JPH0313721U - - Google Patents
Info
- Publication number
- JPH0313721U JPH0313721U JP7360089U JP7360089U JPH0313721U JP H0313721 U JPH0313721 U JP H0313721U JP 7360089 U JP7360089 U JP 7360089U JP 7360089 U JP7360089 U JP 7360089U JP H0313721 U JPH0313721 U JP H0313721U
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- mount component
- center
- leadless
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 230000005484 gravity Effects 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の実施例を示すリードレス表面
実装部品の斜視図、第２図は第１図のＢ−Ｂ線断
面図、第３図はそのリードレス表面実装部品の印
刷配線板へのリフロー半田付け前の状態を示す斜
視図、第４図はそのリフロー半田付け後の状態を
示す斜視図、第５図は従来のリードレス表面実装
部品を印刷配線板にリフロー半田付けする場合の
方法を説明するための斜視図、第６図は第５図に
示すリードレス表面実装部品のリフロー半田付け
後の状態を示す斜視図、第７図は第６図における
Ａ−Ａ線断面図、第８図及び第９図は従来技術の
問題点を示す断面図である。
１０……リードレス表面実装部品、１１……表
面実装部品電極、２０……印刷配線板、２１……
部品搭載パツド、２２……配線パターン、２３…
…ペースト状の半田、２３′……溶融半田、Ｇ…
…重心位置。
Figure 1 is a perspective view of a leadless surface mount component showing an embodiment of the present invention, Figure 2 is a sectional view taken along line B-B in Figure 1, and Figure 3 is a printed wiring board of the leadless surface mount component. Fig. 4 is a perspective view showing the state before reflow soldering, Fig. 5 is a perspective view showing the state after reflow soldering, and Fig. 5 shows the state when conventional leadless surface mount components are reflow soldered to a printed wiring board. A perspective view for explaining the method, FIG. 6 is a perspective view showing the state of the leadless surface mount component shown in FIG. 5 after reflow soldering, and FIG. 7 is a sectional view taken along the line A-A in FIG. 6. FIGS. 8 and 9 are cross-sectional views showing problems of the prior art. 10...Leadless surface mount component, 11...Surface mount component electrode, 20...Printed wiring board, 21...
Component mounting pad, 22... Wiring pattern, 23...
...Paste solder, 23'...Melted solder, G...
…Position of the center of gravity.
Claims (1)
け表面実装部品において、 表面実装部品の下部側が上部側より重くなるよ
うな形状とし、該表面実装部品の重心位置が中央
より下部側になるように構成したことを特徴とす
るリードレス表面実装部品。[Claim for Utility Model Registration] In a reflow soldering surface mount component having multiple leadless electrodes, the bottom side of the surface mount component is heavier than the top side, and the center of gravity of the surface mount component is located below the center. A leadless surface mount component characterized in that it is configured so that it faces sideways.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7360089U JPH0313721U (en) | 1989-06-26 | 1989-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7360089U JPH0313721U (en) | 1989-06-26 | 1989-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0313721U true JPH0313721U (en) | 1991-02-12 |
Family
ID=31612559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7360089U Pending JPH0313721U (en) | 1989-06-26 | 1989-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0313721U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5341153U (en) * | 1976-09-08 | 1978-04-10 |
-
1989
- 1989-06-26 JP JP7360089U patent/JPH0313721U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5341153U (en) * | 1976-09-08 | 1978-04-10 |
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