JPS6322776U - - Google Patents

Info

Publication number
JPS6322776U
JPS6322776U JP1986115916U JP11591686U JPS6322776U JP S6322776 U JPS6322776 U JP S6322776U JP 1986115916 U JP1986115916 U JP 1986115916U JP 11591686 U JP11591686 U JP 11591686U JP S6322776 U JPS6322776 U JP S6322776U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
insulating substrate
conductive pattern
resistance layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986115916U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986115916U priority Critical patent/JPS6322776U/ja
Priority to KR2019870004588U priority patent/KR900004079Y1/en
Publication of JPS6322776U publication Critical patent/JPS6322776U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例に係るプリント配線
板の平面図、第２図はそのプリント配線板に電子
部品を実装した状態を示す断面図、第３図は従来
のプリント配線板の断面図である。 １……絶縁基板、２……導電パターン、２ａ…
…ランド部、３……電子部品、４……リード端子
、５……取付孔、８……半田、９……表示部、１
０……半田抵抗層。 Fig. 1 is a plan view of a printed wiring board according to an embodiment of the present invention, Fig. 2 is a sectional view showing a state in which electronic components are mounted on the printed wiring board, and Fig. 3 is a sectional view of a conventional printed wiring board. It is a diagram. 1... Insulating substrate, 2... Conductive pattern, 2a...
...Land part, 3...Electronic component, 4...Lead terminal, 5...Mounting hole, 8...Solder, 9...Display part, 1
0...Solder resistance layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 導電パターンを有する絶縁基板に、該導電パタ
ーンの半田付け用ランド部を残して半田抵抗層を
形成してなるプリント配線板において、少なくと
も前記ランド部が近接状態で相対向する絶縁基板
上に、絶縁材料からなる表示部を印刷形成し、該
表示部が光透過性の良い材料からなる前記半田抵
抗層を通して視認できるように構成したことを特
徴とするプリント配線板。 In a printed wiring board in which a solder resistance layer is formed on an insulating substrate having a conductive pattern, leaving a soldering land portion of the conductive pattern, at least the land portion is insulated on the insulating substrate facing each other in a close state. 1. A printed wiring board, characterized in that a display section made of a material is formed by printing, and the display section is configured to be visible through the solder resistance layer made of a material with good light transmittance.
JP1986115916U 1986-07-30 1986-07-30 Pending JPS6322776U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1986115916U JPS6322776U (en) 1986-07-30 1986-07-30
KR2019870004588U KR900004079Y1 (en) 1986-07-30 1987-04-04 A printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986115916U JPS6322776U (en) 1986-07-30 1986-07-30

Publications (1)

Publication Number Publication Date
JPS6322776U true JPS6322776U (en) 1988-02-15

Family

ID=31000020

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986115916U Pending JPS6322776U (en) 1986-07-30 1986-07-30

Country Status (2)

Country Link
JP (1) JPS6322776U (en)
KR (1) KR900004079Y1 (en)

Also Published As

Publication number Publication date
KR900004079Y1 (en) 1990-05-08
KR880003790U (en) 1988-04-14

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