGS. 8 and 9 are
The figures are a side sectional view and a plan view of the soldering bath and jet nozzle included in the soldering apparatus shown in Figs. 6 and 7, and the first
0 and 11 are a schematic plan view and a schematic front view of a soldering device for explaining the conventional problems. DESCRIPTION OF SYMBOLS 1... Solder jet nozzle, 2... Conveyance path, 3... Printed circuit board, 4... Solder tank, 5... Molten solder.
Claims (1)
槽の上方にプリント基板の搬送路を配し、該プリ
ント基板を一方向に搬送すると共に上記半田噴流
ノズルより溶融半田を噴出させ、プリント基板上
に実装した電子部品を半田付けするようにした半
田付装置において、 上記搬送路の幅方向にスライド可能な蓋体を付
設し、搬送路対応部より外側の半田噴流ノズルの
開口面を覆うようにしたことを特徴とする半田付
装置。[Claims for Utility Model Registration] A conveyance path for a printed circuit board is disposed above a solder tank having an upwardly opened solder jet nozzle, and while the printed circuit board is conveyed in one direction, molten solder is jetted from the solder jet nozzle. In a soldering device that solders electronic components mounted on a printed circuit board, a lid body that can be slid in the width direction of the transport path is attached, and an opening of the solder jet nozzle outside the corresponding part of the transport path is attached. A soldering device characterized by covering a surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20258986U JPS63106572U (en) | 1986-12-23 | 1986-12-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20258986U JPS63106572U (en) | 1986-12-23 | 1986-12-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63106572U true JPS63106572U (en) | 1988-07-09 |
Family
ID=31167115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20258986U Pending JPS63106572U (en) | 1986-12-23 | 1986-12-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63106572U (en) |
-
1986
- 1986-12-23 JP JP20258986U patent/JPS63106572U/ja active Pending