JPH0377457U - - Google Patents

Info

Publication number
JPH0377457U
JPH0377457U JP13857489U JP13857489U JPH0377457U JP H0377457 U JPH0377457 U JP H0377457U JP 13857489 U JP13857489 U JP 13857489U JP 13857489 U JP13857489 U JP 13857489U JP H0377457 U JPH0377457 U JP H0377457U
Authority
JP
Japan
Prior art keywords
surface mount
mount component
lead terminal
printed wiring
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13857489U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13857489U priority Critical patent/JPH0377457U/ja
Publication of JPH0377457U publication Critical patent/JPH0377457U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の第1の実施例を示す図、第
2図は同第2の実施例を示す図、第3図は同第3
の実施例を示す図、第4図は従来例を示す図、第
5図は第4図の右側面図、第6図は他の従来例を
示す図である。 1……表面実装部品、2……パツケージ、3…
…リード端子、3a……下端部、3a……外側
下端部、3a……内側下端部、3a……水平
部、4……プリント基板、4a……表面、4b…
…プリント配線、5……はんだフイレツト。
Fig. 1 shows the first embodiment of this invention, Fig. 2 shows the second embodiment, and Fig. 3 shows the third embodiment of the invention.
FIG. 4 is a diagram showing a conventional example, FIG. 5 is a right side view of FIG. 4, and FIG. 6 is a diagram showing another conventional example. 1...Surface mount component, 2...Package, 3...
...Lead terminal, 3a...lower end, 3a 1 ...outer lower end, 3a 2 ...inner lower end, 3a 3 ...horizontal part, 4...printed circuit board, 4a...surface, 4b...
...Printed wiring, 5...Solder fillet.

Claims (1)

【実用新案登録請求の範囲】 表面実装部品1を形成するパツケージ2から露
出されたリード端子3を、プリント基板4の表面
4aのプリント配線4bに接続する表面実装部品
1であつて、 前記プリント配線4bに接続するリード端子3
の下端部3aを、V形、〓形、または逆台形に折
り曲げて形成したことを特徴とする表面実装部品
[Claims for Utility Model Registration] A surface mount component 1 in which a lead terminal 3 exposed from a package 2 forming the surface mount component 1 is connected to a printed wiring 4b on a surface 4a of a printed circuit board 4, wherein the printed wiring Lead terminal 3 connected to 4b
A surface mount component characterized in that the lower end portion 3a of the component is bent into a V shape, a square shape, or an inverted trapezoid.
JP13857489U 1989-11-29 1989-11-29 Pending JPH0377457U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13857489U JPH0377457U (en) 1989-11-29 1989-11-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13857489U JPH0377457U (en) 1989-11-29 1989-11-29

Publications (1)

Publication Number Publication Date
JPH0377457U true JPH0377457U (en) 1991-08-05

Family

ID=31685666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13857489U Pending JPH0377457U (en) 1989-11-29 1989-11-29

Country Status (1)

Country Link
JP (1) JPH0377457U (en)

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