JPH031470U - - Google Patents
Info
- Publication number
- JPH031470U JPH031470U JP5876289U JP5876289U JPH031470U JP H031470 U JPH031470 U JP H031470U JP 5876289 U JP5876289 U JP 5876289U JP 5876289 U JP5876289 U JP 5876289U JP H031470 U JPH031470 U JP H031470U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- printed circuit
- board
- solder
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の原理図、第２図は本考案の一
実施例を示す構成図、第３図は本考案の他の実施
例を示す構成図、第４図は従来のプリント基板の
構成図である。
図中、１０はプリント基板、１２は捨てパター
ン、３２は位置決め部（半田付着力の弱い部材）
、４０は半田である。
Fig. 1 is a diagram showing the principle of the present invention, Fig. 2 is a block diagram showing one embodiment of the present invention, Fig. 3 is a block diagram showing another embodiment of the present invention, and Fig. 4 is a diagram of a conventional printed circuit board. FIG. In the figure, 10 is a printed circuit board, 12 is a discarded pattern, and 32 is a positioning part (a member with weak solder adhesion).
, 40 is solder.
Claims (1)
ンと接続された部品ランドに回路部品の一部を半
田付けするプリント基板において、 該基板の半田付け面に露出する半田付着力の弱
い部材３２の近傍に、半田４０を付着する捨てパ
ターン１２を前記配線パターンとは独立して形成
してなることを特徴とするプリント基板。[Scope of Utility Model Registration Claim] In a printed circuit board in which a wiring pattern is formed on an insulating board and a part of a circuit component is soldered to a component land connected to the pattern, solder exposed on the soldering surface of the board A printed circuit board characterized in that a sacrificial pattern 12 to which solder 40 is attached is formed in the vicinity of a member 32 with weak adhesive strength, independent of the wiring pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989058762U JPH0737332Y2 (en) | 1989-05-22 | 1989-05-22 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989058762U JPH0737332Y2 (en) | 1989-05-22 | 1989-05-22 | Printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH031470U true JPH031470U (en) | 1991-01-09 |
| JPH0737332Y2 JPH0737332Y2 (en) | 1995-08-23 |
Family
ID=31584667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989058762U Expired - Lifetime JPH0737332Y2 (en) | 1989-05-22 | 1989-05-22 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0737332Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5710770U (en) * | 1980-06-20 | 1982-01-20 | ||
| JPS6071170U (en) * | 1983-10-21 | 1985-05-20 | 三菱電機株式会社 | Parts mounting mechanism |
-
1989
- 1989-05-22 JP JP1989058762U patent/JPH0737332Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5710770U (en) * | 1980-06-20 | 1982-01-20 | ||
| JPS6071170U (en) * | 1983-10-21 | 1985-05-20 | 三菱電機株式会社 | Parts mounting mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0737332Y2 (en) | 1995-08-23 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |