JPH0362665U - - Google Patents
Info
- Publication number
- JPH0362665U JPH0362665U JP12007289U JP12007289U JPH0362665U JP H0362665 U JPH0362665 U JP H0362665U JP 12007289 U JP12007289 U JP 12007289U JP 12007289 U JP12007289 U JP 12007289U JP H0362665 U JPH0362665 U JP H0362665U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- jet
- rotated
- soldering device
- rotary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000007654 immersion Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の回転式浸漬半田付装置の一実
施例を示す正面図、第２図は第１図に示される実
施例の要部を示す平面図、第３図は実施例の説明
に供される図である。
４……回転テーブル部、４ａ……円盤、８……
噴流半田浴槽、Ｐｃ……回路基板。
Fig. 1 is a front view showing an embodiment of the rotary immersion soldering device of the present invention, Fig. 2 is a plan view showing the main parts of the embodiment shown in Fig. 1, and Fig. 3 is an explanation of the embodiment. FIG. 4...Rotary table section, 4a...Disc, 8...
Jet solder bath, Pc...circuit board.
Claims (1)
せしめ、且つ噴流半田に接触して半田付が行なわ
れる回転式浸漬半田付装置にあつて、 前記回路基板を傾斜して回転移動せしめる回転
手段と、 前記回路基板の回転移動時に溶解半田が接触す
べく、噴流せしめ、前記回路基板を回転移動する
回転テーブルの回転方向に対し、前記噴流方向を
偏角して配設される溶解半田噴流手段と、 を具備することを特徴とする回転式浸漬半田付装
置。[Claims for Utility Model Registration] A rotary immersion soldering device in which a circuit board on which electronic components are mounted is rotated and soldered by contacting jet solder, the circuit board being tilted. a rotating means for rotationally moving the circuit board; and a rotating means for generating a jet so that the molten solder comes into contact with the circuit board when the circuit board is rotated, the jet direction being arranged at an angle with respect to the rotational direction of a rotary table that rotationally moves the circuit board. A rotary immersion soldering device comprising: a molten solder jet means provided therein;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989120072U JPH0735650Y2 (en) | 1989-10-13 | 1989-10-13 | Rotary immersion soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989120072U JPH0735650Y2 (en) | 1989-10-13 | 1989-10-13 | Rotary immersion soldering device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0362665U true JPH0362665U (en) | 1991-06-19 |
| JPH0735650Y2 JPH0735650Y2 (en) | 1995-08-16 |
Family
ID=31668162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989120072U Expired - Lifetime JPH0735650Y2 (en) | 1989-10-13 | 1989-10-13 | Rotary immersion soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0735650Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6393468A (en) * | 1986-10-07 | 1988-04-23 | Fuji Electric Co Ltd | Dip soldering method for semiconductor wafer |
| JPS63242466A (en) * | 1987-03-30 | 1988-10-07 | Tamura Seisakusho Co Ltd | Jet type soldering device |
| JPS6453764A (en) * | 1987-08-24 | 1989-03-01 | Tamura Seisakusho Kk | Method and device for jet soldering |
-
1989
- 1989-10-13 JP JP1989120072U patent/JPH0735650Y2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6393468A (en) * | 1986-10-07 | 1988-04-23 | Fuji Electric Co Ltd | Dip soldering method for semiconductor wafer |
| JPS63242466A (en) * | 1987-03-30 | 1988-10-07 | Tamura Seisakusho Co Ltd | Jet type soldering device |
| JPS6453764A (en) * | 1987-08-24 | 1989-03-01 | Tamura Seisakusho Kk | Method and device for jet soldering |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0735650Y2 (en) | 1995-08-16 |
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