JPS6291470U - - Google Patents

Info

Publication number
JPS6291470U
JPS6291470U JP18212385U JP18212385U JPS6291470U JP S6291470 U JPS6291470 U JP S6291470U JP 18212385 U JP18212385 U JP 18212385U JP 18212385 U JP18212385 U JP 18212385U JP S6291470 U JPS6291470 U JP S6291470U
Authority
JP
Japan
Prior art keywords
lands
wiring board
printed wiring
insulating substrate
conductive foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18212385U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18212385U priority Critical patent/JPS6291470U/ja
Publication of JPS6291470U publication Critical patent/JPS6291470U/ja
Pending legal-status Critical Current

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  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す図、第2図は
本考案の他の実施例を示す図、第3図は従来例を
示す図、第4図は第3図に示された従来例に半田
が付着した状態を示す図、第5図は第4図の側面
図、第6図は従来例の欠点を説明するための平面
図である。 2,2′……ランド、5′……半田部、9……
回路パターン、10……表示部。
Fig. 1 is a diagram showing one embodiment of the present invention, Fig. 2 is a diagram showing another embodiment of the invention, Fig. 3 is a diagram showing a conventional example, and Fig. 4 is shown in Fig. 3. FIG. 5 is a side view of FIG. 4, and FIG. 6 is a plan view for explaining the drawbacks of the conventional example. 2, 2'...Land, 5'...Solder part, 9...
Circuit pattern, 10...display section.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板と、前記絶縁基板に近接して形成され
た一対のランドと、前記ランド相互間を電気的に
接続する接続用導箔とを具備する印刷配線基板に
おいて、前記ランド相互間が一体的に半田付けさ
れることを示す記号をシルク印刷により、前記ラ
ンド若しくは接続用導箔の近傍に形成したことを
特徴とする印刷配線基板。
In a printed wiring board comprising an insulating substrate, a pair of lands formed close to the insulating substrate, and a connecting conductive foil that electrically connects the lands, the lands are integrally connected to each other. 1. A printed wiring board, characterized in that a symbol indicating that it will be soldered is formed near the land or the connection conductive foil by silk printing.
JP18212385U 1985-11-26 1985-11-26 Pending JPS6291470U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18212385U JPS6291470U (en) 1985-11-26 1985-11-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18212385U JPS6291470U (en) 1985-11-26 1985-11-26

Publications (1)

Publication Number Publication Date
JPS6291470U true JPS6291470U (en) 1987-06-11

Family

ID=31127626

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18212385U Pending JPS6291470U (en) 1985-11-26 1985-11-26

Country Status (1)

Country Link
JP (1) JPS6291470U (en)

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