JPS642464U

JPS642464U -

Info

Publication number: JPS642464U
Application number: JP9650087U
Authority: JP
Priority date: 1987-06-25
Filing date: 1987-06-25
Publication date: 1989-01-09

Description

[Brief explanation of the drawing]

第１図Ａは本考案の一実施例の回路基板を用い
て部品が実装された基板の正面図、第１図Ｂは第
１図ＡのＢ−Ｂ線断面図、第１図Ｃは第１図Ａの
基板の底面図、第２図Ａは従来の回路基板を用い
て部品が実装された基板の正面図、第２図Ｂは第
２図ＡのＢ−Ｂ線断面図、第２図Ｃは第２図Ａの
基板の底面図、及び第３図はリフローソルダリン
グを説明するための説明図である。１０……ホツトプレート、２，２０……基板、
３０，ＳＲ１，Ｒ２，Ｚ……表面実装部品、４，
４０……回路パターン、４ａ〜４ｃ……半田付け
部分、５……熱伝導層、５ａ〜５ｃ……分割導電
層、Ｈ１〜Ｈ４……スルーホール接続部。 FIG. 1A is a front view of a board on which components are mounted using a circuit board according to an embodiment of the present invention, FIG. 1B is a sectional view taken along the line B-B of FIG. 1A, and FIG. 1A is a bottom view of the board shown in FIG. 2A, FIG. 2A is a front view of a board on which components are mounted using a conventional circuit board, FIG. FIG. C is a bottom view of the substrate of FIG. 2A, and FIG. 3 is an explanatory diagram for explaining reflow soldering. 10...Hot plate, 2,20...Substrate,
30, SR1, R2, Z...Surface mount component, 4,
40... Circuit pattern, 4a to 4c... Soldering portion, 5... Heat conductive layer, 5a to 5c... Divided conductive layer, H1 to H4... Through hole connection portion.

補正昭６２．７．２８図面の簡単な説明を次のように補正する。明細書第１３頁第１６行〜第１４頁第２行の「
第２図…である。」を下記の通り訂正する。「第２図はリフローソルダリングを説明するた
めの説明図、第３図Ａは従来の回路基板を用いて
部品が実装された基板の面図、第３図Ｂは第３図
ＡのＢ−Ｂ線断面図、第３図Ｃは第３図Ａの基板
の底面図である。」Amendment July 28, 1982 The brief description of the drawing is amended as follows. " from page 13, line 16 to page 14, line 2 of the specification
Figure 2... ' is corrected as follows. "Figure 2 is an explanatory diagram for explaining reflow soldering, Figure 3A is a top view of a board on which components are mounted using a conventional circuit board, and Figure 3B is B--B of Figure 3A. 3C is a bottom view of the substrate in FIG. 3A.

Claims

[Claims for Utility Model Registration] (1) A reflow solder in which a circuit pattern is formed on one surface and a surface mount component is soldered to the circuit pattern by heating from the other surface side by reflow soldering. In the ring circuit board, a thermally conductive layer made of a material with better thermal conductivity than the substrate material is provided on the other surface, and the thermal conductive layer is made of a material with better thermal conductivity than the substrate material, and the heat conductive layer is made of a material with better thermal conductivity than the substrate material. A circuit board for reflow soldering, characterized in that a soldered portion of the circuit pattern to which a surface mount component having a large heat capacity is soldered is connected to the heat conductive layer. (2) The thermally conductive layer is composed of a plurality of divided conductive layers made of a conductive material and electrically insulated from each other; The circuit board for reflow soldering according to claim (1) of the utility model registration, which is connected by a through-hole connection part.