JPS63101174U - - Google Patents
Info
- Publication number
- JPS63101174U JPS63101174U JP19617186U JP19617186U JPS63101174U JP S63101174 U JPS63101174 U JP S63101174U JP 19617186 U JP19617186 U JP 19617186U JP 19617186 U JP19617186 U JP 19617186U JP S63101174 U JPS63101174 U JP S63101174U
- Authority
- JP
- Japan
- Prior art keywords
- head
- heating
- electronic component
- solder
- solder melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 2
- 239000000155 melt Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の原理側面図、第２図は本考案
による一実施例の説明図で、ａは要部側面図、ｂ
はグラフ、第３図は従来の説明図で、ａは側面図
、ｂは要部側面図、ｃはグラフを示す。
図において、１はテーブル、２はプリント基板
、３はヘツド、４はヒータ、５は冷却管、６はフ
ロリナート、７は半田を示す。
Fig. 1 is a side view of the principle of the present invention, Fig. 2 is an explanatory diagram of an embodiment of the present invention, a is a side view of the main part, b
is a graph, and FIG. 3 is a conventional explanatory diagram, in which a is a side view, b is a side view of a main part, and c is a graph. In the figure, 1 is a table, 2 is a printed circuit board, 3 is a head, 4 is a heater, 5 is a cooling pipe, 6 is Fluorinert, and 7 is solder.
Claims (1)
有するプリント基板２を積載するテーブル１と、
所定の該電子部品８の表面に当接されるよう昇降
されるヘツド３とを備え、該ヘツド３の加熱によ
り該半田付けされた半田７の溶融を行う半田溶融
装置において、 前記ヘツド３には加熱する加熱ヒータ４と、冷
却する冷却管５と、循環されるフロリナート６と
が具備されて成ることを特徴とする半田溶融装置
。[Claims for Utility Model Registration] A table 1 on which a printed circuit board 2 having an electronic component 8 mounted by soldering is mounted;
A solder melting apparatus is provided with a head 3 that is moved up and down so as to come into contact with the surface of a predetermined electronic component 8, and melts the solder 7 by heating the head 3. A solder melting device characterized by comprising a heater 4 for heating, a cooling pipe 5 for cooling, and Fluorinert 6 for circulation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19617186U JPS63101174U (en) | 1986-12-18 | 1986-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19617186U JPS63101174U (en) | 1986-12-18 | 1986-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63101174U true JPS63101174U (en) | 1988-07-01 |
Family
ID=31154745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19617186U Pending JPS63101174U (en) | 1986-12-18 | 1986-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63101174U (en) |
-
1986
- 1986-12-18 JP JP19617186U patent/JPS63101174U/ja active Pending
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