JPS61107162U - - Google Patents
Info
- Publication number
- JPS61107162U JPS61107162U JP1984190790U JP19079084U JPS61107162U JP S61107162 U JPS61107162 U JP S61107162U JP 1984190790 U JP1984190790 U JP 1984190790U JP 19079084 U JP19079084 U JP 19079084U JP S61107162 U JPS61107162 U JP S61107162U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- metal
- printed wiring
- conductor
- based printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 229910010293 ceramic material Inorganic materials 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229920000620 organic polymer Polymers 0.000 claims 1
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図〜第５図は本考案実施例を示し、第１図
は要部断面図、第２図は要部斜視図、第４図は実
施例斜視図、第３図は他の実施例斜視図、第５図
は分割配線板平面図、第６図は従来例斜視図であ
る。
符号の説明、３，１０…金属ベースプリント配
線板、１，１１…ターミナルラウンド、１６，３
０…小基体、１７…半田接合部、１８…フエース
ダウン導体、２０…フエースアツプ導体、２２…
導通部。
Figures 1 to 5 show embodiments of the present invention; Figure 1 is a sectional view of the main part, Figure 2 is a perspective view of the main part, Figure 4 is a perspective view of the embodiment, and Figure 3 is another embodiment. FIG. 5 is a plan view of a divided wiring board, and FIG. 6 is a perspective view of a conventional example. Explanation of symbols, 3, 10...Metal base printed wiring board, 1, 11...Terminal round, 16, 3
0...Small substrate, 17...Solder joint, 18...Face down conductor, 20...Face up conductor, 22...
Continuity part.
Claims (1)
回路構成素子に対して電気的に関連づけられるタ
ーミナルラウンドに、放熱性が良好でない耐熱性
基材よりなる小基体をマウントして上記回路構成
素子とともに半田付けしてなるも、上記小基体の
フエースダウン導体との半田接合部によつて上記
小基体自体を実装面より若干浮かし、上記小基体
を上記金属ベースとは熱的に分離した状態で実装
してなり、上記小基体に上記フエースダウン導体
と該フエースダウン導体とは反対側に位置せるフ
エースアツプ導体を導通させる導通部を予め備え
ることにより、上記小基体のフエースアツプ導体
を上記金属ベースプリント配線板のターミナルラ
ウンドとすることを特徴とする金属ベースプリン
ト配線板のターミナル構造。 (2) 上記小基体とは有機高分子、セラミツクス
材料等の絶縁性基材よりなることを特徴とする実
用新案登録請求の範囲第１項記載の金属ベースプ
リント配線板のターミナル構造。 (3) 上記小基体とはプリント配線板であること
を特徴とする実用新案登録請求の範囲第２項記載
の金属ベースプリント配線板のターミナル構造。 (4) 上記小基体とは分割基板であることを特徴
とする実用新案登録請求の範囲第２項または第３
項記載の金属ベースプリント配線板のターミナル
構造。 (5) 上記導通部とはスルーホール導体であるこ
とを特徴とする実用新案登録請求の範囲第２項ま
たは第３項または第４項記載の金属ベースプリン
ト配線板のターミナル構造。[Claims for Utility Model Registration] (1) A small base made of a heat-resistant base material with poor heat dissipation properties is attached to a terminal round that is electrically associated with a circuit component mounted on a metal-based printed wiring board. Although it is mounted and soldered together with the circuit component, the small base itself is slightly raised above the mounting surface by the solder joint with the face-down conductor of the small base, and the small base is different from the metal base. The face-up conductor of the small base is mounted in a thermally separated state, and the small base is provided with a conductive portion for electrically connecting the face-down conductor and the face-up conductor located on the opposite side of the face-down conductor. A terminal structure of a metal-based printed wiring board, characterized in that the conductor is a terminal round of the metal-based printed wiring board. (2) The terminal structure of a metal-based printed wiring board according to claim 1, wherein the small substrate is made of an insulating substrate such as an organic polymer or a ceramic material. (3) The terminal structure of a metal-based printed wiring board according to claim 2, wherein the small substrate is a printed wiring board. (4) Claims 2 or 3 of the utility model registration claim, characterized in that the above-mentioned small substrate is a divided substrate.
Terminal structure of the metal-based printed wiring board described in . (5) The terminal structure of a metal-based printed wiring board according to claim 2, 3, or 4 of the utility model registration claim, wherein the conductive portion is a through-hole conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984190790U JPS61107162U (en) | 1984-12-18 | 1984-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984190790U JPS61107162U (en) | 1984-12-18 | 1984-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61107162U true JPS61107162U (en) | 1986-07-07 |
Family
ID=30748241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984190790U Pending JPS61107162U (en) | 1984-12-18 | 1984-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61107162U (en) |
-
1984
- 1984-12-18 JP JP1984190790U patent/JPS61107162U/ja active Pending
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