JPS6163360U - - Google Patents
Info
- Publication number
- JPS6163360U JPS6163360U JP14719284U JP14719284U JPS6163360U JP S6163360 U JPS6163360 U JP S6163360U JP 14719284 U JP14719284 U JP 14719284U JP 14719284 U JP14719284 U JP 14719284U JP S6163360 U JPS6163360 U JP S6163360U
- Authority
- JP
- Japan
- Prior art keywords
- soldered
- molten solder
- solder
- adhering
- jet soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims 9
- 230000001678 irradiating effect Effects 0.000 claims 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例の装置の概略断面説
明図、第２図は従来の噴流はんだ付け装置の概略
断面説明図である。
図中、１ははんだ槽、２はノズル、１１は熱線
照射装置、ａははんだ付けしようにとする電気部
品を仮り留めしたプリント基板である。
FIG. 1 is a schematic sectional view of a device according to an embodiment of the present invention, and FIG. 2 is a schematic sectional view of a conventional jet soldering device. In the figure, 1 is a soldering bath, 2 is a nozzle, 11 is a heat ray irradiation device, and a is a printed circuit board on which electrical components to be soldered are temporarily fixed.
Claims (1)
出させてこの噴出させた溶融はんだに被はんだ付
け体を移動しながら接触させてはんだ付けする噴
流はんだ付け装置において、上記被はんだ付け体
を搬出する側にこの被はんだ付け体のはんだ付け
部が上記溶融はんだから離反するときこのはんだ
付け部に付着した溶融はんだが上記溶融はんだの
流れから切られる部分及びその近傍又は上記被は
んだ付け体のはんだ付け部が上記溶融はんだから
離反した後の不必要個所に付着したはんだ部分に
熱線を照射する熱線照射手段を設けたことを特徴
とする噴流はんだ付け装置。 In a jet soldering device that jets molten solder stored in a solder bath from a nozzle and solders objects to be soldered by moving them into contact with the spouted molten solder, the object to be soldered is carried out. When the soldered part of the object to be soldered separates from the molten solder, the molten solder adhering to this soldered part is cut off from the flow of the molten solder and its vicinity or the soldered part of the object to be soldered is removed. A jet soldering apparatus characterized in that a heat ray irradiation means is provided for irradiating heat rays onto the solder parts adhering to unnecessary parts after separating from the molten solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984147192U JPH0415414Y2 (en) | 1984-09-28 | 1984-09-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984147192U JPH0415414Y2 (en) | 1984-09-28 | 1984-09-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6163360U true JPS6163360U (en) | 1986-04-30 |
| JPH0415414Y2 JPH0415414Y2 (en) | 1992-04-07 |
Family
ID=30705429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984147192U Expired JPH0415414Y2 (en) | 1984-09-28 | 1984-09-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415414Y2 (en) |
-
1984
- 1984-09-28 JP JP1984147192U patent/JPH0415414Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0415414Y2 (en) | 1992-04-07 |
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