JPH0220367U - - Google Patents
Info
- Publication number
- JPH0220367U JPH0220367U JP9862888U JP9862888U JPH0220367U JP H0220367 U JPH0220367 U JP H0220367U JP 9862888 U JP9862888 U JP 9862888U JP 9862888 U JP9862888 U JP 9862888U JP H0220367 U JPH0220367 U JP H0220367U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- thermal conductivity
- high thermal
- hollowed out
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は、本考案の複合型表面実装プリント基
板に部品が実装された状態を示す側面図である。
第２図は、従来の表面実装プリント基板に部品が
実装された状態を示す側面図である。
１……熱伝導率の高い平板、２……本考案の表
面実装プリント基板、３……熱伝導率の高い絶縁
板、４……半田付け可能な熱伝導率の高い金属板
、５……発熱部品、６……半田付け部、７……ネ
ジ穴、８……くりぬき窓、９……一般チツプ部品
、１０……発熱部品の端子、１１……従来の表面
実装プリント基板、２２……発熱部品取り付けネ
ジ、３３……従来の放熱器、４４……放熱器取り
付けネジ、５５……本考案の複合型表面実装プリ
ント基板。
FIG. 1 is a side view showing a state in which components are mounted on a composite type surface mount printed circuit board of the present invention.
FIG. 2 is a side view showing a state in which components are mounted on a conventional surface mount printed circuit board. 1... Flat plate with high thermal conductivity, 2... Surface mount printed circuit board of the present invention, 3... Insulating plate with high thermal conductivity, 4... Metal plate with high thermal conductivity that can be soldered, 5... Heat generating component, 6... Soldering part, 7... Screw hole, 8... Hollowed out window, 9... General chip component, 10... Terminal of heat generating component, 11... Conventional surface mount printed circuit board, 22... Heat-generating component mounting screw, 33... Conventional heatsink, 44... Heatsink mounting screw, 55... Composite surface mount printed circuit board of the present invention.
Claims (1)
を密着した複合型プリント基板に於て、プリント
基板の実装スペースの一部をくりぬき、このくり
ぬき箇所から露出した該平板に熱伝導率の高い絶
縁板を密着し、更に該絶縁板の上に半田付けの可
能な熱伝導率の高い金属板を密着した事を特徴と
する複合型表面実装プリント基板。 In a composite printed circuit board that has a surface-mounted printed circuit board and a flat plate with high thermal conductivity in close contact with each other, a part of the mounting space of the printed circuit board is hollowed out, and an insulating plate with high thermal conductivity is placed on the flat plate exposed from the hollowed out part. A composite surface mount printed circuit board, characterized in that a solderable metal plate with high thermal conductivity is closely attached to the insulating plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9862888U JPH0220367U (en) | 1988-07-25 | 1988-07-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9862888U JPH0220367U (en) | 1988-07-25 | 1988-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0220367U true JPH0220367U (en) | 1990-02-09 |
Family
ID=31325072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9862888U Pending JPH0220367U (en) | 1988-07-25 | 1988-07-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0220367U (en) |
-
1988
- 1988-07-25 JP JP9862888U patent/JPH0220367U/ja active Pending
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