JPH07307560A - Mounting method of electronic component - Google Patents

Mounting method of electronic component

Info

Publication number
JPH07307560A
JPH07307560A JP9723994A JP9723994A JPH07307560A JP H07307560 A JPH07307560 A JP H07307560A JP 9723994 A JP9723994 A JP 9723994A JP 9723994 A JP9723994 A JP 9723994A JP H07307560 A JPH07307560 A JP H07307560A
Authority
JP
Japan
Prior art keywords
electronic component
circuit board
printed circuit
bond
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9723994A
Other languages
Japanese (ja)
Other versions
JP3237392B2 (en
Inventor
Toshio Nishi
壽雄 西
Seiichi Yoshinaga
誠一 吉永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP09723994A priority Critical patent/JP3237392B2/en
Publication of JPH07307560A publication Critical patent/JPH07307560A/en
Application granted granted Critical
Publication of JP3237392B2 publication Critical patent/JP3237392B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To apply a prescribed amount of bond to a prescribed spot on a printed board. CONSTITUTION:Flux 4 is applied onto solder parts 3 on the electrodes provided to a printed board 1. Then, a second screen mask 14 on which recesses 15 filled with flux 4 are provided is placed above the printed board 1, and bond 6 is applied onto the screen mask 14 by sliding a squeegee 17. Then, an electronic component 7 is mounted on the printed board 1 bringing the leads 9 of an electronic component 7 into touch with the solder parts 3 and a molded body 8 into contact with the bond 6. Then, the printed board 1 is introduced into a heating oven to melt the solder parts 3 to carry out a soldering operation.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、電子部品のリードをプ
リント基板の電極にハンダ付けする電子部品の実装方法
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of mounting an electronic component in which leads of the electronic component are soldered to electrodes of a printed circuit board.

【０００２】[0002]

【従来の技術】電子部品のリードをプリント基板の電極
にハンダ付けするプリント基板の実装方法として、プリ
ント基板の上面に仮付け用のボンドを塗布し、このボン
ドに電子部品のモールド体を接着してプリント基板をラ
イン搬送しながら、リードを電極にハンダ付けする方法
が知られている。以下、従来の電子部品の実装方法につ
いて、図面を参照しながら説明する。2. Description of the Related Art As a method of mounting a printed circuit board in which leads of an electronic component are soldered to electrodes of the printed circuit board, a temporary bonding bond is applied to the upper surface of the printed circuit board, and a molded body of the electronic component is bonded to the bond. There is known a method in which leads are soldered to electrodes while the printed circuit board is being conveyed in line. Hereinafter, a conventional electronic component mounting method will be described with reference to the drawings.

【０００３】図７（ａ），（ｂ），（ｃ）は従来の電子
部品の実装方法の説明図である。図７（ａ）において、
プリント基板１の上面に形成された回路パターンの電極
２上に予め形成されたハンダ部３上にフラックス４を塗
布する。このハンダ部３は、メッキ手段やハンダレベラ
ー手段などにより形成されている。またフラックス４は
ディスペンサやスクリーン印刷手段などにより塗布され
る。FIGS. 7A, 7B and 7C are explanatory views of a conventional mounting method for electronic components. In FIG. 7 (a),
The flux 4 is applied on the solder portion 3 which is formed in advance on the electrode 2 of the circuit pattern formed on the upper surface of the printed board 1. The solder portion 3 is formed by a plating means, a solder leveler means, or the like. The flux 4 is applied by a dispenser or screen printing means.

【０００４】次にディスペンサ５によりプリント基板１
の上面に仮付け用のボンド６を塗布する（図７
（ｂ））。次に電子部品７のモールド体８から側方へ延
出するリード９の下端部をハンダ部３に着地させ、また
モールド体８をボンド６に着地させて、電子部品７をプ
リント基板１に搭載する（図７（ｃ））。このような電
子部品７のプリント基板１への搭載は、自動搭載機によ
り行われる。このようにして電子部品７をプリント基板
１上に仮付けしたならば、プリント基板１をコンベアに
よりラインを搬送しながらリフロー装置の加熱炉へ送
り、加熱炉で加熱する。するとハンダ部３は溶融し、続
いて溶融したハンダ部３を冷却して固化させると、リー
ド９は電極２にハンダ付けされる。Next, the printed circuit board 1 is formed by the dispenser 5.
The bond 6 for temporary attachment is applied to the upper surface of the
(B)). Next, the lower ends of the leads 9 extending laterally from the mold body 8 of the electronic component 7 are landed on the solder portion 3, and the mold body 8 is also landed on the bond 6 to mount the electronic component 7 on the printed circuit board 1. (FIG. 7C). The electronic component 7 is mounted on the printed circuit board 1 by an automatic mounting machine. After the electronic component 7 is temporarily attached to the printed circuit board 1 in this way, the printed circuit board 1 is sent to the heating furnace of the reflow apparatus while being conveyed on a line by a conveyor and heated in the heating furnace. Then, the solder part 3 is melted, and when the melted solder part 3 is cooled and solidified, the lead 9 is soldered to the electrode 2.

【０００５】[0005]

【発明が解決しようとする課題】一般に、プリント基板
１には多数個の電子部品７が実装される。したがって上
記従来の電子部品の実装方法では、ディスペンサ５を水
平方向に移動させながらプリント基板１の多数箇所にボ
ンド６を塗布しなければならないため、ボンド塗布のタ
クトタイムが長くなって作業能率があがらないという問
題点があった。Generally, a large number of electronic components 7 are mounted on the printed circuit board 1. Therefore, in the above-described conventional electronic component mounting method, the bond 6 has to be applied to a large number of locations on the printed circuit board 1 while moving the dispenser 5 in the horizontal direction, which increases the takt time for applying the bond and improves work efficiency. There was a problem that it did not exist.

【０００６】またディスペンサ５によってボンド６を塗
布しているので、ボンド６の塗布量、塗布されたボンド
６の高さ、塗布位置にばらつきが生じやすく、その結
果、電子部品７の仮止め効果もばらつきやすいという問
題点があった。Further, since the bond 6 is applied by the dispenser 5, the amount of the bond 6 applied, the height of the applied bond 6, and the application position are likely to vary, and as a result, the effect of temporarily fixing the electronic component 7 is also obtained. There was a problem that it was easy to vary.

【０００７】そこで本発明は上記従来方法の問題点を解
消し、プリント基板の所定の箇所に所定量、所定高さの
ボンドを高速度で塗布できる電子部品の実装方法を提供
することを目的とする。Therefore, an object of the present invention is to solve the above-mentioned problems of the conventional method and provide an electronic component mounting method capable of applying a predetermined amount and a predetermined height of a bond to a predetermined portion of a printed circuit board at a high speed. To do.

【０００８】[0008]

【課題を解決するための手段】本発明は、プリント基板
の上面に形成された電極上のハンダ部にフラックスを塗
布する工程と、下面にフラックスが嵌入する凹部が形成
され、且つボンドの塗布口が開口されたスクリーンマス
クをプリント基板の上面に位置させ、このスクリーンマ
スク上をスキージを摺動させることにより塗布口を通し
てプリント基板の上面にボンドを塗布する工程と、リー
ドの下端部をハンダ部上に着地させ、且つモールド体を
ボンドに着地させて電子部品をプリント基板に搭載する
工程と、プリント基板を加熱することにより、ハンダ部
を溶融させてリードの下端部を電極にハンダ付けする工
程とから、電子部品の実装方法を構成している。According to the present invention, a step of applying flux to a solder portion on an electrode formed on an upper surface of a printed circuit board, a concave portion into which the flux is fitted is formed on a lower surface, and a bond application port is formed. Position the screen mask with the opening on the upper surface of the printed circuit board, and slide the squeegee on the screen mask to apply the bond to the upper surface of the printed circuit board through the application port. A step of landing on the printed circuit board and mounting the electronic component on the printed circuit board by landing the mold body on the bond, and a step of heating the printed circuit board to melt the solder part and solder the lower end part of the lead to the electrode. From the electronic component mounting method.

【０００９】[0009]

【作用】上記構成によれば、プリント基板の所定の箇所
に所定量のボンドを迅速に塗布し、電子部品をプリント
基板に実装できる。According to the above structure, a predetermined amount of bond can be quickly applied to a predetermined portion of the printed board to mount the electronic component on the printed board.

【００１０】[0010]

【実施例】次に、図面を参照しながら本発明の実施例を
説明する。図１（ａ），（ｂ），（ｃ）および図２
（ａ），（ｂ），（ｃ）は、本発明の第一実施例の電子
部品の実装方法の説明図、図３は図１（ａ）のＡ部分の
拡大図、図４は本発明の第一実施例のハンダ付け後の要
部断面図である。なお図７に示す従来のものと同一のも
のには同一符号を付している。次に、図１〜図４を参照
しながら、電子部品の実装方法について説明する。Embodiments of the present invention will now be described with reference to the drawings. 1 (a), (b), (c) and FIG.
(A), (b) and (c) are explanatory views of a method of mounting an electronic component according to a first embodiment of the present invention, FIG. 3 is an enlarged view of a portion A of FIG. 1 (a), and FIG. FIG. 6 is a cross-sectional view of a main part after soldering of the first embodiment of FIG. The same parts as the conventional one shown in FIG. 7 are designated by the same reference numerals. Next, a method of mounting electronic components will be described with reference to FIGS.

【００１１】図１（ａ）において、プリント基板１の上
面に形成された回路パターンの電極２上には、ハンダ部
３が予め形成されている（図３も参照）。次にスクリー
ン印刷機の第１のスクリーンマスク１１をプリント基板
１の上面に位置させる（図１（ｂ））。第１のスクリー
ンマスク１１には電極２が嵌合するパターン孔１２が開
孔されており、第１のスクリーンマスク１１上をスキー
ジ１３を矢印方向へ摺動させることにより、ハンダ部３
上にフラックス４が塗布される。なおフラックス４は、
ディスペンサ５により塗布してもよい。In FIG. 1A, a solder portion 3 is formed in advance on the electrode 2 of the circuit pattern formed on the upper surface of the printed board 1 (see also FIG. 3). Next, the first screen mask 11 of the screen printing machine is positioned on the upper surface of the printed board 1 (FIG. 1 (b)). A pattern hole 12 into which the electrode 2 is fitted is formed in the first screen mask 11, and the squeegee 13 is slid on the first screen mask 11 in the direction of the arrow so that the solder portion 3 is formed.
Flux 4 is applied on top. The flux 4 is
You may apply with the dispenser 5.

【００１２】次にプリント基板１と第１のスクリーンマ
スク１１を分離し（図１（ｃ））、第２のスクリーンマ
スク１４をプリント基板１の上面に位置させる（図２
（ａ））。第２のスクリーンマスク１４の下面には、フ
ラックス４が嵌入する逃げ用の凹部１５が形成されてお
り、また所定の箇所にはボンド６の塗布口１６が開口さ
れている。そこで第２のスクリーンマスク１４上をスキ
ージ１７を矢印方向へ摺動させることにより、塗布口１
６を通してプリント基板１の上面にボンド６を塗布す
る。Next, the printed board 1 and the first screen mask 11 are separated (FIG. 1C), and the second screen mask 14 is positioned on the upper surface of the printed board 1 (FIG. 2).
(A)). A recess 15 for escape into which the flux 4 is fitted is formed on the lower surface of the second screen mask 14, and an application port 16 for the bond 6 is opened at a predetermined position. Therefore, by sliding the squeegee 17 on the second screen mask 14 in the direction of the arrow, the coating port 1
The bond 6 is applied to the upper surface of the printed circuit board 1 through 6.

【００１３】次にプリント基板１と第２のスクリーンマ
スク１４を分離し（図２（ｂ））、次に電子部品７のモ
ールド体８から側方へ延出するリード９の下端部をハン
ダ部３に着地させ、またモールド体８をボンド６に着地
させて電子部品７をプリント基板１に搭載する（図２
（ｃ））。このような電子部品７のプリント基板１への
搭載は、自動搭載機により行われる。このようにして電
子部品７をプリント基板１上に仮付けしたならば、プリ
ント基板１をコンベアによりラインを搬送しながらリフ
ロー装置の加熱炉へ送り、加熱炉で加熱する。するとハ
ンダ部３は溶融し、続いて溶融したハンダ部３を冷却し
て固化させると、リード９は電極２にハンダ付けされる
（図４参照）。Next, the printed circuit board 1 and the second screen mask 14 are separated (FIG. 2 (b)), and the lower end portions of the leads 9 extending laterally from the mold body 8 of the electronic component 7 are soldered to each other. 3 and land the mold body 8 on the bond 6 to mount the electronic component 7 on the printed circuit board 1 (FIG. 2).
(C)). The electronic component 7 is mounted on the printed circuit board 1 by an automatic mounting machine. After the electronic component 7 is temporarily attached to the printed circuit board 1 in this way, the printed circuit board 1 is sent to the heating furnace of the reflow apparatus while being conveyed on a line by a conveyor and heated in the heating furnace. Then, the solder part 3 is melted, and when the melted solder part 3 is cooled and solidified, the leads 9 are soldered to the electrodes 2 (see FIG. 4).

【００１４】このように本方法では、図２（ａ）に示す
ようにフラックス４の逃げ用の凹部１５が形成された第
２のスクリーンマスク１４を使用することにより、スク
リーン印刷手段によりボンド６をプリント基板１に塗布
することが可能であり、したがってプリント基板１の複
数箇所に、所定量のボンド６を一括して塗布することが
できるので、ボンド塗布を著しく高速化できる。またボ
ンド６の塗布位置は塗布口１６の開口位置により決定さ
れ、またボンド６の塗布量は塗布口１６の大きさと第２
のスクリーンマスク１４の厚さにより決定され、また塗
布されるボンド６の高さは第２のスクリーンマスク１４
の厚さにより決定されるので、第２のスクリーンマスク
１４の設計製作を厳密に行うことにより、所定の箇所に
所定量のボンド６を所定の高さで確実に塗布することが
できる。As described above, in this method, the bond 6 is formed by the screen printing means by using the second screen mask 14 in which the recess 15 for escape of the flux 4 is formed as shown in FIG. 2A. Since it is possible to apply to the printed circuit board 1 and therefore a predetermined amount of the bonds 6 can be applied collectively to a plurality of places of the printed circuit board 1, the bond application can be remarkably speeded up. The application position of the bond 6 is determined by the opening position of the application port 16, and the application amount of the bond 6 is determined by the size of the application port 16 and the second position.
The height of the bond 6 applied is determined by the thickness of the screen mask 14 of the second screen mask 14 and
Since the thickness of the second screen mask 14 is strictly determined, it is possible to surely apply a predetermined amount of the bond 6 at a predetermined height to a predetermined location by strictly designing and manufacturing the second screen mask 14.

【００１５】次に本発明の第二実施例について説明す
る。図５（ａ），（ｂ），（ｃ）および図６（ａ），
（ｂ），（ｃ）は本発明の第二実施例の電子部品の実装
方法の説明図である。図５（ａ）に示すように、本第二
実施例では、プリント基板１の電極２上にはハンダ部３
は形成されておらず、図６（ｃ）に示すように電子部品
７’のリード９にハンダメッキ部１０を形成している点
で、第一実施例と相違している。以下、電子部品の実装
方法を簡単に説明する。Next, a second embodiment of the present invention will be described. 5 (a), (b), (c) and FIG. 6 (a),
(B), (c) is explanatory drawing of the mounting method of the electronic component of the 2nd Example of this invention. As shown in FIG. 5A, in the second embodiment, the solder portion 3 is provided on the electrode 2 of the printed board 1.
6C is different from the first embodiment in that the solder plating portion 10 is formed on the lead 9 of the electronic component 7'as shown in FIG. 6C. Hereinafter, a method of mounting electronic components will be briefly described.

【００１６】図５（ａ），（ｂ），（ｃ）に示すよう
に、第一実施例と同様の方法により、第１のスクリーン
マスク１１上をスキージ１３を摺動させることにより、
電極２上にフラックス４を塗布する。次に第２のスクリ
ーンマスク１４’をプリント基板１の上面に位置させる
（図６（ａ））。第２のスクリーンマスク１４’の下面
には、フラックス４を嵌入させる逃げ用の凹部１５’が
形成されているが、この凹部１５’の深さは、電極２上
にハンダ部３が形成されていない分だけ、第一実施例の
凹部１５よりも浅くなっている。As shown in FIGS. 5 (a), 5 (b) and 5 (c), the squeegee 13 is slid on the first screen mask 11 by the same method as in the first embodiment.
The flux 4 is applied on the electrode 2. Next, the second screen mask 14 ′ is positioned on the upper surface of the printed board 1 (FIG. 6A). On the lower surface of the second screen mask 14 ′, there is formed a recess 15 ′ for escape into which the flux 4 is fitted. The depth of this recess 15 ′ is such that the solder 3 is formed on the electrode 2. It is shallower than the concave portion 15 of the first embodiment by the amount that is not provided.

【００１７】さて、第２のスクリーンマスク１４’をプ
リント基板１の上面に位置させたならば、スキージ１７
を摺動させることにより、塗布口１６を通してプリント
基板１の上面にボンド６を塗布する。Now, when the second screen mask 14 'is positioned on the upper surface of the printed board 1, the squeegee 17
The bond 6 is applied to the upper surface of the printed circuit board 1 through the application port 16 by sliding.

【００１８】次にプリント基板１と第２のスクリーンマ
スク１４’を分離し（図６（ｂ））、次に電子部品７’
のモールド体８から側方へ延出するリード９の下端部を
電極２に着地させ、またモールド体８をボンド６に着地
させて電子部品７’をプリント基板１に搭載する（図６
（ｃ））。このリード８の表面には予めハンダメッキ部
１０が形成されている。このようにして電子部品７’を
プリント基板１上に仮付けしたならば、プリント基板１
をコンベアによりラインを搬送しながらリフロー装置の
加熱炉へ送り、加熱炉で加熱する。するとハンダメッキ
部１０は溶融し、続いて溶融したハンダを冷却して固化
させると、リード９は図４の場合と同様に電極２にしっ
かりハンダ付けされる。したがって本第二実施例も、第
一実施例と同様の作用効果が得られる。Next, the printed board 1 and the second screen mask 14 'are separated (FIG. 6B), and then the electronic component 7'.
The lower end portion of the lead 9 extending laterally from the mold body 8 is landed on the electrode 2, and the mold body 8 is landed on the bond 6 to mount the electronic component 7'on the printed circuit board 1 (FIG. 6).
(C)). A solder plating portion 10 is formed on the surface of the lead 8 in advance. If the electronic component 7'is temporarily attached to the printed circuit board 1 in this way, the printed circuit board 1
Is conveyed to the heating furnace of the reflow device while being conveyed through the line, and heated in the heating furnace. Then, the solder-plated portion 10 is melted, and when the melted solder is cooled and solidified, the lead 9 is firmly soldered to the electrode 2 as in the case of FIG. Therefore, the second embodiment can also obtain the same effects as the first embodiment.

【００１９】[0019]

【発明の効果】以上説明したように本発明によれば、ス
クリーンマスクを用いたスクリーン印刷手段により、プ
リント基板の所定の複数箇所に所定量のボンドを所定の
高さで一括して塗布することが可能であり、ボンド塗布
を著しく高速化できる。しかもボンドの塗布位置は塗布
口の開口位置により決定され、またボンドの塗布量は塗
布口の大きさと第２のスクリーンマスクの厚さにより決
定され、また塗布されるボンドの高さは第２のスクリー
ンマスクの厚さにより決定されるので、第２のスクリー
ンマスクの設計製作を厳密に行うことにより、所定の箇
所に所定量のボンドを所定の高さで確実に塗布すること
ができる。As described above, according to the present invention, a predetermined amount of bond is applied at a predetermined height to a predetermined plurality of places on a printed circuit board by a screen printing means using a screen mask. It is possible to significantly speed up bond application. Moreover, the bond coating position is determined by the opening position of the coating port, the bond coating amount is determined by the size of the coating port and the thickness of the second screen mask, and the height of the bond to be coated is determined by the second level. Since the thickness is determined by the thickness of the screen mask, by strictly designing and manufacturing the second screen mask, it is possible to surely apply a predetermined amount of bond at a predetermined height at a predetermined location.

【図面の簡単な説明】[Brief description of drawings]

【図１】（ａ）本発明の第一実施例の電子部品の実装方
法の説明図 （ｂ）本発明の第一実施例の電子部品の実装方法の説明
図 （ｃ）本発明の第一実施例の電子部品の実装方法の説明
図FIG. 1A is an explanatory diagram of a mounting method of an electronic component according to a first embodiment of the present invention. FIG. 1B is an explanatory diagram of a mounting method of an electronic component according to a first embodiment of the present invention. Explanatory drawing of the mounting method of the electronic component of an Example

【図２】（ａ）本発明の第一実施例の電子部品の実装方
法の説明図 （ｂ）本発明の第一実施例の電子部品の実装方法の説明
図 （ｃ）本発明の第一実施例の電子部品の実装方法の説明
図FIG. 2 (a) is an explanatory diagram of a mounting method of an electronic component according to a first embodiment of the present invention; (b) is an explanatory diagram of a mounting method of an electronic component according to a first embodiment of the present invention; Explanatory drawing of the mounting method of the electronic component of an Example

【図３】本発明の第一実施例の図１（ａ）のＡ部分の拡
大図FIG. 3 is an enlarged view of part A of FIG. 1 (a) of the first embodiment of the present invention.

【図４】本発明の第一実施例のハンダ付け後の要部断面
図FIG. 4 is a cross-sectional view of essential parts after soldering according to the first embodiment of the present invention.

【図５】（ａ）本発明の第二実施例の電子部品の実装方
法の説明図 （ｂ）本発明の第二実施例の電子部品の実装方法の説明
図 （ｃ）本発明の第二実施例の電子部品の実装方法の説明
図FIG. 5 (a) is an explanatory diagram of a mounting method for an electronic component according to a second embodiment of the present invention. (B) is an explanatory diagram of a mounting method for an electronic component according to a second embodiment of the present invention. Explanatory drawing of the mounting method of the electronic component of an Example

【図６】（ａ）本発明の第二実施例の電子部品の実装方
法の説明図 （ｂ）本発明の第二実施例の電子部品の実装方法の説明
図 （ｃ）本発明の第二実施例の電子部品の実装方法の説明
図6A is an explanatory diagram of a mounting method of an electronic component according to a second embodiment of the present invention. FIG. 6B is an explanatory diagram of a mounting method of an electronic component according to a second embodiment of the present invention. Explanatory drawing of the mounting method of the electronic component of an Example

【図７】（ａ）従来の電子部品の実装方法の説明図 （ｂ）従来の電子部品の実装方法の説明図 （ｃ）従来の電子部品の実装方法の説明図FIG. 7A is an explanatory diagram of a conventional electronic component mounting method. FIG. 7B is an explanatory diagram of a conventional electronic component mounting method. FIG. 7C is an explanatory diagram of a conventional electronic component mounting method.

【符号の説明】[Explanation of symbols]

１ プリント基板 ２ 電極 ３ ハンダ部 ４ フラックス ７，７’ 電子部品 ８ モールド体 ９ リード １０ ハンダメッキ部 １４，１４’ 第２のスクリーンマスク １５，１５’ 凹部 １６ 塗布口 １７ スキージ 1 Printed Circuit Board 2 Electrode 3 Solder Part 4 Flux 7, 7'Electronic Component 8 Molded Body 9 Lead 10 Solder Plated Part 14, 14 'Second Screen Mask 15, 15' Recess 16 Coating Port 17 Squeegee

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】プリント基板の上面に形成された電極上の
ハンダ部にフラックスを塗布する工程と、 下面に前記フラックスが嵌入する凹部が形成され、且つ
ボンドの塗布口が開口されたスクリーンマスクを前記プ
リント基板の上面に位置させ、このスクリーンマスク上
をスキージを摺動させることにより前記塗布口を通して
前記プリント基板の上面にボンドを塗布する工程と、 リードの下端部を前記ハンダ部上に着地させ、且つモー
ルド体を前記ボンドに着地させて電子部品を前記プリン
ト基板に搭載する工程と、 前記プリント基板を加熱することにより、前記ハンダ部
を溶融させて前記リードの下端部を前記電極にハンダ付
けする工程と、 を含むことを特徴とする電子部品の実装方法。1. A step of applying a flux to a solder portion on an electrode formed on an upper surface of a printed circuit board, and a screen mask having a recess into which the flux is fitted is formed on the lower surface and a bonding application opening is formed. Positioning on the upper surface of the printed circuit board, applying a bond to the upper surface of the printed circuit board through the coating opening by sliding a squeegee on the screen mask, and letting the lower end portion of the lead land on the solder portion. And a step of landing a mold body on the bond to mount an electronic component on the printed circuit board, and heating the printed circuit board to melt the solder part and solder the lower end part of the lead to the electrode. And a mounting method of an electronic component. 【請求項２】プリント基板の上面に形成された電極上に
フラックスを塗布する工程と、 下面に前記フラックスが嵌入する凹部が形成され、且つ
ボンドの塗布口が開口されたスクリーンマスクを前記プ
リント基板の上面に位置させ、このスクリーンマスク上
をスキージを摺動させることにより前記塗布口を通して
前記プリント基板の上面にボンドを塗布する工程と、 ハンダメッキ部が形成されたリードの下端部を前記電極
上に着地させ、且つモールド体を前記ボンドに着地させ
て電子部品を前記プリント基板に搭載する工程と、 前記プリント基板を加熱することにより、前記ハンダメ
ッキ部を溶融させて前記リードの下端部を前記電極にハ
ンダ付けする工程と、 を含むことを特徴とする電子部品の実装方法。2. A step of applying a flux onto an electrode formed on an upper surface of a printed circuit board, and a screen mask having a concave portion into which the flux is fitted is formed on a lower surface thereof, and a bond application port is opened. And applying a bond to the upper surface of the printed circuit board through the coating opening by sliding a squeegee over the screen mask, and a lower end of the lead having a solder-plated portion on the electrode. And a mold body is landed on the bond to mount an electronic component on the printed circuit board, and by heating the printed circuit board, the solder-plated portion is melted to lower the lower end portion of the lead. A method of mounting an electronic component, comprising: a step of soldering to an electrode.
JP09723994A 1994-05-11 1994-05-11 Electronic component mounting method Expired - Fee Related JP3237392B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP09723994A JP3237392B2 (en) 1994-05-11 1994-05-11 Electronic component mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP09723994A JP3237392B2 (en) 1994-05-11 1994-05-11 Electronic component mounting method

Publications (2)

Publication Number Publication Date
JPH07307560A true JPH07307560A (en) 1995-11-21
JP3237392B2 JP3237392B2 (en) 2001-12-10

Family

ID=14187069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP09723994A Expired - Fee Related JP3237392B2 (en) 1994-05-11 1994-05-11 Electronic component mounting method

Country Status (1)

Country Link
JP (1) JP3237392B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011025294A (en) * 2009-07-28 2011-02-10 Hioki Ee Corp Device and method for flux coating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011025294A (en) * 2009-07-28 2011-02-10 Hioki Ee Corp Device and method for flux coating

Also Published As

Publication number Publication date
JP3237392B2 (en) 2001-12-10

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