JPH0362665U - - Google Patents

Info

Publication number
JPH0362665U
JPH0362665U JP12007289U JP12007289U JPH0362665U JP H0362665 U JPH0362665 U JP H0362665U JP 12007289 U JP12007289 U JP 12007289U JP 12007289 U JP12007289 U JP 12007289U JP H0362665 U JPH0362665 U JP H0362665U
Authority
JP
Japan
Prior art keywords
circuit board
jet
rotated
soldering device
rotary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12007289U
Other languages
Japanese (ja)
Other versions
JPH0735650Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989120072U priority Critical patent/JPH0735650Y2/en
Publication of JPH0362665U publication Critical patent/JPH0362665U/ja
Application granted granted Critical
Publication of JPH0735650Y2 publication Critical patent/JPH0735650Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の回転式浸漬半田付装置の一実
施例を示す正面図、第2図は第1図に示される実
施例の要部を示す平面図、第3図は実施例の説明
に供される図である。 4……回転テーブル部、4a……円盤、8……
噴流半田浴槽、Pc……回路基板。
Fig. 1 is a front view showing an embodiment of the rotary immersion soldering device of the present invention, Fig. 2 is a plan view showing the main parts of the embodiment shown in Fig. 1, and Fig. 3 is an explanation of the embodiment. FIG. 4...Rotary table section, 4a...Disc, 8...
Jet solder bath, Pc...circuit board.

Claims (1)

【実用新案登録請求の範囲】 電子部品が装着された回路基板を回転して移動
せしめ、且つ噴流半田に接触して半田付が行なわ
れる回転式浸漬半田付装置にあつて、 前記回路基板を傾斜して回転移動せしめる回転
手段と、 前記回路基板の回転移動時に溶解半田が接触す
べく、噴流せしめ、前記回路基板を回転移動する
回転テーブルの回転方向に対し、前記噴流方向を
偏角して配設される溶解半田噴流手段と、 を具備することを特徴とする回転式浸漬半田付装
置。
[Claims for Utility Model Registration] A rotary immersion soldering device in which a circuit board on which electronic components are mounted is rotated and soldered by contacting jet solder, the circuit board being tilted. a rotating means for rotationally moving the circuit board; and a rotating means for generating a jet so that the molten solder comes into contact with the circuit board when the circuit board is rotated, the jet direction being arranged at an angle with respect to the rotational direction of a rotary table that rotationally moves the circuit board. A rotary immersion soldering device comprising: a molten solder jet means provided therein;
JP1989120072U 1989-10-13 1989-10-13 Rotary immersion soldering device Expired - Lifetime JPH0735650Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989120072U JPH0735650Y2 (en) 1989-10-13 1989-10-13 Rotary immersion soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989120072U JPH0735650Y2 (en) 1989-10-13 1989-10-13 Rotary immersion soldering device

Publications (2)

Publication Number Publication Date
JPH0362665U true JPH0362665U (en) 1991-06-19
JPH0735650Y2 JPH0735650Y2 (en) 1995-08-16

Family

ID=31668162

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989120072U Expired - Lifetime JPH0735650Y2 (en) 1989-10-13 1989-10-13 Rotary immersion soldering device

Country Status (1)

Country Link
JP (1) JPH0735650Y2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6393468A (en) * 1986-10-07 1988-04-23 Fuji Electric Co Ltd Dip soldering method for semiconductor wafer
JPS63242466A (en) * 1987-03-30 1988-10-07 Tamura Seisakusho Co Ltd Jet type soldering device
JPS6453764A (en) * 1987-08-24 1989-03-01 Tamura Seisakusho Kk Method and device for jet soldering

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6393468A (en) * 1986-10-07 1988-04-23 Fuji Electric Co Ltd Dip soldering method for semiconductor wafer
JPS63242466A (en) * 1987-03-30 1988-10-07 Tamura Seisakusho Co Ltd Jet type soldering device
JPS6453764A (en) * 1987-08-24 1989-03-01 Tamura Seisakusho Kk Method and device for jet soldering

Also Published As

Publication number Publication date
JPH0735650Y2 (en) 1995-08-16

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