JPH01174912U - - Google Patents
Info
- Publication number
- JPH01174912U JPH01174912U JP7197188U JP7197188U JPH01174912U JP H01174912 U JPH01174912 U JP H01174912U JP 7197188 U JP7197188 U JP 7197188U JP 7197188 U JP7197188 U JP 7197188U JP H01174912 U JPH01174912 U JP H01174912U
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- wiring board
- printed wiring
- chip component
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図ａ
は実装状態の正面図、第２図ｂは第２図ａのＡ−
Ａ線に沿う断面図、第３図は従来のチツプ部品の
斜視図、第４図は従来の実装における不具合を示
す正面図である。
１，１１……チツプ部品、２，１２……電極、
３……溝部、４，１４……プリント配線基板、５
，１５……半田、６……導体膜。
Figure 1 is a perspective view of one embodiment of the present invention, Figure 2 a
is a front view of the mounted state, and Fig. 2b is A- of Fig. 2a.
3 is a perspective view of a conventional chip component, and FIG. 4 is a front view showing defects in conventional mounting. 1, 11... Chip parts, 2, 12... Electrodes,
3...Groove portion, 4, 14...Printed wiring board, 5
, 15...Solder, 6...Conductor film.
Claims (1)
板等に半田付けして実装を行う表面実装用のチツ
プ部品において、前記電極の端部にプリント配線
基板等のマウント面に対して垂直となる方向の溝
部を形成したことを特徴とする表面実装用チツプ
部品。 In a surface mount chip component that has electrodes at both ends and is mounted by soldering the electrodes to a printed wiring board, etc., a direction perpendicular to the mounting surface of the printed wiring board, etc. is attached to the end of the electrode. A surface mounting chip component characterized by having a groove formed therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7197188U JPH01174912U (en) | 1988-05-31 | 1988-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7197188U JPH01174912U (en) | 1988-05-31 | 1988-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01174912U true JPH01174912U (en) | 1989-12-13 |
Family
ID=31297153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7197188U Pending JPH01174912U (en) | 1988-05-31 | 1988-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01174912U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6258030B2 (en) * | 1979-11-19 | 1987-12-03 | Tokyo Shibaura Electric Co |
-
1988
- 1988-05-31 JP JP7197188U patent/JPH01174912U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6258030B2 (en) * | 1979-11-19 | 1987-12-03 | Tokyo Shibaura Electric Co |