JPS63106180U - - Google Patents

Info

Publication number
JPS63106180U
JPS63106180U JP19915586U JP19915586U JPS63106180U JP S63106180 U JPS63106180 U JP S63106180U JP 19915586 U JP19915586 U JP 19915586U JP 19915586 U JP19915586 U JP 19915586U JP S63106180 U JPS63106180 U JP S63106180U
Authority
JP
Japan
Prior art keywords
ceramic substrate
conductor plate
center
microwave circuit
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19915586U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19915586U priority Critical patent/JPS63106180U/ja
Publication of JPS63106180U publication Critical patent/JPS63106180U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Waveguide Connection Structure (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示すセラミツク基
板の実装構造の平面図、第2図はその側断面図、
第3図は従来のセラミツク基板の実装構造の平面
図、第4図はその側断面図である。 図において、1はセラミツク基板、2は導体板
、3ははんだ、4はケース、5はネジ、6はナツ
ト、7はワイヤー、8は貫通端子、9は導体リボ
ン、10は雄ネジ、11は端子ピン、12は封止
ガラス、13は逃げ穴である。なお、図中同一符
号は同一又は相当部分を示す。
FIG. 1 is a plan view of a mounting structure of a ceramic substrate showing an embodiment of the present invention, and FIG. 2 is a side sectional view thereof.
FIG. 3 is a plan view of a conventional ceramic substrate mounting structure, and FIG. 4 is a side sectional view thereof. In the figure, 1 is a ceramic board, 2 is a conductor plate, 3 is solder, 4 is a case, 5 is a screw, 6 is a nut, 7 is a wire, 8 is a through terminal, 9 is a conductor ribbon, 10 is a male screw, 11 is a A terminal pin, 12 is a sealing glass, and 13 is an escape hole. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] マイクロ波回路を配したセラミツク基板と、こ
のセラミツク基板を表面にはんだ接合し、雄ネジ
を裏面に備えた導体板とH字型の断面形状を有し
、中央の平板の上部に上記導体板を取付けるケー
スと、このケースの中央の平板の下部に配線され
、上記セラミツク基板上のマイクロ波回路にバイ
アス電位を導入するワイヤーにより構成され、こ
のワイヤーとマイクロ波回路を接続するため上記
導体板の雄ネジ部の中心に絶縁貫通端子を備えた
ことを特徴とするセラミツク基板の実装構造。
It has a ceramic substrate on which a microwave circuit is arranged, a conductor plate with a male screw on the back side, which is soldered to the surface of the ceramic substrate, and a conductor plate with an H-shaped cross section, and the conductor plate is placed on the top of the central flat plate. It consists of a mounting case and a wire that is wired to the bottom of the flat plate in the center of the case to introduce a bias potential to the microwave circuit on the ceramic substrate. A ceramic board mounting structure characterized by having an insulation penetration terminal in the center of the screw part.
JP19915586U 1986-12-26 1986-12-26 Pending JPS63106180U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19915586U JPS63106180U (en) 1986-12-26 1986-12-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19915586U JPS63106180U (en) 1986-12-26 1986-12-26

Publications (1)

Publication Number Publication Date
JPS63106180U true JPS63106180U (en) 1988-07-08

Family

ID=31160514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19915586U Pending JPS63106180U (en) 1986-12-26 1986-12-26

Country Status (1)

Country Link
JP (1) JPS63106180U (en)

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