JPS62162873U - - Google Patents
Info
- Publication number
- JPS62162873U JPS62162873U JP5083486U JP5083486U JPS62162873U JP S62162873 U JPS62162873 U JP S62162873U JP 5083486 U JP5083486 U JP 5083486U JP 5083486 U JP5083486 U JP 5083486U JP S62162873 U JPS62162873 U JP S62162873U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- land
- wiring board
- printed wiring
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例に係るプリント配線
板のランド部近傍を示す平面図、第２図はこれら
ランド部上に電子部品の端子をはんだ付けした状
態を示す平面図、第３図は従来のプリント配線板
のランド部近傍とそこに実装されるＩＣとを示す
斜視図、第４図は、隣接する端子どうしが短絡さ
れるブリツジを示す断面図である。
１……プリント配線板、２……絶縁基板、４…
…ランド部、５……はんだ、７……端子、１０…
…パターン拡大部。
FIG. 1 is a plan view showing the vicinity of the lands of a printed wiring board according to an embodiment of the present invention, FIG. 2 is a plan view showing the terminals of electronic components soldered onto these lands, and FIG. 4 is a perspective view showing the vicinity of a land portion of a conventional printed wiring board and an IC mounted thereon, and FIG. 4 is a sectional view showing a bridge in which adjacent terminals are short-circuited. 1...Printed wiring board, 2...Insulating board, 4...
...Land portion, 5...Solder, 7...Terminal, 10...
...Pattern enlargement section.
Claims (1)
に、電子部品の端子をはんだ付けするためのラン
ド部を設けてなるプリント配線板において、前記
ランド部近傍の導体パターンの一部に、当該ラン
ド部よりも幅広で前記絶縁基板上に露呈出し、か
つ絶縁基板表面でランド部との導通開係が保たれ
ているパターン拡大部を拡大部を設けたことを特
徴とするプリント配線板。 (2) 実用新案登録請求の範囲第(1)項記載におい
て、隣り合う一方のランド部に対応する前記パタ
ーン拡大部と他方のランド部に対応する前記パタ
ーン拡大部とが互いに隣接しあわないように、こ
れらパターン拡大部をランド部を挟んで交互に配
置したことを特徴とするプリント配線板。[Claims for Utility Model Registration] (1) In a printed wiring board in which a land portion for soldering a terminal of an electronic component is provided on a part of a conductive pattern formed on an insulating substrate, An enlarged pattern part is provided in a part of the conductor pattern, which is wider than the land part, is exposed on the insulating substrate, and maintains conductivity with the land part on the surface of the insulating substrate. Features printed wiring board. (2) In claim (1) of the utility model registration, the pattern enlarged portion corresponding to one adjacent land portion and the pattern enlarged portion corresponding to the other land portion may not be adjacent to each other. A printed wiring board characterized in that these pattern enlarged portions are alternately arranged with land portions in between.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5083486U JPS62162873U (en) | 1986-04-07 | 1986-04-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5083486U JPS62162873U (en) | 1986-04-07 | 1986-04-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62162873U true JPS62162873U (en) | 1987-10-16 |
Family
ID=30874552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5083486U Pending JPS62162873U (en) | 1986-04-07 | 1986-04-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62162873U (en) |
-
1986
- 1986-04-07 JP JP5083486U patent/JPS62162873U/ja active Pending
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