JPH0735650Y2 - Rotary immersion soldering device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a rotary immersion soldering device for rotating a circuit board and soldering mounted electronic components by jet soldering.

[Conventional technology]

Conventionally, as a means for soldering electronic components related to a circuit board in which through holes and the like are formed, vapor condensation, ultrasonic waves, laser,
A soldering method such as immersion is used.

The conventional rotary immersion soldering device used in such an immersion soldering method is a device having a relatively small occupied area, and the rotary table to which the circuit board is attached is arranged in the center of the upper surface,
Electronic components are mounted on the turntable through the through holes of the circuit board. Then, the circuit board is attached to the turntable and rotated once. During this time, first
Flux applies flux to the soldering surface (wiring pattern and lead wires of electronic parts), and then preheating is performed by the preheater. Further, the molten solder is formed at a constant temperature, and the wiring pattern of the circuit board and the lead wire of the electronic component are soldered in a jet solder bath in which the molten solder is jetted.
After that, cooling after soldering is performed by blowing air from the cooling fan, and the step of soldering one circuit board is completed. Then, the next circuit board is continuously subjected to such a step, and a step of soldering a plurality of circuit boards is performed.

[Problems to be solved by the device]

However, according to the conventional rotary immersion soldering device, the rotary table is rotated horizontally, that is, orthogonal to the jet solder. In such a rotary immersion soldering device, there is a drawback that the solder is not satisfactorily released after the molten solder comes into contact with the wiring pattern and the lead wire of the electronic component, and flicker, peaks, bridges and the like are likely to occur. Was there.

The present invention has been made in view of the above problems, and the contact between the jet solder and the soldering surface of the circuit board is appropriately performed with an inclination, and for example, flicker, peaks, and bridges are less likely to occur, and high-quality soldering is possible. It is an object of the present invention to provide a rotary type immersion soldering device.

[Means for Solving the Problems]

In order to solve the above-mentioned problems, in the rotary immersion soldering device of the present invention, the circuit board on which the electronic components are mounted is rotated and moved, and is bonded to the jet solder for soldering. In the soldering device, a rotating means for inclining and rotating the circuit board, and a rotating direction of a rotating table for jetting the melted solder so that the molten solder is joined when the circuit board is rotationally moved and rotating the circuit board. As opposed to
And a molten solder jetting means arranged so as to deviate the jetting direction.

[Action]

In the rotary immersion soldering device of the present invention configured as described above, the circuit board is tilted and rotationally moved to make contact between the jet solder, the wiring pattern, and the lead wire of the electronic component.

〔Example〕

Next, an embodiment of the rotary immersion soldering device according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a front view showing an embodiment, FIG. 2 is a plan view showing essential parts, and FIG. 3 is a partially enlarged view used for explanation.

In FIGS. 1 and 2, a portion indicated by reference numeral 2 is a carriage,
A part indicated by C _SW is a control changeover switch part for performing sequence control of each part of the apparatus and setting such as constant temperature adjustment. Then, as shown in the figure, on the carriage 2, a turntable portion 4 for rotating the circuit board Pc at an angle of 5 degrees, a mounting portion 5 of the circuit board Pc, a fluxer 6, a preheater 7, and a jet flow. A solder bath 8 and a cooling fan 10 are provided.

The portions indicated by reference numerals 2a and 2b are a moving roller and a fixing hook.

The center of the disc 4a of the rotary table 4 is fixed to a motor (not shown) shaft. In this case, as shown in the figure, they are fixed with an inclination of 5 degrees with respect to the vertical line.

In such a configuration, the circuit board Pc on which the electronic component is mounted is fixed to the mounting portion of the turntable 4a and rotated once, and the wiring pattern of the circuit board Pc and the lead wire of the electronic component are rotated during this one rotation. Soldering is performed (the arrangement state of the circuit board Pc here is shown by a dotted line).

In this case, first, flux is applied to the soldering surface (wiring pattern and lead wire of electronic component) by the fluxer 6, and then preheating is performed by the preheater 7 to perform soldering without "uniformity". . Further, solder is applied to the soldering surface of the circuit board in the jet solder bath 8 in which the melted solder is jetted while being controlled to a constant temperature. In the soldering here, the molten solder is jetted from the jet portion 8a from the nozzle and comes into contact with the solder surface of the circuit board Pc that rotates and moves to perform soldering. In this case, in the embodiment, the circuit board Pc is configured so as to rotate forward while tilting forward at an angle of 5 degrees with respect to the rotation direction, and comes into contact with the jetted molten solder. Therefore, the detachment (outflow) of the solder adhering to the solder surface is favorably carried out along with the rotational movement, and flicker, peaks, and bridges are less likely to occur.

The circuit board Pc may be tilted backward with respect to the rotation direction, but the forward tilted posture as in the embodiment can be more favorably soldered in terms of preventing the lead wires from rising.

After that, cooling after soldering is performed by blowing air from the cooling fan 10, and the step of soldering one circuit board Pc is completed. Such a process is continuously performed, and a plurality of circuit boards Pc
The soldering process is performed.

Further, when soldering is performed in this manner, the jet portion 8a (shown by a solid line) is angled with respect to the angle shown in FIG. 2, that is, in this example, with respect to the orthogonal line of the rotary tangent line of the rotary table 4a. , 20 to 30 degrees are arranged and soldering is performed, so that the soldering is performed more effectively.

FIG. 3 shows the wiring pattern of the circuit board Pc. As can be easily understood from the drawing, the wiring pattern and the soldered portion (the circled portion shown) of the lead wire of the electronic component are limited by the shape of the general-purpose electronic component and are arranged in parallel. Therefore, in the rotational movement of the rotary table 4a (in the direction indicated by the one-dot chain line arrow), the plurality of soldering portions continuously pass one viewpoint at relatively narrow intervals (n shown in the figure),
Although the bridge is likely to occur, in the embodiment, as shown by the solid line in FIG. 2, that is, the jet portion 8a is arranged at an angle of 20 to 30 degrees with respect to the orthogonal line of the rotation tangent line. The molten solder is jetted in the direction indicated by the solid arrow. Thereby, there is an advantage that the interval (m shown in the drawing) when the soldering portion continuously passes one viewpoint is enlarged, and the bridge hardly occurs.

[Effect of device]

As described above, according to the rotary immersion soldering device of the present invention, the rotating means for tilting and rotating the circuit board on which the electronic component is formed and the molten solder should be in contact with each other when the circuit board is rotated and moved. And a melted solder jet means arranged so as to deviate the jet direction with respect to the rotation direction of the turntable that causes the jet to rotate and move the circuit board, whereby the jet solder and the circuit are provided. The contact with the soldering surface of the substrate is appropriately performed by sloping and eccentrically arranging, and, for example, flicker, peaks and bridges are less likely to be introduced, and high-quality soldering can be performed.

[Brief description of drawings]

FIG. 1 is a front view showing an embodiment of the rotary immersion soldering device of the present invention, FIG. 2 is a plan view showing the essential parts of the embodiment shown in FIG. 1, and FIG. 3 is an explanation of the embodiment. FIG. 4 ... rotary table part, 4a ... disk, 8 ... jet solder bath, Pc ... circuit board.

Claims (1)

[Scope of utility model registration request] 1. A rotary immersion soldering device for rotating and moving a circuit board on which electronic components are mounted, and for soldering by contact with jet solder, wherein the circuit board is tilted and rotated. The jetting direction is arranged so as to be deviated from the rotating direction of the rotating means for moving and the rotating table for jetting the molten solder so that the molten solder comes into contact when the circuit board is rotationally moved. A rotary immersion soldering device comprising: a melted solder jet means.