JPS6426875U - - Google Patents
Info
- Publication number
- JPS6426875U JPS6426875U JP1987122229U JP12222987U JPS6426875U JP S6426875 U JPS6426875 U JP S6426875U JP 1987122229 U JP1987122229 U JP 1987122229U JP 12222987 U JP12222987 U JP 12222987U JP S6426875 U JPS6426875 U JP S6426875U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- spacer
- plate
- insulating material
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図イはこの考案による電子部品取付用スペ
ーサを示す斜視図、第１図ロは発光素子を示す斜
視図、第２図は実装状態を示す要部縦断面図、第
３図は第２図の側面図、第４図はこの考案におけ
る電子部品取付用スペーサの放熱板の内部構造を
示す図、第５図は従来の電子部品取付用スペーサ
の例を示す斜視図である。
図中１，２はリード線、３は発光素子、４は板
状片、５は受金部、６は放熱板、７は電子部品取
付用スペーサ、８はプリント配線基板、９はプリ
ント配線基板の貫通孔、１０は半田付け部、１１
は回路パターン、１２はスペーサ、１３はスペー
サの貫通孔である。尚、図中同一符号は同一また
は相当部分を示す。
FIG. 1A is a perspective view showing a spacer for mounting electronic components according to this invention, FIG. 1B is a perspective view showing a light emitting element, FIG. FIG. 4 is a diagram showing the internal structure of the heat sink of the spacer for mounting electronic components in this invention, and FIG. 5 is a perspective view showing an example of a conventional spacer for mounting electronic components. In the figure, 1 and 2 are lead wires, 3 is a light emitting element, 4 is a plate piece, 5 is a metal receiver, 6 is a heat sink, 7 is a spacer for mounting electronic components, 8 is a printed wiring board, and 9 is a printed wiring board through hole, 10 is soldering part, 11
12 is a circuit pattern, 12 is a spacer, and 13 is a through hole of the spacer. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
本のリード線の間隔にほぼ等しい厚さを有し、絶
縁材料で形成された板状片と、この板状片の底部
に設けられ、絶縁材料で形成された放熱板と、前
記放熱板に設けられ上記リード線を嵌合する熱伝
導性の良い金属材料で形成された受金部とを具備
したことを特徴とする電子部品取付用スペーサ。 2 above so that the two lead wires of the electronic component straddle
A plate-like piece made of an insulating material and having a thickness approximately equal to the spacing between the lead wires of a book; a heat sink formed of an insulating material and provided at the bottom of the plate-like piece; A spacer for mounting an electronic component, comprising a receiving part made of a metal material with good thermal conductivity, into which the lead wire is fitted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987122229U JPS6426875U (en) | 1987-08-10 | 1987-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987122229U JPS6426875U (en) | 1987-08-10 | 1987-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6426875U true JPS6426875U (en) | 1989-02-15 |
Family
ID=31369962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987122229U Pending JPS6426875U (en) | 1987-08-10 | 1987-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6426875U (en) |
-
1987
- 1987-08-10 JP JP1987122229U patent/JPS6426875U/ja active Pending
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