JPH01103272U

JPH01103272U -

Info

Publication number: JPH01103272U
Application number: JP20067087U
Authority: JP
Priority date: 1987-12-28
Filing date: 1987-12-28
Publication date: 1989-07-12

Description

[Brief explanation of the drawing]

第１図は本考案の半田付け実装部品のリードの
一実施例の半田溶融時の状態を拡大して示す図、
第２図は半田付け実装部品の実装状態を示す斜視
図、第３図は第２図中一のリードを取り出して示
す斜視図、第４図はリードをクリーム状半田膜と
対向させて示す図、第５図はリードが半田膜に押
圧されたときの状態を示す図、第６図はリードの
半田付け完了後の状態を示す図、第７図は従来の
リードの１例の斜視図、第８図、第９図、第１０
図は第７図のリードの半田付けを説明する図、第
１１図は半田付け完了後の状態を示す図である。１０……リード、１１……ＬＳＩ、１２……プ
リント基板、１３……ランド、１４……ランド対
向部分、１５……小孔、１６……クリーム状半田
膜、１７……熱エネルギを示す矢印、１８……溶
融した半田、１９……気泡、２０……凝固した半
田、２１……半田の吸い上げを示す矢印、２２…
…上面に広がつた溶融半田、２３……半球状凝固
部分、２４……柱状凝固部分。 FIG. 1 is an enlarged view showing the state of an embodiment of the lead of the soldered component of the present invention when the solder is melted;
Fig. 2 is a perspective view showing the mounting state of soldered components, Fig. 3 is a perspective view showing one lead taken out from Fig. 2, and Fig. 4 is a view showing the lead facing the creamy solder film. , FIG. 5 is a diagram showing the state when the lead is pressed against the solder film, FIG. 6 is a diagram showing the state after soldering of the lead is completed, and FIG. 7 is a perspective view of an example of a conventional lead. Figure 8, Figure 9, Figure 10
This figure is a diagram for explaining the soldering of the leads shown in FIG. 7, and FIG. 11 is a diagram showing the state after the soldering is completed. 10... Lead, 11... LSI, 12... Printed circuit board, 13... Land, 14... Land opposing portion, 15... Small hole, 16... Creamy solder film, 17... Arrow indicating thermal energy , 18... Melted solder, 19... Bubbles, 20... Solidified solder, 21... Arrow indicating solder suction, 22...
...Melted solder spread over the upper surface, 23... Hemispherical solidified portion, 24... Column-shaped solidified portion.

Claims

[Claims for Utility Model Registration] A lead for a mounted component that is soldered to a land on a printed circuit board using a reflow method, in which air bubbles in the molten solder on the bottom side of the lead are located approximately in the center of the part facing the land. A lead for a soldering mounted component having a small hole that allows the molten solder to escape above the lead and guides the molten solder to the upper surface side of the lead.