JPH03128965U - - Google Patents
Info
- Publication number
- JPH03128965U JPH03128965U JP3888590U JP3888590U JPH03128965U JP H03128965 U JPH03128965 U JP H03128965U JP 3888590 U JP3888590 U JP 3888590U JP 3888590 U JP3888590 U JP 3888590U JP H03128965 U JPH03128965 U JP H03128965U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- hole
- pads
- filled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の実施例の断面図、第２図は本
考案の他の実施例の断面図、第３図はリフロー半
田付装置の構成図、第４図のａ，ｂは従来例の断
面図、第５図は他の従来例の図で、ａは断面図、
ｂはリフロー半田付け時の温度上昇特性図である
。
図において、１は印刷配線板、２はパツド、３
はパターン、５は表面実装部品、６は電極部、７
はリード、１０Ａはペースト状半田、１０は半田
、１５はスルーホール、１６はランド、１８は樹
脂、１９は硬鑞、２１はプレヒート室、２２はリ
フロー室、２５はヒーターをそれぞれ示す。
Fig. 1 is a sectional view of an embodiment of the present invention, Fig. 2 is a sectional view of another embodiment of the invention, Fig. 3 is a configuration diagram of a reflow soldering device, and Fig. 4 a and b are conventional examples. 5 is a diagram of another conventional example, a is a sectional view,
b is a temperature rise characteristic diagram during reflow soldering. In the figure, 1 is a printed wiring board, 2 is a pad, 3
is a pattern, 5 is a surface mount component, 6 is an electrode part, 7
10A is a lead, 10A is a paste solder, 10 is a solder, 15 is a through hole, 16 is a land, 18 is a resin, 19 is a hard solder, 21 is a preheat chamber, 22 is a reflow chamber, and 25 is a heater.
Claims (1)
田付け実装する印刷配線板１において、 それぞれの該パツド２部分に裏面に通じるスル
ーホール１５を設け、熱伝導率が大きい樹脂１８
を該スルーホール１５に充填したことを特徴とす
る表面実装用印刷配線板。 (2) 請求項１に記載の印刷配線板において、 それぞれのパツド２部分に裏面に通じるスルー
ホール１５を設け、硬鑞１９を該スルーホール１
５に充填したことを特徴とする表面実装用印刷配
線板。[Claims for Utility Model Registration] (1) In the printed wiring board 1 on which the surface mount components 5 are mounted on the pads 2 by reflow soldering, through holes 15 leading to the back surface are provided in each of the pads 2, and the thermal conductivity Resin 18 with large
A printed wiring board for surface mounting, characterized in that the through holes 15 are filled with. (2) In the printed wiring board according to claim 1, a through hole 15 communicating with the back side is provided in each pad 2 portion, and a hard solder 19 is inserted into the through hole 1.
5. A printed wiring board for surface mounting, characterized in that the printed wiring board is filled with:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3888590U JPH03128965U (en) | 1990-04-11 | 1990-04-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3888590U JPH03128965U (en) | 1990-04-11 | 1990-04-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03128965U true JPH03128965U (en) | 1991-12-25 |
Family
ID=31547295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3888590U Pending JPH03128965U (en) | 1990-04-11 | 1990-04-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03128965U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015076050A1 (en) * | 2013-11-20 | 2015-05-28 | 日立オートモティブシステムズ株式会社 | Electronic control apparatus mounting structure |
| WO2018016144A1 (en) * | 2016-07-21 | 2018-01-25 | Ｋｙｂ株式会社 | Heat dissipating structure |
-
1990
- 1990-04-11 JP JP3888590U patent/JPH03128965U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015076050A1 (en) * | 2013-11-20 | 2015-05-28 | 日立オートモティブシステムズ株式会社 | Electronic control apparatus mounting structure |
| JPWO2015076050A1 (en) * | 2013-11-20 | 2017-03-16 | 日立オートモティブシステムズ株式会社 | Electronic controller mounting structure |
| WO2018016144A1 (en) * | 2016-07-21 | 2018-01-25 | Ｋｙｂ株式会社 | Heat dissipating structure |