JPS6071168U - Terminal connection structure - Google Patents
Terminal connection structureInfo
- Publication number
- JPS6071168U JPS6071168U JP16145783U JP16145783U JPS6071168U JP S6071168 U JPS6071168 U JP S6071168U JP 16145783 U JP16145783 U JP 16145783U JP 16145783 U JP16145783 U JP 16145783U JP S6071168 U JPS6071168 U JP S6071168U
- Authority
- JP
- Japan
- Prior art keywords
- connection structure
- conductive layer
- terminal connection
- substrate
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の接続端子板と接続端子部の接触状態を示
す断面図、第2図はその接続端子部が接続端子板によっ
て寸断された状態を示す断面図、第3図〜第6図はいず
れもこの考案の接続端子構造を示すものであり、第3図
はこの考案の接続端子部が形成された印刷配線基板の平
面図1、第4図は第3図A−Aにて切断した接続端子部
に接続端子板を接触させた状態を示す拡大断面図、第5
図および第6図はいずれも他の実施例を示す平面図であ
る。
10・・・・・・印刷配線基板(基板)、20・・・・
・・接続端子部、22・・・・・・半田メッキ層(半田
付は可能な導電層)、23・・・・・・カーボン層(半
田付は防止層)、23a・・・・・・中央部、23b・
・・・・・周縁部、−24・・・・・・接触部。Fig. 1 is a sectional view showing the contact state between the conventional connecting terminal plate and the connecting terminal part, Fig. 2 is a sectional view showing the state in which the connecting terminal part is cut by the connecting terminal plate, and Figs. 3 to 6. 3 shows the connecting terminal structure of this invention, and FIG. 3 is a plan view 1 of the printed wiring board on which the connecting terminal portion of this invention is formed, and FIG. 4 is a plan view taken along the line A-A in FIG. 5th enlarged cross-sectional view showing a state in which the connecting terminal plate is in contact with the connected terminal portion
Both FIG. 6 and FIG. 6 are plan views showing other embodiments. 10...Printed wiring board (substrate), 20...
... Connection terminal section, 22 ... Solder plating layer (conductive layer that can be soldered), 23 ... Carbon layer (soldering prevention layer), 23a ... Central part, 23b・
...Peripheral part, -24...Contact part.
Claims (1)
と、この導電層上に形成され、中央部とこれを囲繞する
周縁部とからなる半田付は不可能な半田付は防止層と、
この半田付は防止層の前記中央部と周縁部の間で前記導
電層に半田付けされ、前記半田付は防止層の上部まで隆
起して形成された接触部とを具備してなる接続端子構造
。a substrate, a solderable conductive layer fixed on the substrate, and a solderable prevention layer formed on the conductive layer and consisting of a central portion and a peripheral portion surrounding the central portion; and,
This soldering is soldered to the conductive layer between the central part and the peripheral part of the prevention layer, and the soldering is a connection terminal structure comprising a contact part formed by protruding to the top of the prevention layer. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16145783U JPS6071168U (en) | 1983-10-18 | 1983-10-18 | Terminal connection structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16145783U JPS6071168U (en) | 1983-10-18 | 1983-10-18 | Terminal connection structure |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6071168U true JPS6071168U (en) | 1985-05-20 |
JPH047532Y2 JPH047532Y2 (en) | 1992-02-27 |
Family
ID=30354825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16145783U Granted JPS6071168U (en) | 1983-10-18 | 1983-10-18 | Terminal connection structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6071168U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008152283A (en) * | 2003-08-21 | 2008-07-03 | Samsung Electronics Co Ltd | Image recorder |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5181958U (en) * | 1974-12-24 | 1976-06-30 | ||
JPS522852U (en) * | 1975-06-24 | 1977-01-10 |
-
1983
- 1983-10-18 JP JP16145783U patent/JPS6071168U/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5181958U (en) * | 1974-12-24 | 1976-06-30 | ||
JPS522852U (en) * | 1975-06-24 | 1977-01-10 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008152283A (en) * | 2003-08-21 | 2008-07-03 | Samsung Electronics Co Ltd | Image recorder |
JP4536786B2 (en) * | 2003-08-21 | 2010-09-01 | 三星電子株式会社 | Image recording device |
Also Published As
Publication number | Publication date |
---|---|
JPH047532Y2 (en) | 1992-02-27 |
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