JPS63157954U - - Google Patents
Info
- Publication number
- JPS63157954U JPS63157954U JP5069887U JP5069887U JPS63157954U JP S63157954 U JPS63157954 U JP S63157954U JP 5069887 U JP5069887 U JP 5069887U JP 5069887 U JP5069887 U JP 5069887U JP S63157954 U JPS63157954 U JP S63157954U
- Authority
- JP
- Japan
- Prior art keywords
- view
- space
- electrode
- lead
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は表面張力を説明する斜視図、第２図は
本考案による実装状態を示す一実施例の正面図、
第３図は第２図の側面図、第４図は本考案による
実装状態を示す他の実施例の側面図、第５図は従
来技術による実装状態を示す正面図、第６図は第
５図の側面図、第７図は従来技術による他の側面
図である。
図において、１はＩＣ、１ａはパツケージ、１
ｂはリード、１ｂ―１は空間部、２はチツプコン
デンサ、２ａはパツケージ、２ｂは電極、２ｂ―
１は空間部、３，４はプリント基板、３ａ，４ａ
はランド、５は半田フイレツトを示す。
FIG. 1 is a perspective view illustrating surface tension, FIG. 2 is a front view of an embodiment of the present invention showing a state in which it is mounted.
3 is a side view of FIG. 2, FIG. 4 is a side view of another embodiment showing the mounting state according to the present invention, FIG. 5 is a front view showing the mounting state according to the prior art, and FIG. FIG. 7 is another side view according to the prior art. In the figure, 1 is an IC, 1a is a package, 1
b is a lead, 1b-1 is a space, 2 is a chip capacitor, 2a is a package, 2b is an electrode, 2b-
1 is a space, 3 and 4 are printed circuit boards, 3a and 4a
5 indicates a land, and 5 indicates a solder fillet.
Claims (1)
田接合面との間に空間部１ｂ―１または２ｂ―１
を有するように形成したことを特徴とする表面実
装部品。 A space 1b-1 or 2b-1 is provided between the lead 1b or electrode 2b to be soldered and the solder joint surface.
A surface mount component characterized in that it is formed to have.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5069887U JPS63157954U (en) | 1987-04-02 | 1987-04-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5069887U JPS63157954U (en) | 1987-04-02 | 1987-04-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63157954U true JPS63157954U (en) | 1988-10-17 |
Family
ID=30874295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5069887U Pending JPS63157954U (en) | 1987-04-02 | 1987-04-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63157954U (en) |
-
1987
- 1987-04-02 JP JP5069887U patent/JPS63157954U/ja active Pending