JPS6188267U - - Google Patents
Info
- Publication number
- JPS6188267U JPS6188267U JP17450984U JP17450984U JPS6188267U JP S6188267 U JPS6188267 U JP S6188267U JP 17450984 U JP17450984 U JP 17450984U JP 17450984 U JP17450984 U JP 17450984U JP S6188267 U JPS6188267 U JP S6188267U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- electrodes
- hole
- wiring patterns
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案一実施例のチツプ部品実装前の
図で、Ａは断面図、Ｂは斜視図、第２図は同じく
実装後の図、第３図、第４図は従来装置の断面図
である。
１……チツプ部品、１ａ，１ｂ……電極、２…
…基板、２ａ……表面、２ｂ……裏面、３，５…
…配線パターン、４……半田、６……透孔。
Figure 1 is a diagram of an embodiment of the present invention before chip components are mounted, A is a cross-sectional view, B is a perspective view, Figure 2 is a diagram after mounting, and Figures 3 and 4 are cross-sections of a conventional device. It is a diagram. 1... Chip parts, 1a, 1b... Electrodes, 2...
...Substrate, 2a...front surface, 2b...back surface, 3,5...
...Wiring pattern, 4...Solder, 6...Through hole.
Claims (1)
面の配線パターンを結び該チツプ部品の断面とほ
ぼ同一の断面を有する透孔が設けられた両面印刷
配線板とを備え、 前記透孔に前記チツプ部品を前記両端の電極が
前記表裏両面の配線パターンにそれぞれ近接する
ように嵌挿し、前記両端の電極を前記表裏両面の
配線パターンに半田付することにより前記両面印
刷配線板の表裏両面の電気的接続を行なうことを
特徴とするチツプ部品取付装置。 (2) 前記裏面或は表面の配線パターンには粘着
剤が塗布され前記表面或は裏面の透孔から前記チ
ツプ部品が嵌挿された後に前記粘着剤を除去する
ことを特徴とする実用新案登録請求の範囲第１項
記載のチツプ部品取付装置。[Scope of Claim for Utility Model Registration] (1) A chip component having electrodes at both ends, and a double-sided printed wiring board provided with a through hole having a cross section that is almost the same as the cross section of the chip component, connecting wiring patterns on both the front and back sides. The chip component is fitted into the through hole so that the electrodes at both ends are close to the wiring patterns on both the front and back surfaces, respectively, and the electrodes at both ends are soldered to the wiring patterns on both the front and back surfaces. A chip component mounting device characterized by electrically connecting both the front and back sides of a printed wiring board. (2) Registration of a utility model characterized in that an adhesive is applied to the wiring pattern on the back side or the front side, and the adhesive is removed after the chip component is inserted through the through hole on the front side or the back side. A chip component mounting device according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17450984U JPS6188267U (en) | 1984-11-16 | 1984-11-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17450984U JPS6188267U (en) | 1984-11-16 | 1984-11-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6188267U true JPS6188267U (en) | 1986-06-09 |
Family
ID=30732126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17450984U Pending JPS6188267U (en) | 1984-11-16 | 1984-11-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6188267U (en) |
-
1984
- 1984-11-16 JP JP17450984U patent/JPS6188267U/ja active Pending